Infineon Technologies S25FL512SAGBHV313

Overview

S25FL512SAGBHV313 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC. It supports AutoBoot, CFI, and DDR read modes, and is qualified for Industrial Plus (–40°C to +105°C) operation in FBGA package.

For engineers reviewing the S25FL512SAGBHV313 datasheet, S25FL512SAGBHV313 pinout, S25FL512SAGBHV313 application, or S25FL512SAGBHV313 equivalent, this device delivers high-speed Quad/DDR read performance, 100,000 program-erase cycles, OTP-based security, and AEC-Q100 Grade 2 automotive qualification - critical for boot code storage in industrial controllers and ADAS ECUs.

Technical Context

This FL-S family device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling true single-bit ECC correction and deterministic erase timing across uniform 256-KB sectors. Its dual-voltage I/O (1.65–3.6 V) and core (2.7–3.6 V) support flexible host interfacing without level shifters.

The command set maintains footprint and software compatibility with S25FL-A/K/P families while adding DDR read modes and enhanced sector protection via ASP. Reset behavior, AutoBoot address selection, and status register lock bits are configurable via dedicated commands and nonvolatile registers.

Key Specifications

Pinout & Package

Package: 24-ball FBGA (FAB024, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Compared with S25FL512SAGBHV313, the Cypress alternative offers identical functionality with packaging variance, while the Winbond part trades automotive robustness, security, and uniform erase granularity for lower voltage operation and reduced feature set - making it unsuitable for safety-critical or industrial deployments.

Availability

S25FL512SAGBHV313 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging systems, and network edge routers requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 2 qualification.

Supply support for S25FL512SAGBHV313 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions, with global R&D and manufacturing infrastructure.

The FL-S flash product line targets high-reliability embedded systems requiring fast boot, long data retention, and hardware-enforced security - specifically designed for automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.

FAQ

What is the maximum clock frequency supported for DDR read operations?

The S25FL512SAGBHV313 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency, delivering 20 MBps, 40 MBps, and 80 MBps respectively when VIO = VCC = 3.0–3.6 V. DDR timing requires strict setup/hold margins and matched trace lengths on the PCB.

Does this device support hardware write protection independent of software commands?

Yes - the WP# pin provides hardware-based write protection. When held low, it disables all program and erase operations regardless of status register settings. This function operates independently of software commands and remains active even after reset or power cycle.

How is the AutoBoot address configured, and can it be changed in-system?

The AutoBoot address is stored in a nonvolatile configuration register and can be programmed using the Write Configuration Register command. It supports both Normal and Quad Read modes and persists across power cycles. The address is user-selectable within the valid memory map range.

Is the 24-ball FBGA package (FAB024) compatible with standard reflow profiles for lead-free assembly?

Yes - the FAB024 package is Pb-free and qualified for standard IPC/JEDEC J-STD-020D reflow profiles, including peak temperatures up to 260°C. Thermal pad soldering is not required; the package uses perimeter-only ball layout with 0.8 mm pitch and 0.35 mm ball diameter.