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Infineon Technologies S25FL512SAGMFAG10
- Part No.:
- S25FL512SAGMFAG10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL512SAGMFAG10.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,229
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Product details
Overview
S25FL512SAGMFAG10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for high-reliability embedded boot and code storage in industrial and automotive systems. It supports Quad, Dual, and DDR read modes up to 80 MHz (80 MBps Quad DDR), features 256-KB uniform sectors, 100,000 program-erase cycles, 20-year data retention, and integrated hardware ECC. Used in microcontroller boot loaders requiring fast, secure, and pin-efficient nonvolatile storage.
For engineers reviewing the S25FL512SAGMFAG10 datasheet, S25FL512SAGMFAG10 pinout, S25FL512SAGMFAG10 application, or S25FL512SAGMFAG10 equivalent, key selection criteria include SPI Multi-I/O timing compliance, AEC-Q100 Grade 2 qualification (–40°C to +105°C), SO16 package compatibility, OTP security configuration, and CFI/SFDP register support for dynamic initialization.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling true single-bit ECC correction via on-die logic without host intervention. Its command set fully complies with JEDEC JESD216 SFDP v1.6 and Common Flash Interface (CFI), allowing automatic configuration by boot ROMs and flash-aware toolchains.
The SPI interface supports all four clock polarity/phase modes (0 and 3 standard), plus DDR operation at VIO = VCC = 3.0–3.6 V. AutoBoot functionality enables immediate execution of Normal or Quad Read at power-up or reset from a preconfigured address-critical for deterministic boot latency in safety-critical firmware.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - sufficient for full MCU firmware images including bootloader, RTOS, and application binaries in space-constrained designs. |
| Read Throughput | Quad DDR at 80 MBps - enables sub-100 ms full-image reads for rapid firmware updates or failover recovery. |
| Erase Granularity | Uniform 256-KB sectors - simplifies wear leveling and avoids fragmentation in field-upgradeable systems. |
| Endurance & Retention | 100,000 P/E cycles / 20-year retention - validated for automotive ECU and industrial PLC deployments with infrequent but mission-critical reprogramming. |
| Supply Voltage Range | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - supports mixed-voltage SoC interfaces and legacy 3.3 V or modern 1.8 V I/O domains without level shifters. |
| Security Features | 1024-byte OTP array + ASP + SRBP-based block protection - allows immutable root-of-trust keys, secure boot configuration, and write-locking of critical firmware partitions. |
| Temperature Grade | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive applications and extended-temperature industrial gateways. |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, industrial-grade body size (10.16 mm × 7.62 mm × 2.34 mm).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command latching; must be asserted before SCK edge to initiate valid transaction. |
| SCK | Serial Clock Input | Edge-triggered master clock; supports up to 133 MHz SDR or 80 MHz DDR for timing-critical boot sequences. |
| SI / IO0 | Serial Input / I/O0 | Primary data input for commands and addresses; also functions as bidirectional I/O0 in Quad mode for parallelized transfers. |
| SO / IO1 | Serial Output / I/O1 | Primary data output during read; serves as bidirectional I/O1 in Dual/Quad modes to double or quadruple throughput. |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; doubles as I/O2 in Quad mode for full x4 data bus. |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing transfer without deselecting chip; also acts as I/O3 in Quad mode for complete x4 interface utilization. |
| VCC | Core Supply | 2.7–3.6 V core voltage; powers internal logic, ECC engine, and array decoding circuitry. |
| VIO | I/O Supply | 1.65–3.6 V independent I/O rail; decouples signal integrity from core supply, enabling mixed-voltage system integration. |
| VSS | Ground | Common reference for both VCC and VIO; requires low-inductance connection to minimize switching noise in high-speed reads. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically initiates Normal or Quad Read from user-defined address at power-up/reset-eliminates external boot controller and reduces BOM count. |
| Hardware ECC Engine | On-die single-bit error correction with no host CPU overhead or latency penalty during read operations. |
| JEDEC SFDP v1.6 Support | Enables automatic parameter discovery by boot ROMs and flash tools, removing hard-coded timing constants from firmware. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled per-sector locking-supports hierarchical firmware partitioning (e.g., bootloader vs. application vs. config). |
| Quad-Input Page Programming (QPP) | Reduces programming time in low-clock-rate MCUs by accepting 4-byte-wide write data per SCK cycle instead of serial bitstream. |
Applications
| Automotive ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot firmware and safety-critical control algorithms in engine control units with AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary nonvolatile boot source accessed directly by MCU ROM bootloader via SPI Quad mode. Use Value: 80 MBps Quad DDR read speed ensures <80 ms full-image load; 20-year retention guarantees firmware integrity over vehicle lifetime. | Use Scenario: Holding firmware, configuration tables, and HMI assets in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Code-execution memory mapped via XIP-capable MCU with hardware ECC for runtime reliability. Use Value: Uniform 256-KB erase blocks simplify field updates; OTP array stores calibration data immune to accidental overwrite. |
| Medical Imaging System BIOS | Smart Grid Communication Module |
Use Scenario: Hosting diagnostic BIOS and FPGA configuration bitstreams in portable ultrasound and MRI subsystems requiring Class II medical certification. IC Role / Device Role / Timing Role: Secure, tamper-resistant storage for boot code and cryptographic keys used during secure boot chain verification. Use Value: ASP and 1024-byte OTP enable HIPAA-compliant secure boot; –40°C to +85°C industrial temp grade meets IEC 60601-1 ambient requirements. | Use Scenario: Storing protocol stacks (DLMS/COSEM, IEC 61850), encryption keys, and firmware patches in utility smart meters and RTUs. IC Role / Device Role / Timing Role: Field-upgradable firmware repository with hardware write protection against remote cyber intrusion. Use Value: Block protection + SRBP bits prevent unauthorized firmware modification; 100,000-cycle endurance supports >10 years of OTA updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SDSMFAG10 | Same die, identical electrical specs and pinout; differs only in marking and traceability documentation per Cypress/Infineon merger transition. | No functional difference; accepted interchangeably in existing designs certified with legacy Cypress part numbers. | Select when sourcing from legacy Cypress-distributed inventory or for backward-compatible BOM revision. |
| Winbond W25Q512JVFIQ | 512 Mb density, Quad SPI, but lacks DDR mode, AutoBoot, and ASP; uses different SFDP layout and OTP structure. | Suitable for cost-sensitive consumer applications where DDR performance and advanced security are not required. | Choose only if design does not rely on DDR reads, password-protected sector locking, or automatic boot execution. |
Compared with S25FL512SAGMFAG10, the Cypress variant offers seamless drop-in replacement with identical behavior, while the Winbond part trades DDR speed and ASP security for lower unit cost and broader distributor availability-making it viable only in non-automotive, non-safety-critical contexts.
Availability
S25FL512SAGMFAG10 is available at Aetrix Electronics and suitable for automotive ECUs, industrial PLCs, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for S25FL512SAGMFAG10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, connectivity, and memory solutions for automotive, industrial, and IoT markets.
The S25FL-S family delivers high-performance, AEC-Q100-qualified serial NOR flash targeting deterministic boot, secure firmware storage, and long-term reliability in harsh environments.
FAQ
What is the maximum supported clock frequency for Quad DDR read operations?
The S25FL512SAGMFAG10 supports Quad DDR read at up to 80 MHz, delivering 80 MBps throughput when VIO = VCC = 3.0–3.6 V. This requires strict adherence to DDR timing parameters (tDSH, tDHD, tDQMH) specified in Section 5.5 of the datasheet, and proper PCB layout with matched trace lengths and controlled impedance.
Does this device require external hardware ECC circuitry?
No. The S25FL512SAGMFAG10 integrates a dedicated on-die ECC engine that automatically detects and corrects single-bit errors during all read operations. No external logic or host software intervention is needed-correction occurs transparently within the memory access cycle.
Can the AutoBoot address be changed after initial programming?
Yes. The AutoBoot start address is stored in a dedicated configuration register (CR3[7:0]) and can be modified using the Write Configuration Register (WRCR) command. Changes persist across power cycles and do not require OTP programming-enabling flexible field updates to boot vector locations.
Is the SOIC package RoHS-compliant and lead-free?
Yes. The S25FL512SAGMFAG10 in the 16-pin SOIC package is fully RoHS-compliant and Pb-free, meeting EU Directive 2011/65/EU and IPC/JEDEC J-STD-609A Class 3 moisture sensitivity level (MSL-3) requirements.
S25FL512SAGMFAG10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL512SAGMFAG10 FAQ
1.How can I place an order for S25FL512SAGMFAG10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGMFAG10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGMFAG10 reliable?
The price and inventory of S25FL512SAGMFAG10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGMFAG10 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGMFAG10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGMFAG10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGMFAG10?
S25FL512SAGMFAG10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGMFAG10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGMFAG10?
For technical support, including S25FL512SAGMFAG10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGMFAG10 requirements.
6.How does Aetrix verify that S25FL512SAGMFAG10 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGMFAG10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGMFAG10 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGMFAG10?
All S25FL512SAGMFAG10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGMFAG10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGMFAG10 part is unused and in its original packaging.
Return procedure for S25FL512SAGMFAG10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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