Infineon Technologies S25FL512SAGBHVC10
- Part No.:
- S25FL512SAGBHVC10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHVC10.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,641
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Product details
Overview
S25FL512SAGBHVC10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for high-reliability embedded boot code and firmware storage in industrial and automotive systems. It supports Quad Read at up to 52 MBps, features 256-KB uniform sectors, 100,000 program-erase cycles, 20-year data retention, and integrated hardware ECC.
For engineers reviewing the S25FL512SAGBHVC10 datasheet, S25FL512SAGBHVC10 pinout, S25FL512SAGBHVC10 application, or S25FL512SAGBHVC10 equivalent, key selection criteria include SPI DDR support, AEC-Q100 Grade 2 qualification (–40°C to +105°C), SO16 package compatibility, OTP security, and AutoBoot functionality for deterministic startup.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling fast random access and low-power operation. It supports SPI clock modes 0 and 3, extended 32-bit addressing, and dual/quad/DDR read commands - all while maintaining footprint and command-set compatibility with prior S25FL-A/K/P families.
The internal control logic integrates automatic ECC generation for single-bit correction, programmable block protection via status register bits, and Advanced Sector Protection (ASP) with password- or boot-code-controlled individual sector locking. VIO operates independently from VCC (1.65–3.6 V vs. 2.7–3.6 V), supporting mixed-voltage system interfacing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and multi-application partitioning in resource-constrained hosts |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables sub-100 ms firmware load times for real-time boot requirements |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and eliminates erase granularity mismatches in file systems |
| Endurance | 100,000 program-erase cycles - supports field-updatable firmware with frequent OTA patching |
| Data Retention | 20 years minimum at +85°C - meets long-lifecycle requirements for industrial control and automotive ECUs |
| Security | 1024-byte OTP array + ASP + hardware/software write protection - enables secure key storage and immutable boot code lockdown |
| Temperature Range | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive applications without derating |
| Voltage Support | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - allows direct interfacing with 1.8 V or 3.3 V microcontrollers without level shifters |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, industrial-grade body outline per JEDEC MS-012.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command execution; must be asserted before SCK edge to initiate valid transaction |
| SCK | Serial Clock Input | Drives all timing for command, address, and data transfers; supports up to 133 MHz SDR and 80 MHz DDR |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad modes |
| WP# / IO2 | Write Protect Input / I/O2 | Hardware lock for status register and sector protection; doubles as I/O2 in Quad mode |
| HOLD# / IO3 | Hold Input / I/O3 | Suspends ongoing read without deselecting device; doubles as I/O3 in Quad mode |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; decoupling required within 10 mm of pin |
| VIO | I/O Supply | 1.65–3.6 V supply for interface pins only; enables voltage translation between host and flash |
| VSS | Ground | Common reference for VCC and VIO; requires low-inductance connection to PCB ground plane |
| RESET# | Reset Input | Asynchronous active-low reset that clears internal state and forces re-initialization on next CS# assertion |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates host-side boot initialization latency |
| Hardware ECC | On-the-fly single-bit error correction with no software overhead - ensures data integrity without CPU intervention |
| Quad-Input Page Programming (QPP) | Enables high-speed programming even with slow host clocks by accepting 4-bit-wide write data - reduces programming time by ~4× vs. standard SPI |
| Common Flash Interface (CFI) | Standardized configuration data accessible via read commands - enables automatic driver detection and parameter negotiation |
| Extended Addressing (32-bit) | Supports >16 MB address space natively - removes need for bank switching in large firmware deployments |
Applications
| Automotive ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and safety-critical application firmware in engine control units requiring AEC-Q100 Grade 2 compliance. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory accessed during cold start; delivers Quad Read at 52 MBps to meet ASAM MCAL boot timing constraints. Use Value: 20-year data retention and 100K endurance ensure reliable operation over 15+ year vehicle lifetimes without field replacement. | Use Scenario: Holds firmware, configuration tables, and HMI assets in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Standalone SPI flash providing deterministic firmware load to ARM Cortex-M7 host; supports AutoBoot for zero-delay restart after brownout. Use Value: Independent VIO (1.65–3.6 V) allows direct connection to 1.8 V FPGA I/O banks, eliminating external level shifters and BOM cost. |
| Medical Imaging System Code Storage | Smart Grid RTU Configuration Memory |
Use Scenario: Stores diagnostic firmware and calibration data in portable ultrasound devices requiring long-term data integrity and tamper resistance. IC Role / Device Role / Timing Role: Secure firmware repository with OTP and ASP; used during power-on self-test to validate signature before execution. Use Value: 1024-byte OTP stores cryptographic keys and device-specific calibration constants, preventing unauthorized firmware modification. | Use Scenario: Retains communication protocol stacks and grid event logs in remote terminal units operating unattended for decades in outdoor substations. IC Role / Device Role / Timing Role: High-endurance, temperature-stable memory for infrequent but critical firmware updates and persistent logging across wide thermal swings. Use Value: Uniform 256-KB sectors simplify log rotation algorithms and eliminate partial-erase failures common with legacy flash with mixed sector sizes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFI10 | Same die, FBGA-24 (FAB024) package instead of SO16; identical electrical specs and command set | Requires PCB redesign for BGA layout and reflow profile; better thermal performance in high-density designs | Select when board space is constrained and thermal management justifies BGA assembly complexity |
| Winbond W25Q512JWIM (512 Mb, 1.8 V) | 1.8 V core/I/O; lower max clock (133 MHz SDR only, no DDR); no AutoBoot or ASP; different OTP structure | Limited to 1.8 V systems; lacks automotive qualification and deterministic boot capability | Consider only for cost-sensitive, non-automotive, low-temperature applications where DDR and ASP are unnecessary |
Compared with S25FL512SAGBHVC10, the FBGA variant offers identical functionality in smaller footprint but higher assembly cost, while the Winbond part sacrifices automotive qualification, DDR, AutoBoot, and advanced security for lower unit price and 1.8 V operation.
Availability
S25FL512SAGBHVC10 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC development, and medical imaging system integration requiring stable component supply, long-lifecycle support, and AEC-Q100-compliant flash memory.
Supply support for S25FL512SAGBHVC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The S25FL-S family targets high-reliability embedded systems needing deterministic boot, long data retention, and robust security - particularly in automotive ECUs, industrial controllers, and medical devices where firmware integrity is mission-critical.
FAQ
What is the maximum supported SPI clock frequency for DDR read operations?
The S25FL512SAGBHVC10 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency, delivering 20 MBps, 40 MBps, and 80 MBps respectively when VIO = VCC = 3.0–3.6 V. DDR mode requires proper setup via configuration register bit CR3[1] and is not enabled by default.
Does this device support hardware reset recovery without host intervention?
Yes - the RESET# pin provides asynchronous hardware reset that clears internal state and forces re-initialization on the next CS# assertion. After reset, the device defaults to standard SPI mode and executes AutoBoot if previously configured, enabling fully autonomous recovery from power glitches or brownouts.
How is the 1024-byte OTP array accessed and protected?
The OTP array is accessed via dedicated One-Time-Program commands (0x4B, 0x42) and resides at fixed address 0x00000000 in OTP space. It is permanently locked after first write; subsequent writes return status error. Access requires Write Enable (0x06) and is blocked when Status Register Bit 7 (SRP) is set to 1, enforcing irreversible lockdown.
Can the device operate with VIO = 1.8 V while VCC = 3.3 V?
Yes - VIO (1.65–3.6 V) and VCC (2.7–3.6 V) are independently powered. Operating with VIO = 1.8 V and VCC = 3.3 V is explicitly supported and enables direct interfacing with 1.8 V microcontrollers or FPGAs while maintaining full internal performance and reliability specifications.
S25FL512SAGBHVC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Bulk
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SAGBHVC10 FAQ
1.How can I place an order for S25FL512SAGBHVC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHVC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHVC10 reliable?
The price and inventory of S25FL512SAGBHVC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHVC10 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHVC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHVC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHVC10?
S25FL512SAGBHVC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHVC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHVC10?
For technical support, including S25FL512SAGBHVC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHVC10 requirements.
6.How does Aetrix verify that S25FL512SAGBHVC10 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHVC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHVC10 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHVC10?
All S25FL512SAGBHVC10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHVC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHVC10 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHVC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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