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Infineon Technologies S25FL512SAGBHV310

Part No.:
S25FL512SAGBHV310
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL512SAGBHV310.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,606

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Product details

Overview

S25FL512SAGBHV310 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC. It supports AutoBoot, CFI, SFDP, and operates across –40°C to +105°C (Industrial Plus grade) in FBGA-24 package.

For engineers reviewing the S25FL512SAGBHV310 datasheet, S25FL512SAGBHV310 pinout, S25FL512SAGBHV310 application, or S25FL512SAGBHV310 equivalent, key selection criteria include Quad DDR read performance (80 MBps), 100,000 program-erase cycles, OTP security (1024 bytes), AEC-Q100 Grade 2 qualification, and compatibility with S25FL-P family footprints.

Technical Context

This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing for boot code and firmware storage. Its dual-voltage I/O (VIO = 1.65–3.6 V) allows interoperability with legacy and low-voltage controllers while maintaining full 3.0 V core operation.

The command set supports both SDR and DDR SPI modes, including Fast, Dual, Quad, and DDR variants of Read/Program/Erase operations. Internal hardware ECC provides single-bit error correction without host intervention, and AutoBoot enables automatic execution of Normal or Quad Read at power-up from a user-configurable address.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB) - sufficient for full MCU boot image + application firmware in space-constrained embedded systems
Read Speed (Quad)52 MBps at 104 MHz (VIO = VCC = 3.0–3.6 V) - enables fast code execution from XIP configurations
Erase UnitUniform 256-KB sectors - simplifies firmware update partitioning and wear leveling implementation
Endurance100,000 program-erase cycles - supports field firmware updates over product lifetime
Data Retention20 years minimum - ensures long-term reliability in industrial and automotive deployments
Security1024-byte OTP array + Advanced Sector Protection - enables secure key storage and selective sector lockdown
Temperature Range–40°C to +105°C (Industrial Plus) - qualified for under-hood automotive and high-ambient industrial use

Pinout & Package

Package: 24-ball FBGA (FAB024 footprint, 6 × 8 mm, 0.8 mm pitch, Pb-free).

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for SPI command decoding; must be asserted before clock edge for valid transaction
SCKSerial Clock InputDrives all synchronous SPI operations; supports up to 133 MHz SDR and 80 MHz DDR modes
IO0 (SI)Serial Input / I/O0Primary data input during programming; bidirectional in Quad mode for address/data transfer
IO1 (SO)Serial Output / I/O1Primary data output during reads; bidirectional in Quad mode for address/data transfer
IO2 (WP#)Write Protect / I/O2Hardware-enabled sector protection when tied low; also functions as Quad I/O line
IO3 (HOLD#)Hold Input / I/O3Pauses ongoing SPI transaction without deselecting device; also functions as Quad I/O line
VCCCore Supply2.7–3.6 V core voltage; powers internal logic, array, and ECC engine
VIOI/O Supply1.65–3.6 V independent I/O voltage; decouples interface level-shifting from core operation
RESET#Reset InputAsynchronous active-low reset that clears internal state and reinitializes configuration registers

Key Features

FeatureDesign Value
Quad DDR Read80 MBps throughput at 80 MHz DDR clock - doubles effective bandwidth vs. SDR Quad Read for XIP-critical applications
AutoBoot FunctionConfigurable pre-power-up read address - eliminates external boot controller requirement in minimal-BOM designs
Hardware ECC EngineOn-the-fly single-bit correction with no CPU overhead - improves system-level reliability without software intervention
Advanced Sector ProtectionPassword- or boot-code-controlled per-sector lock - enables secure OTA update partitions and IP-protected firmware regions
SFDP ComplianceJESD216-compliant parameter table - enables automatic driver initialization and runtime configuration on modern SoCs

Applications

Automotive ADAS ECU Boot StorageIndustrial PLC Firmware Repository

Use Scenario: Stores boot loader and safety-critical firmware for radar processing units requiring AEC-Q100 Grade 2 qualification.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with AutoBoot execution and hardware ECC ensuring deterministic startup within 100 ms.

Use Value: Eliminates external error-checking logic and reduces BOM count while meeting ISO 26262 ASIL-B requirements via 20-year retention and 100K-cycle endurance.

Use Scenario: Holds field-upgradable control logic and HMI assets in programmable logic controllers deployed in factory automation environments.

IC Role / Device Role / Timing Role: High-reliability firmware archive supporting over-the-air updates with sector-level write protection and OTP-secured keys.

Use Value: Enables secure, atomic firmware swaps using uniform 256-KB erase blocks and ASP-based rollback prevention.

Medical Imaging System ConfigurationNetworking Equipment Boot Image

Use Scenario: Stores calibration profiles, DICOM metadata templates, and FPGA configuration bitstreams in portable ultrasound devices.

IC Role / Device Role / Timing Role: Low-power, high-integrity configuration store with 0.07 mA standby current and 1.65 V I/O compatibility for mixed-voltage SoC interfaces.

Use Value: Extends battery life between charges while guaranteeing data integrity across thermal cycling (–40°C to +105°C).

Use Scenario: Hosts bootloader and Linux kernel images for carrier-grade Ethernet switches operating in telecom central offices.

IC Role / Device Role / Timing Role: High-speed SPI flash supporting XIP execution with Quad DDR read (80 MBps) to reduce boot latency below 500 ms.

Use Value: Accelerates system initialization and supports hot-swap firmware recovery without external memory controllers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL512SAGMFI10Same die, SOIC-16 package (300 mil); lacks FBGA mechanical robustness and thermal performanceBetter suited for prototyping and low-vibration PCBs; not recommended for automotive chassis-mount applicationsSelect when board space permits larger SOIC and thermal cycling is < ±60°C
Winbond W25Q512JWIM > 256KB sectors512 Mb density but uses 4-KB and 64-KB erase blocks; no hardware ECC or AutoBootRequires host-side ECC and custom boot sequencing; lower cost but higher integration effortSelect only if firmware update granularity demands sub-256KB erase units and ECC is handled in software

Compared with S25FL512SAGBHV310, the SOIC variant trades mechanical ruggedness for ease of hand-soldering, while the Winbond alternative sacrifices integrated reliability features for finer erase granularity-neither matches the combined AEC-Q100 Grade 2 qualification, hardware ECC, and AutoBoot of the original.

Availability

S25FL512SAGBHV310 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging subsystems, and carrier-grade networking equipment requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S25FL512SAGBHV310 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.

The FL-S family targets high-reliability embedded systems requiring fast, secure, and long-life nonvolatile storage-designed specifically for boot code, firmware, and configuration data in AEC-Q100-qualified environments.

FAQ

What is the maximum clock frequency supported in DDR mode?

The S25FL512SAGBHV310 supports up to 80 MHz DDR clock frequency, delivering 80 MBps Quad Read DDR throughput when VIO = VCC = 3.0–3.6 V. This requires strict PCB layout adherence to DDR timing constraints, including matched trace lengths and controlled impedance routing for IO0–IO3 lines.

Does this part require external pull-up resistors on WP# and HOLD# pins?

Yes-WP# and HOLD# are active-low inputs with internal weak pull-downs. External 4.7 kΩ pull-up resistors to VIO are required for reliable deassertion during normal operation; omission may cause unintended sector protection or transaction suspension during noise events.

How is the AutoBoot address configured?

The AutoBoot address is stored in the Configuration Register (CR) bits [23:8] and is loaded at power-up or RESET#. It must be programmed via Write Enable + Write Configuration Register command prior to first use; default value is 0x000000, pointing to the start of the memory array.

Is the OTP region one-time programmable only, or can it be erased?

The 1024-byte OTP array is permanently programmable-once a bit is set to '0', it cannot be reset to '1'. Erase is not supported. Programming is performed via dedicated One-Time Program commands and requires Write Enable; each byte must be written individually with proper timing margins.

S25FL512SAGBHV310 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (6x8)

S25FL512SAGBHV310 FAQ

1.How can I place an order for S25FL512SAGBHV310 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL512SAGBHV310 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL512SAGBHV310 reliable?

The price and inventory of S25FL512SAGBHV310 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHV310 is usually 5 days.

3.What payment methods are accepted for S25FL512SAGBHV310?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHV310 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL512SAGBHV310?

S25FL512SAGBHV310 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL512SAGBHV310 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL512SAGBHV310?

For technical support, including S25FL512SAGBHV310 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHV310 requirements.

6.How does Aetrix verify that S25FL512SAGBHV310 is sourced from the original manufacturer or authorized distributors?

All S25FL512SAGBHV310 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHV310 meets industry standards.

7.What is the process for return or replacement of S25FL512SAGBHV310?

All S25FL512SAGBHV310 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHV310, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL512SAGBHV310 part is unused and in its original packaging.

Return procedure for S25FL512SAGBHV310:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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