Infineon Technologies S25FL512SAGBHVD13
- Part No.:
- S25FL512SAGBHVD13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SAGBHVD13.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,401
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Product details
Overview
S25FL512SAGBHVD13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC for single-bit error correction. It operates across industrial (–40°C to +85°C) and automotive AEC-Q100 Grade 2 (–40°C to +105°C) temperature ranges and is used in boot code storage for microcontroller-based edge gateways.
For engineers reviewing the S25FL512SAGBHVD13 datasheet, S25FL512SAGBHVD13 pinout, S25FL512SAGBHVD13 application, or S25FL512SAGBHVD13 equivalent, key selection criteria include Quad DDR read performance (80 MBps), OTP security array size (1024 bytes), sector protection granularity (256 KB), and compatibility with S25FL-P family footprints.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing and low-power operation. Its dual-voltage design supports independent core (2.7–3.6 V) and I/O (1.65–3.6 V) supplies, allowing interoperability with 1.8 V and 3.3 V host controllers.
The command set includes standard SPI modes 0/3, DDR-capable read protocols, AutoBoot functionality for configurable power-up execution, and Common Flash Interface (CFI) metadata for runtime configuration discovery. Sector erase and page programming are fully hardware-managed with internal ECC generation and verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images plus configuration and log storage in resource-constrained embedded systems |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables fast boot loading and real-time firmware updates without external cache |
| Erase Unit | Uniform 256-KB sectors - simplifies partitioning for OTA update dual-bank schemes and secure boot validation |
| Endurance | 100,000 program-erase cycles - supports frequent field firmware upgrades over 10+ year product lifecycle |
| Data Retention | 20 years minimum - ensures long-term reliability in unpowered storage for industrial control and automotive ECUs |
| Security | 1024-byte OTP array + ASP - allows permanent key storage and password-controlled sector lockdown for secure boot enforcement |
| Supply Range | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - enables direct interfacing with both 1.8 V FPGAs and 3.3 V MCUs without level shifters |
Pinout & Package
Package: 24-ball FBGA (FAB024, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction |
| SCK | Serial Clock | Input clock for SDR/DDR SPI; supports up to 133 MHz for Fast Read and 80 MHz for DDR modes |
| IO0 | Serial Input / I/O0 | Primary data input during programming; bidirectional in Quad mode for address/data transfer |
| IO1 | Serial Output / I/O1 | Primary data output during reads; bidirectional in Dual/Quad modes for high-speed throughput |
| IO2 | Write Protect / I/O2 | Hardware write protection control; tied low to disable all program/erase commands on selected sectors |
| IO3 | Hold / I/O3 | Pauses ongoing SPI transaction without deselecting chip; retains state for multi-command sequences |
| RESET# | Hardware Reset | Asynchronous active-low reset that clears internal state and reinitializes flash controller logic |
| VCC | Core Supply | 2.7–3.6 V power for memory array and control logic; decoupling required within 10 mm of pin |
| VIO | I/O Supply | 1.65–3.6 V supply setting I/O voltage level; independent of VCC for mixed-voltage system integration |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance connection to PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically executes Normal or Quad Read at preconfigured address on power-up/reset - eliminates host-side boot initialization delay |
| Hardware ECC | On-the-fly single-bit error correction with no software overhead - maintains data integrity without CPU intervention |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled per-sector lockdown - enforces secure firmware update boundaries in certified applications |
| CFI & SFDP Support | Standardized configuration metadata accessible via JEDEC JESD216 - enables automatic driver initialization in Linux and RTOS environments |
| Uniform Sector Architecture | 256-KB erase blocks across entire 64 MB array - simplifies wear leveling and reduces firmware complexity vs. mixed-sector devices |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data for programmable logic controllers operating in harsh factory environments with wide temperature swings. IC Role / Device Role / Timing Role: Primary boot memory executing Quad Read at startup; provides deterministic <100 ms boot latency under –40°C to +85°C conditions. Use Value: 20-year data retention and 100K endurance ensure reliable operation across 15+ year maintenance cycles without field replacement. | Use Scenario: Hosting boot code and safety-critical calibration data for radar processing units in Level 2+ ADAS systems. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified SPI flash providing secure, fast-access boot image with OTP-stored cryptographic keys. Use Value: Hardware ECC and ASP prevent bit-flip corruption and unauthorized sector modification - meeting ISO 26262 ASIL-B requirements. |
| Edge Gateway OTA Storage | Medical Imaging Device Code Repository |
Use Scenario: Holding dual-bank firmware images and update metadata for secure over-the-air updates in cellular-connected IoT gateways. IC Role / Device Role / Timing Role: Nonvolatile storage with uniform 256-KB sectors enabling atomic bank switching and rollback capability. Use Value: Quad DDR read (80 MBps) accelerates post-update verification; 1024-byte OTP stores asymmetric key pairs for signature validation. | Use Scenario: Archiving diagnostic firmware, calibration tables, and regulatory compliance logs in FDA-cleared imaging equipment. IC Role / Device Role / Timing Role: High-reliability code repository supporting 20-year archival storage with guaranteed data integrity under continuous operation. Use Value: 20-year retention and 100K endurance eliminate scheduled media refreshes - reducing service downtime and lifecycle cost. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SDSBHI10 | Same die, identical electrical specs and pinout; differs only in marking and packaging (SO16 vs FBGA) | Limited to SOIC footprint; lower thermal dissipation and board density than FBGA | Select when legacy PCB layout or manual assembly favors through-hole or SOIC form factor |
| Winbond W25Q512JWIM | 512 Mb, 1.8 V I/O compatible, but lacks ASP and CFI; uses different command set and OTP structure | No AEC-Q100 qualification; not suitable for automotive safety-critical boot paths | Choose for cost-sensitive consumer applications where advanced security and automotive compliance are not required |
Compared with S25FL512SAGBHVD13, the SOIC variant offers identical functionality in legacy-compatible packaging, while the Winbond part trades security and qualification for lower unit cost - making it viable only in non-safety, non-automotive contexts.
Availability
S25FL512SAGBHVD13 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, and edge gateway OTA storage requiring stable component supply, long-term lifecycle support, and AEC-Q100 Grade 2 qualification.
Supply support for S25FL512SAGBHVD13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for industrial, automotive, and IoT markets.
The S25FL-S series targets high-reliability embedded systems requiring secure, fast, and long-life nonvolatile storage - especially where AEC-Q100 qualification, hardware ECC, and uniform sector erase are mandatory.
FAQ
What is the maximum clock frequency supported for Quad DDR read operations?
The S25FL512SAGBHVD13 supports Quad DDR read at up to 80 MHz, delivering 80 MBps throughput when VIO = VCC = 3.0–3.6 V. This requires strict adherence to DDR timing parameters including tDSH, tDHD, and tDQMH as specified in Section 5.5 of the datasheet. The device automatically configures DDR mode upon receipt of the Fast Read DDR command (0x0D) after proper register setup.
Does this part support hardware write protection without software intervention?
Yes - the WP#/IO2 pin provides hardware-level write protection. When driven low, it disables all program and erase commands across the entire memory array, regardless of status register settings. This function remains active even during power transitions and does not require SPI communication or register writes to engage, making it suitable for fail-safe lock-down in safety-critical systems.
How is the 1024-byte OTP array accessed and protected?
The OTP array is accessed via dedicated One-Time-Program commands (0x4B, 0x42) and resides at fixed address 0x00000000 in its own address space. Once programmed, bits cannot be reset. Protection is enforced by Status Register Lock Bit (SRP) and hardware fuse; writing to OTP requires prior Write Enable (0x06) and confirmation via SRP=1 and WEL=1, preventing accidental overwrite during normal operation.
Can this device operate with a 1.8 V I/O supply while maintaining full read performance?
At VIO = 1.65–2.7 V, Quad Read speed drops to 33 MBps (66 MHz clock), versus 52 MBps at 3.0–3.6 V. All other features remain functional, including AutoBoot, ECC, and ASP. However, DDR modes are disabled below 2.7 V I/O, and Fast Read DDR (0x0D) is not supported - limiting maximum throughput in 1.8 V systems to 8.25 MBps (Fast Read) or 33 MBps (Quad Read).
S25FL512SAGBHVD13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- 750µs
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL512SAGBHVD13 FAQ
1.How can I place an order for S25FL512SAGBHVD13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGBHVD13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGBHVD13 reliable?
The price and inventory of S25FL512SAGBHVD13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGBHVD13 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGBHVD13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGBHVD13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGBHVD13?
S25FL512SAGBHVD13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGBHVD13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGBHVD13?
For technical support, including S25FL512SAGBHVD13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGBHVD13 requirements.
6.How does Aetrix verify that S25FL512SAGBHVD13 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGBHVD13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGBHVD13 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGBHVD13?
All S25FL512SAGBHVD13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGBHVD13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGBHVD13 part is unused and in its original packaging.
Return procedure for S25FL512SAGBHVD13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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