Infineon Technologies S25FL512SAGBHV310
- Part No.:
- S25FL512SAGBHV310
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHV310.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,606
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Product details
Overview
S25FL512SAGBHV310 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC. It supports AutoBoot, CFI, SFDP, and operates across –40°C to +105°C (Industrial Plus grade) in FBGA-24 package.
For engineers reviewing the S25FL512SAGBHV310 datasheet, S25FL512SAGBHV310 pinout, S25FL512SAGBHV310 application, or S25FL512SAGBHV310 equivalent, key selection criteria include Quad DDR read performance (80 MBps), 100,000 program-erase cycles, OTP security (1024 bytes), AEC-Q100 Grade 2 qualification, and compatibility with S25FL-P family footprints.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing for boot code and firmware storage. Its dual-voltage I/O (VIO = 1.65–3.6 V) allows interoperability with legacy and low-voltage controllers while maintaining full 3.0 V core operation.
The command set supports both SDR and DDR SPI modes, including Fast, Dual, Quad, and DDR variants of Read/Program/Erase operations. Internal hardware ECC provides single-bit error correction without host intervention, and AutoBoot enables automatic execution of Normal or Quad Read at power-up from a user-configurable address.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full MCU boot image + application firmware in space-constrained embedded systems |
| Read Speed (Quad) | 52 MBps at 104 MHz (VIO = VCC = 3.0–3.6 V) - enables fast code execution from XIP configurations |
| Erase Unit | Uniform 256-KB sectors - simplifies firmware update partitioning and wear leveling implementation |
| Endurance | 100,000 program-erase cycles - supports field firmware updates over product lifetime |
| Data Retention | 20 years minimum - ensures long-term reliability in industrial and automotive deployments |
| Security | 1024-byte OTP array + Advanced Sector Protection - enables secure key storage and selective sector lockdown |
| Temperature Range | –40°C to +105°C (Industrial Plus) - qualified for under-hood automotive and high-ambient industrial use |
Pinout & Package
Package: 24-ball FBGA (FAB024 footprint, 6 × 8 mm, 0.8 mm pitch, Pb-free).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before clock edge for valid transaction |
| SCK | Serial Clock Input | Drives all synchronous SPI operations; supports up to 133 MHz SDR and 80 MHz DDR modes |
| IO0 (SI) | Serial Input / I/O0 | Primary data input during programming; bidirectional in Quad mode for address/data transfer |
| IO1 (SO) | Serial Output / I/O1 | Primary data output during reads; bidirectional in Quad mode for address/data transfer |
| IO2 (WP#) | Write Protect / I/O2 | Hardware-enabled sector protection when tied low; also functions as Quad I/O line |
| IO3 (HOLD#) | Hold Input / I/O3 | Pauses ongoing SPI transaction without deselecting device; also functions as Quad I/O line |
| VCC | Core Supply | 2.7–3.6 V core voltage; powers internal logic, array, and ECC engine |
| VIO | I/O Supply | 1.65–3.6 V independent I/O voltage; decouples interface level-shifting from core operation |
| RESET# | Reset Input | Asynchronous active-low reset that clears internal state and reinitializes configuration registers |
Key Features
| Feature | Design Value |
|---|---|
| Quad DDR Read | 80 MBps throughput at 80 MHz DDR clock - doubles effective bandwidth vs. SDR Quad Read for XIP-critical applications |
| AutoBoot Function | Configurable pre-power-up read address - eliminates external boot controller requirement in minimal-BOM designs |
| Hardware ECC Engine | On-the-fly single-bit correction with no CPU overhead - improves system-level reliability without software intervention |
| Advanced Sector Protection | Password- or boot-code-controlled per-sector lock - enables secure OTA update partitions and IP-protected firmware regions |
| SFDP Compliance | JESD216-compliant parameter table - enables automatic driver initialization and runtime configuration on modern SoCs |
Applications
| Automotive ADAS ECU Boot Storage | Industrial PLC Firmware Repository |
|---|---|
Use Scenario: Stores boot loader and safety-critical firmware for radar processing units requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with AutoBoot execution and hardware ECC ensuring deterministic startup within 100 ms. Use Value: Eliminates external error-checking logic and reduces BOM count while meeting ISO 26262 ASIL-B requirements via 20-year retention and 100K-cycle endurance. | Use Scenario: Holds field-upgradable control logic and HMI assets in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: High-reliability firmware archive supporting over-the-air updates with sector-level write protection and OTP-secured keys. Use Value: Enables secure, atomic firmware swaps using uniform 256-KB erase blocks and ASP-based rollback prevention. |
| Medical Imaging System Configuration | Networking Equipment Boot Image |
Use Scenario: Stores calibration profiles, DICOM metadata templates, and FPGA configuration bitstreams in portable ultrasound devices. IC Role / Device Role / Timing Role: Low-power, high-integrity configuration store with 0.07 mA standby current and 1.65 V I/O compatibility for mixed-voltage SoC interfaces. Use Value: Extends battery life between charges while guaranteeing data integrity across thermal cycling (–40°C to +105°C). | Use Scenario: Hosts bootloader and Linux kernel images for carrier-grade Ethernet switches operating in telecom central offices. IC Role / Device Role / Timing Role: High-speed SPI flash supporting XIP execution with Quad DDR read (80 MBps) to reduce boot latency below 500 ms. Use Value: Accelerates system initialization and supports hot-swap firmware recovery without external memory controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFI10 | Same die, SOIC-16 package (300 mil); lacks FBGA mechanical robustness and thermal performance | Better suited for prototyping and low-vibration PCBs; not recommended for automotive chassis-mount applications | Select when board space permits larger SOIC and thermal cycling is < ±60°C |
| Winbond W25Q512JWIM > 256KB sectors | 512 Mb density but uses 4-KB and 64-KB erase blocks; no hardware ECC or AutoBoot | Requires host-side ECC and custom boot sequencing; lower cost but higher integration effort | Select only if firmware update granularity demands sub-256KB erase units and ECC is handled in software |
Compared with S25FL512SAGBHV310, the SOIC variant trades mechanical ruggedness for ease of hand-soldering, while the Winbond alternative sacrifices integrated reliability features for finer erase granularity-neither matches the combined AEC-Q100 Grade 2 qualification, hardware ECC, and AutoBoot of the original.
Availability
S25FL512SAGBHV310 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging subsystems, and carrier-grade networking equipment requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S25FL512SAGBHV310 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The FL-S family targets high-reliability embedded systems requiring fast, secure, and long-life nonvolatile storage-designed specifically for boot code, firmware, and configuration data in AEC-Q100-qualified environments.
FAQ
What is the maximum clock frequency supported in DDR mode?
The S25FL512SAGBHV310 supports up to 80 MHz DDR clock frequency, delivering 80 MBps Quad Read DDR throughput when VIO = VCC = 3.0–3.6 V. This requires strict PCB layout adherence to DDR timing constraints, including matched trace lengths and controlled impedance routing for IO0–IO3 lines.
Does this part require external pull-up resistors on WP# and HOLD# pins?
Yes-WP# and HOLD# are active-low inputs with internal weak pull-downs. External 4.7 kΩ pull-up resistors to VIO are required for reliable deassertion during normal operation; omission may cause unintended sector protection or transaction suspension during noise events.
How is the AutoBoot address configured?
The AutoBoot address is stored in the Configuration Register (CR) bits [23:8] and is loaded at power-up or RESET#. It must be programmed via Write Enable + Write Configuration Register command prior to first use; default value is 0x000000, pointing to the start of the memory array.
Is the OTP region one-time programmable only, or can it be erased?
The 1024-byte OTP array is permanently programmable-once a bit is set to '0', it cannot be reset to '1'. Erase is not supported. Programming is performed via dedicated One-Time Program commands and requires Write Enable; each byte must be written individually with proper timing margins.
S25FL512SAGBHV310 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL512SAGBHV310 FAQ
1.How can I place an order for S25FL512SAGBHV310 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHV310 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHV310 reliable?
The price and inventory of S25FL512SAGBHV310 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHV310 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHV310?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHV310 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHV310?
S25FL512SAGBHV310 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHV310 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHV310?
For technical support, including S25FL512SAGBHV310 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHV310 requirements.
6.How does Aetrix verify that S25FL512SAGBHV310 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHV310 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHV310 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHV310?
All S25FL512SAGBHV310 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHV310, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHV310 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHV310:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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