Infineon Technologies S25FL512SAGBHMC10
- Part No.:
- S25FL512SAGBHMC10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHMC10.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,758
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Product details
Overview
S25FL512SAGBHMC10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) in SO16 package and supports AutoBoot, CFI, and JEDEC SFDP.
For engineers reviewing the S25FL512SAGBHMC10 datasheet, S25FL512SAGBHMC10 pinout, S25FL512SAGBHMC10 application, or S25FL512SAGBHMC10 equivalent, key selection criteria include Quad DDR read performance (80 MBps), OTP security (1024-byte array), AEC-Q100 Grade 3 qualification, sector protection granularity, and compatibility with S25FL-P family footprint and command set.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing and low-power operation. Its dual-voltage I/O (1.65–3.6 V) and core (2.7–3.6 V) support flexible system integration while maintaining full SPI command compatibility across legacy FL-A/K/P families.
The logic block integrates SRAM latches, X/Y decoders, and dedicated control logic for simultaneous address decoding and data path management. All read, program, and erase operations are managed by on-die state machines with automatic ECC generation and verification-no host software intervention required for bit-error recovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - supports firmware images, boot code, and configuration data for mid-to-high-end embedded systems |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables fast boot execution directly from flash without XIP latency penalties |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and eliminates need for complex sector-mapping logic |
| Endurance | 100,000 program-erase cycles - suitable for field-upgradable firmware with frequent OTA updates |
| Data Retention | 20 years minimum - ensures long-term reliability in unpowered storage for industrial and automotive applications |
| ECC | On-die hardware single-bit correction - eliminates external error-handling overhead and improves system robustness |
| Security | 1024-byte OTP + ASP + status register block protection - provides layered write-protection for boot code and calibration data |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, industrial temperature grade (–40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction |
| SCK | Serial Clock Input | Drives all synchronous operations; supports modes 0 and 3, plus DDR clocking up to 80 MHz |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad modes |
| WP# / IO2 | Write Protect / I/O2 | Hardware-enabled sector lock when pulled low; doubles as I/O2 in Quad mode |
| HOLD# / IO3 | Hold Input / I/O3 | Suspends ongoing read without losing internal address; doubles as I/O3 in Quad mode |
| VCC | Core Supply | 2.7–3.6 V power for memory array and control logic; independent of I/O voltage |
| VIO | I/O Supply | 1.65–3.6 V power for interface pins; allows level-shifting with 1.8 V or 3.3 V controllers |
| VSS | Ground | Common reference for both core and I/O domains; requires low-impedance PCB return path |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates boot loader dependency for simple systems |
| Quad-Input Page Programming (QPP) | Enables high-speed programming on low-frequency clocks - reduces MCU SPI clock burden during firmware update |
| Common Flash Interface (CFI) | Provides standardized parameter tables for runtime configuration discovery - simplifies driver portability across flash vendors |
| JEDEC SFDP Support | Exposes configurable parameters (read latency, dummy cycles, voltage ranges) via standardized register map - enables auto-adaptive initialization |
| Advanced Sector Protection (ASP) | Allows password- or boot-code-controlled individual sector locking - enforces secure boot partitioning without hardware fuses |
Applications
| Automotive Instrument Cluster | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores calibrated display assets, gauge animations, and safety-critical boot firmware in digital dashboards. IC Role / Device Role / Timing Role: Nonvolatile code storage with AEC-Q100 Grade 3 qualification and 20-year retention for fail-safe operation. Use Value: Uniform 256-KB sectors simplify OTA update partitioning; Quad DDR read (80 MBps) ensures sub-100 ms boot time. | Use Scenario: Holds real-time OS kernel, ladder logic engine, and I/O mapping tables in programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability SPI flash with hardware ECC and 100K-cycle endurance for frequent field updates. Use Value: On-die ECC eliminates external error detection logic; SO16 package enables cost-effective through-hole manufacturing. |
| Medical Imaging Boot Memory | Network Router Configuration Storage |
Use Scenario: Stores bootloader, FPGA bitstream, and DICOM protocol stack in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Secure boot memory with 1024-byte OTP for cryptographic keys and ASP for protected boot partition. Use Value: Hardware write protection prevents accidental corruption; CFI/SFDP support enables plug-and-play driver integration. | Use Scenario: Maintains routing tables, CLI scripts, and TLS certificates in enterprise-grade Layer 3 switches. IC Role / Device Role / Timing Role: High-speed configuration store supporting concurrent read/write via QPP and sector erase isolation. Use Value: Dual/Quad Read bandwidth (up to 52 MBps) accelerates config reload after failover; 256-KB erase granularity minimizes service interruption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SDSBHI10 | Same die, identical pinout and command set; differs only in marking and packaging (SO16 vs. FBGA) | Identical functional use; selected where board layout requires surface-mount BGA instead of through-hole SOIC | Choose for space-constrained designs requiring 6×8 mm BGA footprint and higher thermal dissipation |
| Winbond W25Q512JVFIQ | 512 Mb density, Quad SPI, but lacks AutoBoot, ASP, and hardware ECC; uses different SFDP structure | Lower-security applications where OTP and password-based sector lock are not required | Choose for cost-sensitive consumer designs where ECC and advanced protection are optional |
Compared with S25FL512SAGBHMC10, the Cypress alternative offers identical functionality in BGA form factor, while the Winbond part trades security and boot automation for lower unit cost and broader vendor availability-making it suitable only where ECC and ASP are not mandated.
Availability
S25FL512SAGBHMC10 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging subsystems, and network infrastructure requiring stable component supply, long-lifecycle support, and AEC-Q100 compliance.
Supply support for S25FL512SAGBHMC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and memory solutions for automotive, industrial, and IoT markets.
The S25FL-S series targets high-reliability embedded systems requiring secure, high-speed, and long-life nonvolatile storage-designed specifically for automotive dashboard, ADAS, and industrial control applications demanding AEC-Q100 qualification and 20-year data retention.
FAQ
What is the maximum Quad DDR read speed supported by S25FL512SAGBHMC10?
The device achieves 80 MBps Quad DDR read speed at 80 MHz clock rate with VIO = VCC = 3.0–3.6 V. This requires proper setup of DDR mode via configuration register and matching controller timing margins. Performance drops to 33 MBps under 1.65–2.7 V I/O conditions due to reduced signal slew rate.
Does S25FL512SAGBHMC10 support hardware reset via the RESET# pin?
Yes, the RESET# pin is an active-low asynchronous input that forces the device into hardware reset state, clearing internal registers and aborting any ongoing operation. After deassertion, the device enters standby mode and waits for CS# assertion to resume normal operation-no reinitialization sequence is required.
How does the AutoBoot feature function without external configuration?
AutoBoot is configured using nonvolatile bits in the configuration register. Once programmed, the device automatically executes a Normal or Quad Read command at a user-defined address upon power-up or RESET#. No host processor interaction is needed, making it ideal for systems with minimal boot firmware.
Can S25FL512SAGBHMC10 be used in place of older S25FL-P series devices?
Yes-this part is pin-compatible and command-set compatible with S25FL-P devices, including identical SO16 footprint and register mapping. Migration requires no PCB change and minimal firmware update, primarily to leverage enhanced features like AutoBoot, ASP, and improved DDR timing margins.
S25FL512SAGBHMC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SAGBHMC10 FAQ
1.How can I place an order for S25FL512SAGBHMC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHMC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHMC10 reliable?
The price and inventory of S25FL512SAGBHMC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHMC10 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHMC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHMC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHMC10?
S25FL512SAGBHMC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHMC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHMC10?
For technical support, including S25FL512SAGBHMC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHMC10 requirements.
6.How does Aetrix verify that S25FL512SAGBHMC10 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHMC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHMC10 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHMC10?
All S25FL512SAGBHMC10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHMC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHMC10 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHMC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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