Infineon Technologies S25FL512SAGBHVA10
- Part No.:
- S25FL512SAGBHVA10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHVA10.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:317
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL512SAGBHVA10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC for single-bit error correction. It supports AutoBoot, CFI, and DDR read modes, and is qualified for Industrial Plus (–40°C to +105°C) operation in FBGA package.
For engineers reviewing the S25FL512SAGBHVA10 datasheet, S25FL512SAGBHVA10 pinout, S25FL512SAGBHVA10 application, or S25FL512SAGBHVA10 equivalent, key selection factors include Quad/DDR read bandwidth, 100,000 program-erase cycles, OTP security, sector protection granularity, and AEC-Q100 Grade 2 qualification for extended-temperature embedded systems.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing and low-latency command execution. Its dual-voltage I/O (VIO = 1.65–3.6 V) decouples interface signaling from core logic, supporting mixed-voltage host designs.
The SPI interface supports all four clock polarity/phase modes (CPOL/CPHA 0/0, 0/1, 1/0, 1/1), plus DDR mode at up to 80 MHz, and features a 512-byte page programming buffer with Quad-Input Page Programming (QPP) for low-clock-rate systems. The CFI and SFDP tables provide standardized configuration discovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - supports firmware images, boot code, and configuration data for mid-to-high-end microcontrollers and SoCs. |
| Read Bandwidth (Quad) | 52 MBps at VIO = VCC = 3.0–3.6 V - enables fast code XIP (execute-in-place) from flash without local RAM buffering. |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and partitioning for OTA update schemes with atomic sector-level rollback. |
| Endurance | 100,000 program-erase cycles - ensures reliable field updates over 10+ years in industrial control and automotive ECUs. |
| Data Retention | 20 years minimum at +85°C - meets long-life requirements for infrastructure and automotive applications without refresh. |
| Security | 1024-byte OTP array + hardware/software block protection + Advanced Sector Protection - enables secure boot key storage and immutable firmware partitions. |
| Temperature Range | –40°C to +105°C (Industrial Plus) - validated for under-hood and factory-floor environments without derating. |
| Supply Voltages | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - allows direct interfacing with 1.8 V or 3.3 V host processors without level shifters. |
Pinout & Package
Package: 24-ball FBGA (FAB024 footprint, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command latching; must be asserted before SCK edge to initiate valid transaction. |
| SCK | Serial Clock Input | Edge-triggered clock for synchronous data transfer; supports up to 133 MHz SDR or 80 MHz DDR operation. |
| IO0 (SI) | Serial Input / I/O0 | Primary data input during write/program; functions as bidirectional I/O0 in Dual/Quad modes. |
| IO1 (SO) | Serial Output / I/O1 | Primary data output during read; functions as bidirectional I/O1 in Dual/Quad modes. |
| IO2 (WP#) | Write Protect / I/O2 | Hardware-enabled sector lock when pulled low; also serves as Quad I/O2 in multi-line commands. |
| IO3 (HOLD#) | Hold Input / I/O3 | Pauses ongoing SPI transfer without deselecting chip; doubles as Quad I/O3 in high-speed modes. |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that clears internal state and reinitializes flash controller logic. |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; independent of I/O voltage for mixed-signal compatibility. |
| VIO | I/O Supply | 1.65–3.6 V supply for all signal pins; enables interoperability with 1.8 V or 3.3 V host interfaces. |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance PCB return path for signal integrity. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically executes Normal or Quad Read at power-up/reset from user-configurable address - eliminates external boot ROM dependency. |
| Hardware ECC | On-the-fly single-bit error correction with no software overhead - maintains data integrity across 20-year retention without host intervention. |
| Extended Addressing | 32-bit addressing support - required to access full 512 Mb capacity beyond legacy 24-bit SPI flash limits. |
| Quad-Input Page Programming (QPP) | Reduces programming time in low-clock-rate systems by using all four I/O lines for input - improves throughput where SCK < 33 MHz. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enables fine-grained firmware partitioning for secure OTA updates. |
Applications
| Automotive ECU Boot Storage | Industrial PLC Firmware |
|---|---|
Use Scenario: Storing boot loader and safety-critical firmware in engine control units requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Nonvolatile boot memory with AutoBoot and hardware ECC, providing deterministic startup within 100 ms after power-on. Use Value: Eliminates external error-checking logic and enables field firmware updates with verified sector erase/program cycles under thermal stress. | Use Scenario: Holding real-time OS kernel, ladder logic, and configuration data in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability SPI flash with 256-KB uniform sectors and 100K endurance - supports daily firmware revisions and runtime parameter logging. Use Value: Enables atomic firmware swaps via sector-level erase, reducing downtime during maintenance and ensuring rollback capability after failed updates. |
| Medical Imaging System Code Storage | 5G Baseband Radio Firmware |
Use Scenario: Storing FPGA bitstreams and diagnostic application binaries in portable ultrasound and MRI subsystems operating at +105°C ambient. IC Role / Device Role / Timing Role: Industrial Plus temperature-rated serial NOR flash with Quad Read bandwidth > 50 MBps - accelerates FPGA configuration and UI asset loading. Use Value: Meets IEC 60601-1 thermal safety margins while delivering XIP performance comparable to parallel NOR, reducing BOM count. | Use Scenario: Hosting radio stack firmware and calibration tables in massive MIMO baseband units requiring secure, high-bandwidth flash access. IC Role / Device Role / Timing Role: Secure SPI flash with OTP key storage and ASP - isolates cryptographic keys from runtime firmware partitions. Use Value: Prevents unauthorized firmware modification via hardware-enforced sector locks and tamper-resistant one-time programmable memory. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFI10 | Same die, SOIC-16 package (300 mil); lacks FBGA mechanical robustness and thermal dissipation. | Better suited for prototyping and low-vibration lab environments; not rated for automotive shock/vibe. | Select when board space allows SOIC and thermal budget is unconstrained. |
| Winbond W25Q512JWIM (512 Mb, 1.8 V I/O) | 1.8 V only I/O (no 3.3 V tolerance); no DDR mode; 64-KB erase blocks instead of 256-KB. | Requires level-shifting for 3.3 V hosts; finer erase granularity increases wear leveling complexity. | Select only if system uses 1.8 V I/O exclusively and does not require DDR read or AutoBoot. |
Compared with S25FL512SAGBHVA10, the SOIC variant trades package ruggedness for ease of hand-soldering, while the Winbond alternative sacrifices voltage flexibility and DDR performance for lower cost in 1.8 V-only designs - neither matches the combined Industrial Plus rating, 256-KB uniform erase, and hardware ECC of the FBGA version.
Availability
S25FL512SAGBHVA10 is available at Aetrix Electronics and suitable for automotive ECU boot storage, industrial PLC firmware, medical imaging system code storage, and 5G baseband radio firmware requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S25FL512SAGBHVA10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and communications markets.
The S25FL-S family delivers high-reliability serial NOR flash optimized for mission-critical embedded systems requiring AEC-Q100 qualification, extended data retention, and hardware-based security features.
FAQ
What is the maximum clock frequency supported in DDR mode?
The S25FL512SAGBHVA10 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency when VIO = VCC = 3.0–3.6 V, delivering up to 80 MBps read bandwidth in Quad DDR mode. This is specified in the AC characteristics section of the datasheet under DDR timing parameters.
Does this part support 32-bit addressing in standard SPI mode?
Yes - the device implements Extended Addressing with 32-bit address support across all read, program, and erase commands, enabled via Bank Address Register (BAR) or 4-byte address instruction (0x13). This is required to access the full 512 Mb density beyond the 16 MB limit of 24-bit addressing.
How is the 1024-byte OTP array accessed and protected?
The OTP array is accessed via dedicated One-Time-Program commands (0x4B, 0x42) and locked permanently after first write. Protection is enforced by Status Register bit SRP0/SRP1 and hardware WP# assertion; once programmed, OTP contents cannot be erased or rewritten, even with RESET#.
Can the device operate with VIO = 1.8 V while VCC = 3.3 V?
Yes - the device supports independent VIO (1.65–3.6 V) and VCC (2.7–3.6 V) supplies. At VIO = 1.8 V and VCC = 3.3 V, it operates in SDR mode up to 66 MHz with reduced read bandwidth (e.g., 33 MBps Quad Read), as defined in the performance summary table for low-VIO conditions.
S25FL512SAGBHVA10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SAGBHVA10 FAQ
1.How can I place an order for S25FL512SAGBHVA10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHVA10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHVA10 reliable?
The price and inventory of S25FL512SAGBHVA10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHVA10 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHVA10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHVA10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHVA10?
S25FL512SAGBHVA10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHVA10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHVA10?
For technical support, including S25FL512SAGBHVA10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHVA10 requirements.
6.How does Aetrix verify that S25FL512SAGBHVA10 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHVA10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHVA10 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHVA10?
All S25FL512SAGBHVA10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHVA10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHVA10 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHVA10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL512SAGBHVA10 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

