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Infineon Technologies S25FL512SAGBHV213
- Part No.:
- S25FL512SAGBHV213
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHV213.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,231
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Product details
Overview
S25FL512SAGBHV213 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, and uniform 256-KB sector architecture. It supports Quad Read up to 52 MBps, on-chip ECC, AutoBoot, and CFI/SFDP compliance for embedded boot and firmware storage in industrial and automotive systems.
For engineers reviewing the S25FL512SAGBHV213 datasheet, S25FL512SAGBHV213 pinout, S25FL512SAGBHV213 application, or S25FL512SAGBHV213 equivalent, key selection criteria include Quad DDR read performance (80 MBps), AEC-Q100 Grade 2 qualification (–40°C to +105°C), 100,000 program-erase cycles, OTP security, and SO16/FBGA package compatibility.
Technical Context
This FL-S family device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with hardware-accelerated ECC and deterministic AutoBoot execution at power-up. Its dual-voltage I/O (1.65–3.6 V) and core (2.7–3.6 V) support flexible host interfacing across diverse MCU platforms.
The command set is fully backward-compatible with S25FL-A/K/P families and extends support to DDR SPI modes, 32-bit addressing, and Advanced Sector Protection (ASP) via password- or boot-code-controlled individual sector locking - critical for secure firmware updates in safety-critical applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and parameter tables in modern microcontrollers |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables fast code XIP (execute-in-place) from flash without local RAM buffering |
| Erase Unit | Uniform 256-KB sectors - simplifies partitioning for OTA update staging and rollback regions |
| Endurance | 100,000 program-erase cycles - supports frequent field firmware updates over product lifetime |
| Data Retention | 20 years minimum - ensures long-term reliability in unpowered storage for industrial logging and calibration data |
| Security | 1024-byte OTP + ASP - provides immutable root-of-trust keys and per-sector write protection enforceable by boot ROM |
| Temperature Range | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs and industrial edge controllers |
| Voltage Support | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - allows direct interfacing with 1.8 V or 3.3 V host MCUs without level shifters |
Pinout & Package
Package: 24-ball FBGA (FAB024 footprint, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction |
| SCK | Serial Clock Input | Master-generated clock driving all SPI transfers; supports up to 133 MHz SDR and 80 MHz DDR modes |
| IO0 (SI) | Serial Input / I/O0 | Primary data input during commands; functions as bidirectional I/O0 in Dual/Quad modes |
| IO1 (SO) | Serial Output / I/O1 | Primary data output during reads; functions as bidirectional I/O1 in Dual/Quad modes |
| IO2 (WP#) | Write Protect / I/O2 | Hardware write lock when pulled low; also serves as Quad I/O2 in multi-line operations |
| IO3 (HOLD#) | Hold Input / I/O3 | Pauses ongoing transfer without deselecting chip; doubles as Quad I/O3 in expanded mode |
| RESET# | Hardware Reset Input | Asynchronous reset that clears internal state and reinitializes configuration registers |
| VCC | Core Supply | 2.7–3.6 V power for logic and array; decoupling required within 10 mm of pin |
| VIO | I/O Supply | 1.65–3.6 V independent rail for interface voltage translation and noise isolation |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance PCB plane connection |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically performs Normal or Quad Read at preconfigured address on power-up/reset - eliminates external boot controller dependency |
| Hardware ECC | On-the-fly single-bit error correction with no software overhead - maintains data integrity without CPU intervention |
| Advanced Sector Protection (ASP) | Password- or boot-code-triggered per-sector lock - enforces secure firmware update boundaries in certified bootloader environments |
| CFI & SFDP Compliance | Standardized JEDEC JESD216 parameter tables and Common Flash Interface - enables automatic driver configuration in Linux/U-Boot/RTOS |
| Quad-Input Page Programming (QPP) | Reduces programming time on low-clock hosts by accepting 4-byte-wide write data - improves OTA update throughput on resource-constrained SoCs |
Applications
| Automotive ECU Boot Storage | Industrial PLC Firmware Image |
|---|---|
Use Scenario: Storing boot code and safety-critical firmware for engine control units operating under hood temperatures up to +105°C. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory executing XIP during cold start; AutoBoot initiates Quad Read at fixed vector address within 100 µs of reset release. Use Value: AEC-Q100 Grade 2 qualification and 20-year retention ensure functional safety compliance (ISO 26262 ASIL-B) without periodic refresh or backup. | Use Scenario: Holding field-upgradable firmware and configuration parameters in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Dual-role storage for active firmware and staged update image; uniform 256-KB sectors allow atomic swap between partitions using hardware erase. Use Value: 100,000 endurance cycles and ASP support secure, authenticated OTA updates without exposing unprotected sectors to malicious writes. |
| Medical Imaging System BIOS | Networking Equipment Configuration Store |
Use Scenario: Hosting BIOS and calibration data in portable ultrasound and MRI subsystems requiring long-term data integrity and tamper resistance. IC Role / Device Role / Timing Role: Secure silicon region (OTP) stores cryptographic keys; CFI/SFDP enables plug-and-play driver initialization in real-time OS environments. Use Value: 1024-byte OTP + hardware write protection prevents unauthorized modification of boot credentials and regulatory-critical calibration constants. | Use Scenario: Storing switch/router configuration profiles, MAC tables, and firmware patches in carrier-grade Ethernet switches with hot-swap capability. IC Role / Device Role / Timing Role: High-speed Quad DDR read (80 MBps) accelerates configuration reload after failover; HOLD# enables seamless context preservation during link renegotiation. Use Value: Dual-voltage I/O (1.8 V/3.3 V) interfaces directly with FPGA management cores and avoids level-shifter BOM cost and signal integrity risk. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFI101 | Same die, identical electrical specs, but in SO16 package (300-mil) instead of FAB024 FBGA | Larger footprint and lower thermal performance; unsuitable for space-constrained automotive modules | Select when board layout prioritizes through-hole assembly or legacy socket compatibility over density and thermal efficiency |
| Winbond W25Q512JWIM (512 Mb, 1.8 V) | 1.8 V only I/O (no 3.3 V support); lacks AutoBoot and ASP; uses different SFDP structure | Not AEC-Q100 qualified; limited to commercial temperature range (–40°C to +85°C) | Consider only for cost-sensitive consumer designs where extended temperature and security features are not required |
Compared with S25FL512SAGBHV213, the SO16 alternative offers identical functionality in legacy packaging but sacrifices thermal and space advantages, while the Winbond part trades automotive qualification and advanced security for lower voltage operation and reduced BOM cost in non-critical applications.
Availability
S25FL512SAGBHV213 is available at Aetrix Electronics and suitable for automotive ECU boot storage, industrial PLC firmware image storage, and medical imaging system BIOS requiring stable component supply across extended temperature and long-lifecycle programs.
Supply support for S25FL512SAGBHV213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The FL-S flash product line delivers high-reliability, feature-rich serial NOR memory optimized for secure boot, firmware storage, and code execution in safety- and mission-critical embedded systems.
FAQ
Does S25FL512SAGBHV213 support Quad DDR read mode?
Yes, it supports Quad DDR Fast Read at up to 80 MBps with 80 MHz clock frequency when VIO = VCC = 3.0–3.6 V. This mode uses double-data-rate sampling on all four I/O lines to maximize throughput for XIP and high-bandwidth firmware loading scenarios.
What is the function of the RESET# pin?
RESET# is an asynchronous, active-low hardware reset input that forces the device into a known initial state, clearing internal command latches and reinitializing configuration registers. It does not erase memory contents but restores default interface timing and protection settings.
Can S25FL512SAGBHV213 operate with VIO = 1.8 V while VCC = 3.3 V?
Yes, it supports mixed-voltage operation: VIO may be independently set from 1.65 V to 2.7 V (including 1.8 V) while VCC remains within 2.7–3.6 V. This enables direct interfacing with 1.8 V FPGAs or low-power MCUs without external level shifters.
How is Advanced Sector Protection (ASP) enabled and controlled?
ASP is enabled via the Configuration Register and controlled either by a user-defined password stored in OTP or by executing a specific boot code sequence. Once activated, it allows individual 256-KB sectors to be locked against program/erase independently of standard block protection bits.
S25FL512SAGBHV213 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SAGBHV213 FAQ
1.How can I place an order for S25FL512SAGBHV213 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHV213 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHV213 reliable?
The price and inventory of S25FL512SAGBHV213 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHV213 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHV213?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHV213 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHV213?
S25FL512SAGBHV213 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHV213 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHV213?
For technical support, including S25FL512SAGBHV213 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHV213 requirements.
6.How does Aetrix verify that S25FL512SAGBHV213 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHV213 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHV213 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHV213?
All S25FL512SAGBHV213 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHV213, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHV213 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHV213:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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