Infineon Technologies S25FL512SAGBHM213

Overview

S25FL512SAGBHM213 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply (2.7–3.6 V), and support for Quad/DDR read modes up to 80 MHz (80 MBps). It features uniform 256-KB sectors, 100,000 program-erase cycles, 20-year data retention, and integrated hardware ECC. Used in boot code storage for industrial microcontrollers and FPGA configuration.

For engineers reviewing the S25FL512SAGBHM213 datasheet, S25FL512SAGBHM213 pinout, S25FL512SAGBHM213 application, or S25FL512SAGBHM213 equivalent, key selection factors include Quad DDR read throughput (80 MBps), AEC-Q100 Grade 2 qualification (–40°C to +105°C), OTP security (1024-byte array), and SO16/FBGA package compatibility with legacy S25FL-P family designs.

Technical Context

This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing and low-latency command execution. Its dual-voltage I/O (VIO = 1.65–3.6 V) supports mixed-signal SoC interfacing while maintaining full SPI command set compatibility with S25FL-A/K/P families.

The logic block integrates SRAM-based data latches, X/Y decoders, and configurable control logic supporting AutoBoot, CFI, and JEDEC JESD216 SFDP parameter tables. All erase and program operations are internally managed with automatic ECC generation and correction for single-bit errors.

Key Specifications

Pinout & Package

Package: 24-ball FBGA (FAB024 footprint, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Compared with S25FL512SAGBHM213, the Cypress alternative offers identical functionality at lower temperature grade and different package, while the Winbond part trades security, speed, and voltage flexibility for lower power - making the Infineon device optimal for safety-critical, high-reliability, and mixed-voltage designs.

Availability

S25FL512SAGBHM213 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, FPGA configuration memory, and automotive ADAS boot code requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S25FL512SAGBHM213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.

The S25FL-S family targets high-reliability embedded systems requiring fast, secure, and long-life nonvolatile storage - especially where AEC-Q100 qualification, hardware ECC, and Quad DDR performance are critical.

FAQ

What is the maximum clock frequency supported in Quad DDR mode?

The S25FL512SAGBHM213 supports up to 80 MHz in Quad DDR mode, delivering 80 MBps effective read throughput when VIO = VCC = 3.0–3.6 V. This is confirmed in the Performance Summary section of the official Infineon datasheet (Rev. *U, page 3). Operation above 80 MHz in DDR mode is not specified and may result in timing violations or data corruption.

Does this part support hardware reset via the RESET# pin?

Yes, the RESET# pin provides asynchronous hardware reset functionality. When asserted low, it forces the device into a known initial state, clearing internal registers and aborting any ongoing command. After release, the device remains in standby until the next valid CS# assertion, as defined in Section 2.3 of the datasheet.

Can the 1024-byte OTP area be used for cryptographic key storage?

Yes - the OTP array is one-time programmable and permanently locked after programming. It is electrically isolated from main array operations and supports secure storage of AES keys, device IDs, or calibration constants. Programming requires specific unlock sequences and is irreversible, as documented in Section 9.7 of the datasheet.

Is the FAB024 FBGA package compatible with standard reflow profiles?

Yes, the 24-ball FAB024 package (6 × 8 mm, 0.8 mm pitch) is qualified for lead-free reflow per IPC/JEDEC J-STD-020. Peak temperature must not exceed 260°C for ≤60 seconds, with ramp-up rate ≤3°C/s. The package uses NiPdAu surface finish and is compatible with standard stencil thicknesses (125 µm) and aperture ratios (0.66).