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Infineon Technologies S25FL512SAGBHVB10

Part No.:
S25FL512SAGBHVB10
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL512SAGBHVB10.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:184

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Product details

Overview

S25FL512SAGBHVB10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, and integrated hardware ECC. It supports Quad Read at up to 52 MBps, AutoBoot, CFI, and operates across –40°C to +105°C (Industrial Plus). Used in boot code storage for embedded microcontrollers and FPGA configuration.

For engineers reviewing the S25FL512SAGBHVB10 datasheet, S25FL512SAGBHVB10 pinout, S25FL512SAGBHVB10 application, or S25FL512SAGBHVB10 equivalent, this page delivers verified electrical specs, package mapping, real-world timing performance, security features (OTP, ASP), and validated alternative parts for migration or sourcing continuity.

Technical Context

This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with single-bit ECC correction and deterministic erase/program latency. Its dual-voltage I/O (1.65–3.6 V) and core (2.7–3.6 V) support mixed-signal SoC interfacing without level shifters.

The SPI interface supports all four clock modes (0 and 3 standard), DDR read commands, extended 32-bit addressing, and command sets compatible with S25FL-A/K/P families-ensuring firmware reuse and PCB footprint compatibility across generations.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB) - sufficient for full FPGA bitstreams or multi-stage bootloader images
Read Speed (Quad)52 MBps at 104 MHz - enables sub-100 ms boot time for 4 MB firmware
Erase UnitUniform 256-KB sectors - simplifies wear leveling and avoids partial-sector fragmentation
Endurance100,000 program-erase cycles - supports field firmware updates over 10+ years
Data Retention20 years minimum - meets long-lifecycle industrial and automotive requirements
Voltage RangeVCC: 2.7–3.6 V; VIO: 1.65–3.6 V - interoperable with 1.8 V or 3.3 V host controllers
Temperature Range–40°C to +105°C (Industrial Plus) - qualified for under-hood and factory-floor deployments

Pinout & Package

Package: 24-ball FBGA (FAB024, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for SPI command latching; must be held low during entire transaction
SCKSerial Clock InputDrives all data transfers; supports up to 133 MHz SDR or 80 MHz DDR operation
IO0 (SI)Serial Input / I/O0Primary data input for standard SPI; also serves as first I/O line in Dual/Quad modes
IO1 (SO)Serial Output / I/O1Primary data output in standard mode; second I/O line in Dual/Quad configurations
IO2 (WP#)Write Protect / I/O2Hardware write protection when asserted low; configurable as Quad I/O line in non-protect mode
IO3 (HOLD#)Hold Input / I/O3Pauses ongoing transfer without deselecting chip; doubles as fourth I/O line in Quad mode
VCCCore Supply2.7–3.6 V power for internal logic and array; decoupling required per datasheet layout guidelines
VIOI/O Supply1.65–3.6 V supply setting voltage threshold for all I/O pins-enables mixed-voltage system integration

Key Features

FeatureDesign Value
AutoBoot FunctionAutomatically executes Normal or Quad Read at power-up/reset from preconfigured address-eliminates host-side boot initialization code
Hardware ECCOn-the-fly single-bit error correction with no software overhead-ensures data integrity without CPU intervention
Advanced Sector Protection (ASP)Password- or boot-code-controlled individual sector locking-prevents unauthorized firmware modification in secure boot chains
Common Flash Interface (CFI)Standardized register map for runtime identification of density, timings, and protection status-simplifies portable bootloader development
Quad-Input Page Programming (QPP)Enables high-speed programming even on low-frequency hosts by using all four I/O lines for write data-reduces programming time by ~4× vs. standard SPI

Applications

Industrial PLC Firmware StorageFPGA Configuration Memory

Use Scenario: Storing firmware and configuration parameters in programmable logic controllers deployed in factory automation environments with wide temperature swings.

IC Role / Device Role / Timing Role: Nonvolatile boot memory providing deterministic startup sequence and field-upgradable application code.

Use Value: 20-year data retention and 100K endurance ensure reliable operation over equipment lifetime without recalibration or replacement.

Use Scenario: Holding full bitstream for Xilinx or Intel FPGAs in edge AI inference accelerators requiring fast, repeatable reconfiguration.

IC Role / Device Role / Timing Role: High-speed serial configuration memory delivering 52 MBps Quad Read to meet FPGA startup timing budgets.

Use Value: Uniform 256-KB sectors and AutoBoot reduce configuration latency and eliminate external controller dependency during power-on reset.

Automotive ADAS Boot ImageMedical Imaging System Code Storage

Use Scenario: Storing certified boot images and safety-critical firmware for radar processing units operating in AEC-Q100 Grade 2 conditions (–40°C to +105°C).

IC Role / Device Role / Timing Role: Secure, qualified flash memory supporting ASIL-B boot integrity via OTP and ASP protections.

Use Value: Hardware write protection and password-locked sector access prevent tampering during vehicle service or OTA update attempts.

Use Scenario: Hosting diagnostic firmware and calibration tables in portable ultrasound devices requiring regulatory-compliant long-term data integrity.

IC Role / Device Role / Timing Role: Trusted nonvolatile memory with CFI and JEDEC SFDP support for automated firmware validation during manufacturing test.

Use Value: Integrated ECC and 20-year retention satisfy FDA 21 CFR Part 11 data integrity requirements without external checksum layers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL512SAGNFA10Same die, identical electrical specs, but in 16-pin SOIC (300 mil) package instead of FAB024 BGAPreferred for prototyping, legacy PCBs, or space-tolerant designs where BGA rework is impracticalSelect when board-level testability, hand-soldering, or mechanical robustness outweigh density and thermal advantages of BGA
Winbond W25Q512JWIM
(512 Mb, 1.8 V)
Lower VIO range (1.7–2.0 V), no DDR support, lacks AutoBoot and ASP; uses different ECC implementationSuitable only for cost-sensitive consumer IoT where extended temp and security are not requiredNot recommended for industrial or automotive use due to missing AEC-Q100 qualification and reduced feature set

Compared with S25FL512SAGBHVB10, the SOIC variant offers identical functionality in a through-hole-compatible package, while the Winbond part trades security, temperature range, and advanced boot features for lower voltage operation and cost-making it unsuitable for mission-critical systems.

Availability

S25FL512SAGBHVB10 is available at Aetrix Electronics and suitable for industrial control systems, automotive ADAS modules, medical imaging platforms, and FPGA-based edge computing devices requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 compliance.

Supply support for S25FL512SAGBHVB10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.

The S25FL-S family targets high-reliability embedded systems needing secure, fast, and long-life serial flash-designed specifically for boot code, FPGA configuration, and firmware storage in harsh environments.

FAQ

What is the maximum clock frequency supported in DDR mode?

The S25FL512SAGBHVB10 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency, delivering 20 MBps, 40 MBps, and 80 MBps respectively when VIO = VCC = 3.0–3.6 V. DDR timing requires strict setup/hold alignment per AC specification section 5.5.

Does this part support hardware write protection independent of software commands?

Yes. The WP# pin provides hardware-based write protection: when held low, it blocks all program and erase operations regardless of status register settings. This function remains active even if software write-enable latches are set, offering fail-safe protection against accidental writes.

How is the 1024-byte OTP array used in secure boot implementations?

The OTP array stores immutable keys, certificates, or cryptographic seeds used during secure boot verification. Once programmed, its contents cannot be erased or rewritten. It interfaces directly with boot ROM logic to authenticate firmware signatures before execution, forming the root-of-trust foundation for ASIL-B and SIL-2 systems.

Can this device operate with VIO = 1.8 V while VCC = 3.3 V?

Yes. The device supports independent VIO (1.65–3.6 V) and VCC (2.7–3.6 V) supplies. At VIO = 1.8 V and VCC = 3.3 V, Quad Read achieves 33 MBps (66 MHz clock), enabling interoperability with 1.8 V FPGAs or microcontrollers while maintaining full core performance and reliability.

S25FL512SAGBHVB10 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (6x8)

S25FL512SAGBHVB10 FAQ

1.How can I place an order for S25FL512SAGBHVB10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL512SAGBHVB10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL512SAGBHVB10 reliable?

The price and inventory of S25FL512SAGBHVB10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHVB10 is usually 5 days.

3.What payment methods are accepted for S25FL512SAGBHVB10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHVB10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL512SAGBHVB10?

S25FL512SAGBHVB10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL512SAGBHVB10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL512SAGBHVB10?

For technical support, including S25FL512SAGBHVB10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHVB10 requirements.

6.How does Aetrix verify that S25FL512SAGBHVB10 is sourced from the original manufacturer or authorized distributors?

All S25FL512SAGBHVB10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHVB10 meets industry standards.

7.What is the process for return or replacement of S25FL512SAGBHVB10?

All S25FL512SAGBHVB10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHVB10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL512SAGBHVB10 part is unused and in its original packaging.

Return procedure for S25FL512SAGBHVB10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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