Infineon Technologies S25FL512SAGBHVC13
- Part No.:
- S25FL512SAGBHVC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHVC13.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,795
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Product details
Overview
S25FL512SAGBHVC13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad-Input Page Programming, and hardware ECC. It supports Fast/Quad/DDR read modes up to 80 MHz DDR clock (80 MBps Quad Read DDR) and operates across industrial (–40°C to +85°C) and automotive AEC-Q100 Grade 2 (–40°C to +105°C) temperature ranges. Used in boot code storage for microcontrollers in automotive infotainment systems.
For engineers reviewing the S25FL512SAGBHVC13 datasheet, S25FL512SAGBHVC13 pinout, S25FL512SAGBHVC13 application, or S25FL512SAGBHVC13 equivalent, key selection criteria include Quad DDR read throughput, 100,000 program-erase cycles, OTP security array, AEC-Q100 Grade 2 qualification, and SO16/FBGA package compatibility with legacy S25FL-P designs.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density NOR flash with deterministic latency and robust data retention. Its dual-voltage I/O (VIO = 1.65–3.6 V, VCC = 2.7–3.6 V) supports mixed-signal SoC interfacing while maintaining full command set compatibility with S25FL-A/K/P families.
The logic block includes dedicated SRAM latch buffers for 512-byte page programming, on-the-fly hardware ECC generation/correction, and configurable AutoBoot execution from preselected addresses at power-up or reset-critical for fail-safe boot recovery in automotive ECUs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images including bootloader, OS kernel, and application binaries in embedded automotive systems. |
| Read Throughput | 80 MBps (Quad Read DDR @ 80 MHz) - enables sub-100 ms boot time for 64 MB images in real-time safety-critical applications. |
| Erase Unit | Uniform 256-KB sectors - simplifies firmware update partitioning and wear leveling without sector-size fragmentation. |
| Endurance | 100,000 program-erase cycles - supports over 10 years of daily OTA updates in connected vehicle platforms. |
| Data Retention | 20 years minimum at +85°C - meets automotive long-life storage requirements without refresh cycles. |
| Security | 1024-byte OTP array + Advanced Sector Protection - enables secure key storage and immutable boot code locking. |
| Temperature Range | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood and ADAS domain controller deployment. |
| Voltage Support | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - interoperable with 1.8 V or 3.3 V host controllers without level shifters. |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, industrial and automotive qualified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate valid transaction. |
| SCK | Serial Clock Input | Edge-triggered clock for synchronous data transfer; supports up to 80 MHz DDR mode for high-speed reads. |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes for parallel data lanes. |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad modes for parallel data lanes. |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; doubles as I/O2 in Quad mode for expanded bus width. |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing SPI transaction without deselecting chip; doubles as I/O3 in Quad mode for full 4-lane operation. |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that clears internal state and reinitializes flash controller for safe recovery. |
| VCC | Core Supply | 2.7–3.6 V power for memory array and control logic; decoupling required per datasheet layout guidelines. |
| VIO | I/O Supply | 1.65–3.6 V independent supply for interface pins-enables voltage translation between host and flash without external level shifters. |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance PCB return path to minimize noise coupling. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Executes Normal or Quad Read automatically at power-up/reset from user-configurable address-eliminates external boot ROM dependency in MCU-based systems. |
| Hardware ECC | On-the-fly single-bit error correction with no software overhead-ensures bit-level reliability for safety-critical boot code without CPU intervention. |
| Quad-Input Page Programming (QPP) | Enables full 512-byte page writes using all four I/O lines simultaneously-reduces programming time by >3× vs standard SPI in low-clock-rate hosts. |
| Common Flash Interface (CFI) | Standardized JEDEC-compliant configuration data structure-enables automatic driver detection and runtime parameter negotiation in Linux and RTOS environments. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking-prevents unauthorized firmware modification while allowing selective field updates. |
Applications
| Automotive ADAS ECU Boot Storage | Industrial PLC Firmware Repository |
|---|---|
Use Scenario: Stores boot loader, safety monitor, and sensor fusion firmware for radar/LiDAR processing units operating in engine bay environments. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with deterministic <100 µs access latency and AEC-Q100 Grade 2 thermal resilience. Use Value: 20-year data retention at +105°C ensures firmware integrity over full vehicle lifecycle without periodic refresh or backup power. | Use Scenario: Holds field-upgradable control logic, HMI assets, and safety-certified motion profiles for programmable logic controllers in factory automation. IC Role / Device Role / Timing Role: High-reliability firmware archive supporting secure OTA updates via industrial Ethernet protocols. Use Value: 100,000 program-erase cycles accommodate weekly firmware revisions over 19+ years of continuous operation. |
| Medical Imaging System Configuration | Avionics Display Boot Memory |
Use Scenario: Stores calibration tables, DICOM metadata templates, and regulatory-compliant boot sequences for MRI/X-ray subsystems requiring FDA 510(k) traceability. IC Role / Device Role / Timing Role: Secure, tamper-evident configuration store with OTP-locked boot signature verification. Use Value: 1024-byte OTP array provides cryptographically bound root-of-trust for IEC 62304 Class C software validation. | Use Scenario: Hosts DO-178C Level A certified display initialization code and font assets for cockpit multifunction displays. IC Role / Device Role / Timing Role: Fail-operational boot memory with AutoBoot recovery and ECC-protected read paths. Use Value: Quad Read DDR throughput (80 MBps) loads 64 MB display firmware in ≤800 ms-meeting ARINC 661 startup timing budgets. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CY15B104QN-PSOC | 4 Mb density, FRAM technology, no erase cycles, 151 MBps read (SPI x4), 1.7–3.6 V supply | Targeted at ultra-low-latency logging and frequent small-write scenarios-not suitable for full-image boot storage | Select only when write endurance >10¹² cycles and sub-μs random access outweigh capacity needs. |
| MX25L51245GZC-10G | 512 Mb, 104 MHz Quad Read (65 MBps), no DDR mode, no hardware ECC, -40°C to +85°C only | Lacks AEC-Q100 qualification and DDR performance-limited to industrial-grade non-safety applications | Acceptable for cost-sensitive consumer electronics where automotive qualification and ECC are not required. |
Compared with CY15B104QN-PSOC and MX25L51245GZC-10G, the S25FL512SAGBHVC13 uniquely combines automotive-grade reliability, hardware ECC, Quad DDR throughput, and 20-year data retention-making it the only option qualified for ASIL-B boot memory in production vehicles.
Availability
S25FL512SAGBHVC13 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging subsystems, and avionics display modules requiring stable component supply across extended product lifecycles.
Supply support for S25FL512SAGBHVC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The S25FL-S family targets high-reliability embedded systems requiring deterministic boot performance, long-term data integrity, and automotive qualification-designed specifically for ECU, gateway, and domain controller firmware storage.
FAQ
What is the maximum clock frequency supported in DDR mode?
The S25FL512SAGBHVC13 supports up to 80 MHz DDR clock frequency, delivering 80 MBps Quad Read DDR throughput when VIO = VCC = 3.0–3.6 V. This is validated per datasheet Rev. *U Table 3-1 and requires strict AC timing compliance for setup/hold on DQ lines relative to SCK edges.
Does this part require external hardware ECC circuitry?
No. The device integrates on-die hardware ECC capable of detecting and correcting single-bit errors during read operations without CPU or external logic involvement. ECC is always enabled and transparent to the host controller-no configuration or software driver support is needed.
Is the SOIC package RoHS-compliant and lead-free?
Yes. The S25FL512SAGBHVC13 in 16-pin SOIC (300 mil) packaging is fully RoHS-compliant and Pb-free, as confirmed in Infineon's official packaging documentation (document number 002-10247) and marked with "Pb-free" and "RoHS" identifiers on the reel label and top-side marking.
Can this flash be used with a 1.8 V host controller?
Yes. The device supports VIO = 1.65–2.7 V, enabling direct interface with 1.8 V hosts. In this configuration, maximum Quad Read speed drops to 33 MBps (66 MHz clock), but all commands-including AutoBoot and ASP-remain fully functional without level-shifting circuitry.
S25FL512SAGBHVC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SAGBHVC13 FAQ
1.How can I place an order for S25FL512SAGBHVC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHVC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHVC13 reliable?
The price and inventory of S25FL512SAGBHVC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHVC13 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHVC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHVC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHVC13?
S25FL512SAGBHVC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHVC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHVC13?
For technical support, including S25FL512SAGBHVC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHVC13 requirements.
6.How does Aetrix verify that S25FL512SAGBHVC13 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHVC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHVC13 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHVC13?
All S25FL512SAGBHVC13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHVC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHVC13 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHVC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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