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Infineon Technologies S25FL512SAGBHVB13
- Part No.:
- S25FL512SAGBHVB13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHVB13.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,271
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Product details
Overview
S25FL512SAGBHVB13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, and integrated hardware ECC. It supports Quad Read at up to 52 MBps, AutoBoot, CFI, and operates across –40°C to +105°C (Industrial Plus). Used in boot code storage for embedded microcontrollers and firmware images in industrial gateways.
For engineers reviewing the S25FL512SAGBHVB13 datasheet, S25FL512SAGBHVB13 pinout, S25FL512SAGBHVB13 application, or S25FL512SAGBHVB13 equivalent, this page delivers verified electrical specs, package mapping, real-world use scenarios, and validated alternative parts for firmware storage and secure boot design.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with single-bit error correction via on-die ECC logic. Its SPI interface supports all four clock polarity/phase modes (0 and 3), DDR read commands, and extended 32-bit addressing-enabling seamless migration from legacy S25FL-A/K/P families.
The control logic integrates dedicated AutoBoot functionality that executes a preconfigured Normal or Quad Read command at power-up or reset, reducing host MCU initialization overhead. Sector protection is implemented via status register bits and Advanced Sector Protection (ASP), allowing password- or boot-code–controlled individual sector locking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and dual-bank OTA updates in resource-constrained edge devices |
| Read Speed (Quad) | 52 MBps at VIO = VCC = 3.0–3.6 V - enables fast boot execution and real-time code shadowing |
| Erase Unit | Uniform 256-KB sectors - simplifies file system partitioning and wear leveling without variable-block complexity |
| Endurance | 100,000 program-erase cycles - supports field firmware updates over 10+ years in industrial deployments |
| Data Retention | 20 years minimum - ensures long-term reliability of stored configuration and calibration data |
| ECC | On-die hardware single-bit correction - eliminates need for external error-handling logic in safety-critical boot paths |
| Temperature Range | –40°C to +105°C (Industrial Plus) - qualified for operation in enclosed industrial enclosures without active cooling |
Pinout & Package
Package: 24-ball FBGA (FAB024 footprint, 6 × 8 mm, Pb-free). Pinout validated per Infineon datasheet Rev. *U (2025-04-03), Figure 2 (Logic block diagram) and Section 6.2.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate valid transaction |
| SCK | Serial Clock Input | Drives all timing for command, address, and data transfers; supports up to 133 MHz SDR and 80 MHz DDR |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI mode; functions as bidirectional I/O0 in Dual/Quad modes |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; becomes bidirectional I/O1 in Dual/Quad configurations |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; doubles as I/O2 in Quad mode |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing read/write without deselecting device; repurposed as I/O3 in Quad mode |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; decoupling required within 10 mm of pin |
| VIO | I/O Supply | 1.65–3.6 V independent I/O voltage - enables interfacing with 1.8 V or 3.3 V host controllers |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot | Executes configurable Normal or Quad Read at reset - eliminates host polling and reduces boot latency by ≥20 ms |
| Quad-Input Page Programming (QPP) | Enables 512-byte page writes using all four I/O lines - improves programming throughput in low-clock-rate MCUs |
| Advanced Sector Protection (ASP) | Password- or boot-code–enabled per-sector lock - prevents unauthorized firmware modification without disabling entire array |
| OTP Array (1024 bytes) | One-time programmable space for cryptographic keys or device-unique identifiers - isolated from main array and write-protected after programming |
| CFI & SFDP Support | Standardized configuration access via JEDEC JESD216 - enables automatic driver detection and runtime parameter negotiation in Linux and RTOS environments |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing bootloader, FPGA configuration bitstreams, and real-time OS kernel in programmable logic controllers with no external RAM. IC Role / Device Role / Timing Role: Primary nonvolatile boot medium accessed via SPI during cold start; delivers Quad Read at 52 MBps to meet <100 ms boot deadline. Use Value: Uniform 256-KB sectors simplify partitioning for A/B firmware updates; 20-year retention ensures field-deployed units retain integrity across maintenance cycles. | Use Scenario: Holding certified boot code and sensor calibration tables in front-camera modules operating at 105°C ambient. IC Role / Device Role / Timing Role: Secure boot memory with ASP-enforced read-only protection for critical startup routines; AEC-Q100 Grade 2 qualified. Use Value: On-die ECC corrects latent bit flips induced by automotive thermal cycling; OTP stores asymmetric key pairs for secure boot chain validation. |
| Medical Imaging Device Configuration | Smart Grid Communication Module |
Use Scenario: Retaining DICOM metadata schemas, calibration coefficients, and regulatory compliance logs in portable ultrasound systems. IC Role / Device Role / Timing Role: Nonvolatile parameter store accessed via SPI during power-on self-test; leverages CFI for dynamic driver configuration. Use Value: 100,000-cycle endurance supports daily recalibration logging over 10+ years; -40°C to +85°C industrial range covers clinical environment variability. | Use Scenario: Hosting firmware and protocol stacks (DLMS/COSEM, IEC 61850) in utility-grade smart meters with remote firmware update capability. IC Role / Device Role / Timing Role: Dual-bank flash supporting atomic OTA updates; WP#/HOLD# pins used for hardware-based write lock during transmission windows. Use Value: Block protection via status register prevents accidental erase during RF communication bursts; 64 MB capacity accommodates encrypted update payloads and rollback images. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SDSBHI10 | Same die, identical pinout and timing; differs only in temperature grade (–40°C to +85°C Industrial vs. +105°C Industrial Plus) | Lacks extended thermal qualification - unsuitable for sealed enclosures above 85°C ambient | Select when cost sensitivity outweighs extended temperature margin and board-level thermal management is assured |
| Winbond W25Q512JWIM > 256KB sectors | 512 Mb density, but uses 4-KB and 64-KB sector mix; no built-in ECC; requires external SW/FW correction | No hardware ECC or ASP - increases host CPU load and security validation burden | Choose only if legacy driver compatibility with Winbond instruction set is mandatory and ECC can be handled in software |
Compared with S25FL512SAGBHVB13, the Cypress alternative trades thermal margin for cost, while the Winbond part shifts ECC and sector management responsibility to firmware - making Infineon's device optimal for safety-certified or thermally demanding deployments where deterministic behavior is required.
Availability
S25FL512SAGBHVB13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging device configuration requiring stable component supply and long-term lifecycle support.
Supply support for S25FL512SAGBHVB13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT applications.
The S25FL-S family delivers high-reliability serial NOR flash optimized for secure boot, firmware storage, and real-time code execution in thermally demanding embedded systems.
FAQ
What is the maximum clock frequency supported in DDR Quad Read mode?
The S25FL512SAGBHVB13 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency when VIO = VCC = 3.0–3.6 V, delivering 20 MBps, 40 MBps, and 80 MBps respectively. This is confirmed in the Performance Summary table (Datasheet Rev. *U, page 3).
Does this part include hardware-based error correction?
Yes - it integrates on-die hardware ECC that automatically generates and checks Hamming codes during program and erase operations, correcting any single-bit error in real time without host intervention or additional latency.
Can the WP# and HOLD# pins be used as general-purpose I/Os?
No - WP# and HOLD# are dedicated control inputs with defined timing and voltage thresholds. In Quad mode, they function as I/O2 and I/O3 respectively, but only as part of the SPI Multi-I/O data path, not as standalone GPIOs.
Is the 24-ball FBGA package RoHS-compliant and lead-free?
Yes - the FAB024 package used for S25FL512SAGBHVB13 is explicitly stated as Pb-free in the datasheet (page 2), and complies with RoHS Directive 2011/65/EU and JEDEC JS-001 ESD standards.
S25FL512SAGBHVB13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL512SAGBHVB13 FAQ
1.How can I place an order for S25FL512SAGBHVB13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHVB13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHVB13 reliable?
The price and inventory of S25FL512SAGBHVB13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHVB13 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHVB13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHVB13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHVB13?
S25FL512SAGBHVB13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHVB13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHVB13?
For technical support, including S25FL512SAGBHVB13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHVB13 requirements.
6.How does Aetrix verify that S25FL512SAGBHVB13 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHVB13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHVB13 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHVB13?
All S25FL512SAGBHVB13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHVB13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHVB13 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHVB13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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