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Infineon Technologies S25FL512SAGBHMC13
- Part No.:
- S25FL512SAGBHMC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHMC13.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,419
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Product details
Overview
S25FL512SAGBHMC13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC for single-bit error correction. It supports AutoBoot, CFI, and DDR read modes, and is qualified for Industrial Plus (–40°C to +105°C) operation in FBGA package.
For engineers reviewing the S25FL512SAGBHMC13 datasheet, S25FL512SAGBHMC13 pinout, S25FL512SAGBHMC13 application, or S25FL512SAGBHMC13 equivalent, this device delivers high-speed Quad/DDR read performance, OTP-based security, AEC-Q100 Grade 2 qualification, and drop-in compatibility with S25FL-P family footprints in embedded boot code storage and firmware update systems.
Technical Context
This FL-S series flash implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling simultaneous read-while-write capability and deterministic erase timing across uniform 256-KB sectors. Its dual-voltage I/O (1.65–3.6 V) and core (2.7–3.6 V) support flexible host interfacing without level shifters.
The device uses standard SPI command sets (modes 0/3), extends addressing to 32 bits, and integrates dedicated control logic for Advanced Sector Protection (ASP), OTP array access, and automatic ECC generation during program operations - all managed via status/configuration registers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and multi-application partitioning in resource-constrained hosts. |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables fast boot execution directly from flash without XIP latency penalties. |
| Erase Unit | Uniform 256-KB sectors - simplifies firmware update partitioning and eliminates variable-sector management overhead. |
| Endurance | 100,000 program-erase cycles - supports field firmware updates over 10+ years in industrial gateways. |
| Data Retention | 20 years minimum - ensures long-term reliability of stored configuration and calibration data. |
| Security | 1024-byte OTP + ASP + block protection - provides immutable root-of-trust storage and per-sector write lock enforcement. |
| Temperature Range | –40°C to +105°C (Industrial Plus) - validated for continuous operation in enclosed edge computing enclosures. |
Pinout & Package
Package: 24-ball FBGA (FAB024 footprint, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command latching; must be held low for entire command sequence including address/data phases. |
| SCK | Serial Clock Input | Drives all timing-critical operations; supports up to 133 MHz SDR and 80 MHz DDR clock rates. |
| IO0 (SI) | Serial Input / I/O0 | Primary data input for commands and addresses; also functions as first bidirectional I/O line in Quad mode. |
| IO1 (SO) | Serial Output / I/O1 | Primary data output during reads; serves as second bidirectional I/O line in Dual/Quad modes. |
| IO2 (WP#) | Write Protect / I/O2 | Hardware-enabled sector protection when asserted low; doubles as third I/O line in Quad mode. |
| IO3 (HOLD#) | Hold Input / I/O3 | Pauses ongoing read/write transfers without deselecting chip; also acts as fourth I/O line in Quad mode. |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; decoupling required within 10 mm of pin. |
| VIO | I/O Supply | 1.65–3.6 V independent I/O voltage - allows direct interfacing with 1.8 V or 3.3 V controllers. |
| RESET# | Hardware Reset | Asynchronous active-low reset that clears internal state and forces re-initialization of configuration registers. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Function | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates host-side boot loader polling and reduces boot time by ≥15 ms. |
| Hardware ECC | On-the-fly single-bit error correction during read/program - removes need for software ECC layers and improves system MTBF. |
| Quad-Input Page Programming (QPP) | Enables full 512-byte page writes using all four I/O lines - cuts programming time by 4× vs. standard SPI in low-clock-rate microcontrollers. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enforces secure firmware update boundaries without relying on external secure elements. |
| CFI & SFDP Support | Standardized configuration discovery via JEDEC JESD216 - enables automatic driver initialization and runtime parameter negotiation in Linux and RTOS environments. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing real-time control firmware and safety-critical configuration data in programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with deterministic 256-KB sector erase and AutoBoot-triggered Quad Read at power-on. Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity across 15+ years of unattended operation without refresh. | Use Scenario: Holding boot code and sensor fusion algorithms for radar/Ethernet ECUs in autonomous driving systems requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Secure, high-reliability boot flash with OTP-stored cryptographic keys and ASP-enforced update partitioning. Use Value: Hardware ECC and 105°C rating guarantee error-free boot execution under under-hood thermal stress and EMI exposure. |
| Edge AI Gateway Configuration | Medical Imaging Device Firmware |
Use Scenario: Hosting multiple firmware variants and calibration profiles for AI inference accelerators in cellular-connected edge gateways operating in remote infrastructure. IC Role / Device Role / Timing Role: Dual-voltage (1.8 V I/O / 3.3 V core) flash enabling direct interface with low-power SoCs while maintaining high-speed Quad Read throughput. Use Value: 52 MBps Quad Read and uniform sector layout reduce OTA update validation time by >40% compared to legacy SPI NOR devices. | Use Scenario: Storing FDA-certified diagnostic firmware and DICOM protocol stacks in portable ultrasound and MRI control units requiring traceable lifecycle management. IC Role / Device Role / Timing Role: Certified nonvolatile memory with CFI/SFDP auto-discovery and 20-year retention for regulatory audit compliance and field recalibration persistence. Use Value: 1024-byte OTP array stores immutable device serials and calibration signatures, satisfying IEC 62304 traceability requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SDSBHI10 | Same die, identical electrical specs and pinout; differs only in SOIC-16 packaging and -40°C to +85°C temp grade. | Lacks Industrial Plus temperature rating and FBGA mechanical robustness for high-vibration environments. | Select when board space permits SOIC and ambient temperature stays ≤85°C. |
| Winbond W25Q512JWIM (1.8 V I/O variant) | 1.8 V only I/O supply (no 3.3 V compatibility); lacks AutoBoot and ASP; lower 50K endurance rating. | Not suitable for AEC-Q100 or industrial thermal cycling; requires external ECC for safety-critical use. | Consider only for cost-sensitive consumer designs where 1.8 V interface and reduced security are acceptable. |
Compared with S25FL512SDSBHI10, the S25FL512SAGBHMC13 adds thermal margin and board-level reliability via FBGA; versus W25Q512JWIM, it delivers certified automotive readiness, hardware ECC, and deterministic sector erase - critical for medical and industrial firmware integrity.
Availability
S25FL512SAGBHMC13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and edge AI gateway configuration requiring stable component supply across extended product lifecycles.
Supply support for S25FL512SAGBHMC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.
The FL-S Flash product line delivers high-reliability, multi-I/O serial NOR memory optimized for deterministic boot, secure firmware updates, and long-life embedded systems - with emphasis on AEC-Q100 qualification and MIRRORBIT™ endurance.
FAQ
What is the maximum clock frequency supported for DDR read operations?
The S25FL512SAGBHMC13 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock rate, delivering 20 MBps, 40 MBps, and 80 MBps respectively when VIO = VCC = 3.0–3.6 V. DDR timing requires strict setup/hold alignment per AC specification section 5.5 of the datasheet.
Does this part require external hardware for ECC correction?
No. The device integrates on-die hardware ECC that automatically detects and corrects single-bit errors during read operations and generates ECC codes during program operations. No external circuitry or software intervention is needed for basic single-bit correction.
Can the OTP area be reprogrammed after initial programming?
No. The 1024-byte One-Time Programmable (OTP) array is permanently programmed using high-voltage pulses and cannot be erased or rewritten. Once written, OTP contents remain intact through power cycles, temperature extremes, and 20-year data retention.
Is the FAB024 FBGA package compatible with standard reflow profiles?
Yes. The Pb-free FAB024 package is qualified for standard lead-free reflow profiles (J-STD-020D), with peak temperature up to 260°C for ≤60 seconds. Board layout must follow Infineon's recommended pad geometry and thermal relief patterns to ensure solder joint reliability.
S25FL512SAGBHMC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SAGBHMC13 FAQ
1.How can I place an order for S25FL512SAGBHMC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHMC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHMC13 reliable?
The price and inventory of S25FL512SAGBHMC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHMC13 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHMC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHMC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHMC13?
S25FL512SAGBHMC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHMC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHMC13?
For technical support, including S25FL512SAGBHMC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHMC13 requirements.
6.How does Aetrix verify that S25FL512SAGBHMC13 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHMC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHMC13 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHMC13?
All S25FL512SAGBHMC13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHMC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHMC13 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHMC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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