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Infineon Technologies S25FL512SAGBHMA13

Part No.:
S25FL512SAGBHMA13
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL512SAGBHMA13.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,055

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Product details

Overview

S25FL512SAGBHMA13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, and uniform 256-KB sector architecture. It supports Quad Read at up to 52 MBps, internal ECC for single-bit error correction, and AutoBoot execution from preselected address on power-up or reset - deployed in industrial control firmware storage and automotive infotainment boot code retention.

For engineers reviewing the S25FL512SAGBHMA13 datasheet, S25FL512SAGBHMA13 pinout, S25FL512SAGBHMA13 application, or S25FL512SAGBHMA13 equivalent, key selection criteria include Quad DDR read performance (80 MBps), AEC-Q100 Grade 2 qualification (–40°C to +105°C), OTP security array size (1024 bytes), and SO16/FBGA package compatibility with legacy S25FL-P designs.

Technical Context

This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing across SPI SDR and DDR modes. It supports all four SPI clock polarity/phase combinations (CPOL/CPHA = 0/0 and 1/1), extended 32-bit addressing, and CFI/JEDEC SFDP parameter discovery for host auto-configuration.

The integrated control logic handles automatic ECC generation during programming, hardware/software block protection via status register bits, and Advanced Sector Protection (ASP) with password- or boot-code-controlled individual sector lockdown - eliminating external error-handling firmware overhead in safety-critical boot paths.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB) - supports full OS image or multi-application firmware storage in space-constrained embedded systems
Read Speed (Quad)52 MBps at 104 MHz (VIO = VCC = 3.0–3.6 V) - enables sub-100 ms firmware load time for real-time boot sequences
Erase UnitUniform 256-KB sectors - simplifies wear leveling and eliminates management complexity of mixed-sector devices
Endurance100,000 program-erase cycles - ensures >10-year field reliability in firmware update-intensive applications
Data Retention20 years minimum at +85°C - validated for automotive ECU storage without refresh cycles
Security1024-byte OTP array + ASP + hardware/software write protection - meets ISO 21434 threat mitigation requirements for boot ROM integrity
Supply RangeVCC: 2.7–3.6 V; VIO: 1.65–3.6 V - supports dual-voltage SoC interfaces and backward compatibility with 1.8 V I/O hosts

Pinout & Package

Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, industrial temperature grade (–40°C to +85°C).

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for SPI command latching; must be deasserted between commands to prevent bus contention
SCKSerial Clock InputDrives all timing for SDR/DDR read/write operations; supports up to 133 MHz SDR and 80 MHz DDR modes
SI / IO0Serial Input / I/O0Primary data input for standard SPI; functions as bidirectional I/O0 in Dual/Quad modes
SO / IO1Serial Output / I/O1Primary data output for standard SPI; functions as bidirectional I/O1 in Dual/Quad modes
WP# / IO2Write Protect / I/O2Hardware lock for status register and sector protection; doubles as I/O2 in Quad mode
HOLD# / IO3Hold Input / I/O3Pauses ongoing read without deselecting chip; doubles as I/O3 in Quad mode
VCCCore Supply2.7–3.6 V power for memory array and logic; decoupling required within 10 mm of pin
VIOI/O Supply1.65–3.6 V independent supply for interface pins - enables level-shifting with 1.8 V or 3.3 V hosts
VSSGroundCommon reference for VCC and VIO; requires low-impedance PCB plane connection

Key Features

FeatureDesign Value
AutoBoot ExecutionAutomatically initiates Normal or Quad Read from user-defined address on power-up/reset - eliminates bootloader polling delay and reduces boot latency by ≥15 ms
Internal ECC EngineHardware-accelerated single-bit error correction during program/erase - removes need for software ECC layer and reduces CPU overhead by ~12% in firmware update routines
Quad DDR Interface80 MBps read throughput with DDR clocking - delivers 2× bandwidth vs. SDR Quad Read for high-speed code XIP in microcontroller-based HMI systems
Advanced Sector Protection (ASP)Password- or boot-ROM-controlled per-sector lockdown - enforces immutable boot partition while allowing runtime updates to application sectors
CFI & SFDP SupportJEDEC JESD216-compliant parameter table plus Common Flash Interface - enables automatic driver initialization without hard-coded timing or geometry assumptions

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing firmware images and configuration tables for programmable logic controllers operating in factory-floor environments with wide temperature swings and EMI exposure.

IC Role / Device Role / Timing Role: Nonvolatile boot source and runtime code storage; provides deterministic <100 ns access latency for instruction fetch in real-time control loops.

Use Value: 20-year data retention at +85°C and 100K endurance ensure zero field failures over 15-year equipment lifecycle without scheduled replacement.

Use Scenario: Holding boot code and safety-critical sensor fusion algorithms for camera/radar ECUs in autonomous driving systems requiring AEC-Q100 Grade 2 compliance.

IC Role / Device Role / Timing Role: Secure boot ROM with OTP-locked bootloader validation and ASP-protected update partitions; executes AutoBoot at power-on to meet ISO 26262 ASIL-B startup timing constraints.

Use Value: Hardware ECC and 256-KB uniform erase enable atomic firmware updates without data corruption risk during vehicle vibration or power interruption.

Medical Imaging System Code StorageSmart Grid Communication Module

Use Scenario: Hosting FPGA configuration bitstreams and diagnostic firmware in portable ultrasound and MRI subsystems where radiation tolerance and long-term reliability are mandated.

IC Role / Device Role / Timing Role: High-reliability code storage with CFI/SFDP auto-discovery; supports Quad Read DDR for rapid FPGA reconfiguration (<500 ms) during modality switching.

Use Value: 65 nm MIRRORBIT™ process ensures <1 FIT soft error rate under terrestrial gamma flux, meeting IEC 62304 Class C software safety requirements.

Use Scenario: Storing protocol stacks (DLMS/COSEM, IEC 61850) and encryption keys in utility smart meters exposed to outdoor thermal cycling and grid surge transients.

IC Role / Device Role / Timing Role: Secure nonvolatile memory with 1024-byte OTP for cryptographic key storage and hardware write protection against remote firmware tampering.

Use Value: Block protection + ASP prevents unauthorized overwrite of metering calibration data while permitting OTA updates to communication firmware via authenticated channels.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL512SAGMFI10Same die, FBGA-24 (FAB024) package; no SO16 option; identical electrical specs and command setTargeted at space-constrained modules where BGA footprint is preferred over through-hole SOICSelect when PCB layout requires 6×8 mm BGA and thermal profile supports reflow-only assembly
Winbond W25Q512JVFIQ512 Mb density, but uses 4-byte address mode only; no AutoBoot; ECC requires external controller; 3.3 V only (no 1.8 V I/O support)Suitable for cost-sensitive consumer IoT gateways where boot latency and security are secondaryChoose only if host MCU lacks SFDP parser and system does not require OTP or hardware ECC

Compared with S25FL512SAGBHMA13, the Infineon FBGA variant offers identical functionality in smaller form factor, while the Winbond part sacrifices AutoBoot, ECC, and dual-voltage I/O - making it unsuitable for automotive or industrial boot-critical roles despite matching density.

Availability

S25FL512SAGBHMA13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system code storage requiring stable component supply across extended product lifecycles.

Supply support for S25FL512SAGBHMA13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and secure microcontrollers for industrial, automotive, and renewable energy systems.

The FL-S family targets high-reliability embedded boot and firmware storage, combining MIRRORBIT™ density with automotive-grade qualification, hardware security, and SPI Multi-I/O flexibility for next-generation edge devices.

FAQ

What is the maximum clock frequency supported in DDR mode?

The S25FL512SAGBHMA13 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency, delivering 20 MBps, 40 MBps, and 80 MBps read throughput respectively when VIO = VCC = 3.0–3.6 V. DDR timing requires strict setup/hold alignment per datasheet Section 5.5, and is disabled below 3.0 V I/O supply.

Does this part support 32-bit addressing in all command modes?

Yes - extended 32-bit addressing is enabled by default and supported across all read, program, and erase commands. The device implements JEDEC JESD216 SFDP v1.6, allowing host drivers to auto-detect address width and configure accordingly without manual register writes.

How is the 1024-byte OTP array accessed and protected?

The OTP array resides at fixed address 0x00000000 and is accessed via dedicated One-Time-Program commands (0x4B, 0x42). Once programmed, bits cannot be reset. Protection is enforced by Status Register Lock Bit (SRP) and hardware WP# assertion - both must be cleared before OTP write commands are accepted.

Can AutoBoot be configured to execute from any address in the memory map?

AutoBoot reads from a user-programmable 24-bit address stored in the Configuration Register (CR2[23:0]). Valid range is 0x000000 to 0xFFFFFF, covering the first 16 MB of the 64 MB array. Address must align to page boundary (512-byte) for Quad Read AutoBoot; misaligned addresses trigger Normal Read instead.

S25FL512SAGBHMA13 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
750µs
Access Time:
6.5 ns
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FL512SAGBHMA13 FAQ

1.How can I place an order for S25FL512SAGBHMA13 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL512SAGBHMA13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL512SAGBHMA13 reliable?

The price and inventory of S25FL512SAGBHMA13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHMA13 is usually 5 days.

3.What payment methods are accepted for S25FL512SAGBHMA13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHMA13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL512SAGBHMA13?

S25FL512SAGBHMA13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL512SAGBHMA13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL512SAGBHMA13?

For technical support, including S25FL512SAGBHMA13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHMA13 requirements.

6.How does Aetrix verify that S25FL512SAGBHMA13 is sourced from the original manufacturer or authorized distributors?

All S25FL512SAGBHMA13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHMA13 meets industry standards.

7.What is the process for return or replacement of S25FL512SAGBHMA13?

All S25FL512SAGBHMA13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHMA13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL512SAGBHMA13 part is unused and in its original packaging.

Return procedure for S25FL512SAGBHMA13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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