Infineon Technologies S25FL512SAGBHVA13

Overview

S25FL512SAGBHVA13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad-Input Page Programming, and integrated hardware ECC. It supports Fast/Quad/DDR read modes up to 80 MHz DDR clock (80 MBps Quad Read DDR), operates from –40°C to +105°C (Industrial Plus), and is packaged in 24-ball FBGA (FAB024, 6 × 8 mm).

For engineers reviewing the S25FL512SAGBHVA13 datasheet, S25FL512SAGBHVA13 pinout, S25FL512SAGBHVA13 application, or S25FL512SAGBHVA13 equivalent, key selection criteria include Quad DDR read throughput, 100,000 program-erase cycles, OTP-based security, AEC-Q100 Grade 2 qualification, and compatibility with S25FL-P family footprints and command sets.

Technical Context

This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density, low-power serial flash operation. Its dual-voltage design separates core (VCC: 2.7–3.6 V) and I/O (VIO: 1.65–3.6 V) supplies, supporting mixed-signal SoC interfacing while maintaining signal integrity across voltage domains.

The logic block integrates SRAM latches, X/Y decoders, and configurable control logic for AutoBoot execution, CFI-compliant configuration access, and JEDEC JESD216 SFDP parameter discovery. All erase and program operations are managed by on-die state machines with automatic ECC generation and correction for single-bit errors.

Key Specifications

Pinout & Package

Package: FAB024 24-ball FBGA (6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Compared with S25FL512SAGBHVA13, the SOIC variant trades DDR performance and thermal efficiency for ease of prototyping, while the Winbond part sacrifices security and flexible voltage operation for minimal quiescent power - making the Infineon FBGA version optimal for thermally dense, safety-critical, and high-throughput embedded systems.

Availability

S25FL512SAGBHVA13 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, industrial PLC code retention, and 5G RRU FPGA configuration requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S25FL512SAGBHVA13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure embedded solutions, with global manufacturing and quality certification to ISO/TS 16949 and AEC-Q200 standards.

The FL-S family targets high-reliability embedded systems needing fast, secure, and scalable serial flash - designed specifically for automotive, industrial, and communications applications demanding AEC-Q100 qualification, extended temperature operation, and robust data integrity.

FAQ

What is the maximum supported clock frequency for DDR read operations?

The S25FL512SAGBHVA13 supports Quad Read DDR at up to 80 MHz clock frequency, delivering 80 MBps effective throughput when VIO = VCC = 3.0–3.6 V. This mode requires proper setup/hold timing compliance and is disabled below 3.0 V I/O supply. DDR operation is configured via status register bits and verified using the Read Status Register command before issuing DDR read commands.

Does this part support hardware write protection independent of software commands?

Yes - the WP#/IO2 pin provides hardware-level write protection when driven low, disabling all program and erase commands regardless of status register settings. This function remains active even during power transitions and complements software-based block protection. The pin must be pulled to VIO or grounded through a resistor; floating is not permitted per datasheet absolute maximum ratings.

How is AutoBoot configured and what address does it target by default?

AutoBoot behavior is set via Configuration Register bits CR[3:2]; it can be enabled to execute either Normal Read (0x03) or Quad Read (0x6B) at a user-defined 24-bit or 32-bit start address stored in the AutoBoot Address Register. Default address is 0x000000 unless programmed via Write Configuration Register command. AutoBoot triggers on power-up completion or RESET# deassertion after internal voltage stabilization.

Is the FAB024 package compatible with standard reflow profiles for lead-free assembly?

Yes - the S25FL512SAGBHVA13 in FAB024 package is qualified for IPC/JEDEC J-STD-020D reflow profile with peak temperature of 260°C for 30 seconds maximum. Its Pb-free, matte-tin finish meets RoHS Directive 2011/65/EU and is compatible with standard nitrogen or air reflow ovens. Board layout must follow Infineon's recommended pad geometry and thermal relief patterns to prevent solder voiding and mechanical stress.