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Infineon Technologies S25FL512SAGMFB013

Part No.:
S25FL512SAGMFB013
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixS25FL512SAGMFB013.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,535

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Product details

Overview

S25FL512SAGMFB013 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for boot code storage and firmware execution in embedded systems. It supports Quad, Dual, and DDR read modes up to 80 MHz clock (80 MBps Quad DDR), features 256-KB uniform sectors, 100,000 program-erase cycles, and 20-year data retention. Used in industrial controllers requiring fast, reliable nonvolatile code storage.

For engineers reviewing the S25FL512SAGMFB013 datasheet, S25FL512SAGMFB013 pinout, S25FL512SAGMFB013 application, or S25FL512SAGMFB013 equivalent, key selection criteria include SPI Multi-I/O timing compliance, 256-KB sector erase granularity, OTP security configuration, AEC-Q100 Grade 2 qualification, and FBGA-24 (FAB024) package compatibility.

Technical Context

This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density, low-power serial flash operation. It supports SPI clock modes 0 and 3, extended 32-bit addressing, and CFI/SFDP parameter discovery for automatic host configuration.

The integrated hardware ECC provides single-bit error correction during read operations, while AutoBoot enables configurable power-up execution of Normal or Quad Read commands at a preselected address-critical for deterministic boot latency in real-time systems.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB) - sufficient for full firmware images and dual-bank OTA updates in resource-constrained microcontrollers
Read Speed (Quad DDR)80 MBps at 80 MHz - enables sub-100 ms full firmware load time for 64 MB image
Erase UnitUniform 256-KB sectors - simplifies wear leveling and avoids partial-sector fragmentation in file systems
Endurance100,000 program-erase cycles - supports frequent field firmware updates over 10+ years of operation
Data Retention20 years minimum at +85°C - ensures long-term reliability in unattended industrial deployments
Supply RangeVCC: 2.7–3.6 V; VIO: 1.65–3.6 V - allows interoperability with both 1.8 V and 3.3 V host I/O domains
Temperature GradeAEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive ECUs and high-temp industrial gateways

Pinout & Package

Package: 24-ball FBGA (FAB024 footprint, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for SPI command latching; must be held stable during multi-byte transfers
SCKSerial Clock InputDrives all SPI timing; supports up to 80 MHz DDR mode with precise setup/hold requirements
IO0–IO3Multi-I/O Bidirectional Data LinesConfigurable as SI/SO/WP#/HOLD# in standard SPI or as quad data lanes in QPI mode
RESET#Hardware Reset InputAsynchronous reset that clears internal state and forces re-initialization of command parser
VCCCore Power Supply2.7–3.6 V supply powering array and control logic; decoupling required per layout guidelines
VIOI/O Power SupplyIndependent 1.65–3.6 V rail enabling level-shifting between host and flash I/O domains

Key Features

FeatureDesign Value
AutoBoot FunctionExecutes preconfigured Normal or Quad Read at power-up/reset without host intervention-reduces boot sequence dependency on external controller timing
Hardware ECCOn-the-fly single-bit error correction using internal logic-eliminates need for software-based ECC overhead in bootloader
Advanced Sector Protection (ASP)Password- or boot-code-controlled individual sector locking-enables secure firmware partitioning (e.g., protected bootloader vs. updatable app region)
OTP Array (1024 B)One-time programmable space for cryptographic keys or device-specific calibration data-physically isolated from main array
CFI & SFDP SupportStandardized configuration registers accessible via JEDEC JESD216-allows automatic host driver initialization without hard-coded parameters

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing boot firmware and runtime configuration for programmable logic controllers operating in factory-floor environments with wide temperature swings and EMI exposure.

IC Role / Device Role / Timing Role: Primary nonvolatile boot memory executing XIP (eXecute-In-Place) code directly from flash via Quad SPI interface.

Use Value: 256-KB uniform sectors simplify firmware update partitioning; AEC-Q100 Grade 2 rating ensures operation at +105°C ambient in enclosed control cabinets.

Use Scenario: Hosting boot loader and safety-critical sensor fusion firmware in radar or camera ECUs where deterministic startup and tamper resistance are mandatory.

IC Role / Device Role / Timing Role: Secure boot memory with ASP-enabled sector lockdown and OTP-stored root keys for cryptographic verification chain.

Use Value: Hardware ECC prevents silent corruption of boot code; AutoBoot reduces boot latency variance to <50 µs across temperature range.

Medical Imaging System ConfigurationSmart Grid Communication Module

Use Scenario: Storing calibrated imaging algorithms and regulatory-compliant device profiles in portable ultrasound or MRI subsystems requiring traceable firmware revisions.

IC Role / Device Role / Timing Role: Nonvolatile configuration store with CFI/SFDP auto-discovery enabling plug-and-play driver compatibility across product generations.

Use Value: 20-year data retention meets FDA 21 CFR Part 11 archival requirements; OTP space secures calibration checksums against unauthorized modification.

Use Scenario: Holding protocol stacks (DLMS/COSEM, IEC 61850) and encryption certificates in cellular-connected smart meters deployed in utility substations with high ESD risk.

IC Role / Device Role / Timing Role: Secure firmware repository supporting remote OTA updates with sector-level write protection during transmission.

Use Value: Block protection via status register prevents accidental overwrite during wireless update; Quad DDR read speed enables rapid certificate validation pre-decrypt.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL512SAGNFI010Same die, SOIC-16 package (300 mil); lacks FBGA thermal performance and board space efficiencyBetter suited for prototyping or low-volume legacy PCBs with through-hole or wide-pitch routing constraintsSelect when mechanical compatibility with existing SOIC footprints is required and thermal derating is acceptable
Winbond W25Q512JWIM > 512Mb512 Mb, but uses 1.2 V I/O; no AEC-Q100 Grade 2 qualification; different SFDP parameter layoutTargeted at consumer IoT edge nodes-not certified for automotive or industrial safety-critical useChoose only for cost-sensitive, non-safety applications where 1.2 V I/O integration simplifies power design

Compared with S25FL512SAGMFB013, the SOIC variant trades thermal robustness and density for ease of assembly, while the Winbond alternative sacrifices automotive qualification and voltage flexibility for lower unit cost in non-critical designs.

Availability

S25FL512SAGMFB013 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging subsystems, and smart grid communication modules requiring stable component supply across extended lifecycles.

Supply support for S25FL512SAGMFB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and security solutions for automotive, industrial, and IoT markets.

The FL-S family targets high-reliability embedded systems needing fast, secure, and long-life serial flash-designed specifically for deterministic boot, firmware integrity, and AEC-Q100-compliant operation.

FAQ

What is the maximum supported clock frequency for Quad DDR read operations?

The S25FL512SAGMFB013 supports Quad DDR read at up to 80 MHz clock frequency, delivering 80 MBps effective throughput when VIO = VCC = 3.0–3.6 V. This requires strict adherence to AC timing parameters including tDSH (data setup hold) and tDH (data hold time), as specified in Section 5.5 of the datasheet. The device does not support DDR above 80 MHz, even with tighter voltage margins.

Does this part support hardware reset via the RESET# pin, and what is its behavior?

Yes, the RESET# pin provides asynchronous hardware reset. When asserted low, it terminates all ongoing operations, clears internal command state, resets status registers to default values, and places the device into standby mode. Release of RESET# initiates internal initialization, after which the device is ready to accept new commands within tRES1 (max 100 µs). No external delay is required before issuing the first post-reset command.

How is Advanced Sector Protection (ASP) configured and enforced?

ASP is configured by writing password-protected commands to dedicated ASP registers, then setting ASP enable bits in the configuration register. Once enabled, individual 256-KB sectors can be locked/unlocked only via valid password authentication or boot code execution. Lock status persists across power cycles and cannot be overridden by standard block protection bits-providing hierarchical, tamper-resistant firmware partitioning.

Can the VIO and VCC supplies operate at different voltages simultaneously?

Yes, VIO (1.65–3.6 V) and VCC (2.7–3.6 V) are independently powered. This allows interfacing with 1.8 V hosts while maintaining full core performance, provided VIO ≥ 1.65 V and VCC ≥ 2.7 V. Voltage sequencing is not required, but VCC must be stable before asserting CS#; VIO may ramp concurrently or slightly after VCC per Section 4.4 of the datasheet.

S25FL512SAGMFB013 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
Automotive
Qualification:
AEC-Q100
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

S25FL512SAGMFB013 FAQ

1.How can I place an order for S25FL512SAGMFB013 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL512SAGMFB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL512SAGMFB013 reliable?

The price and inventory of S25FL512SAGMFB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGMFB013 is usually 5 days.

3.What payment methods are accepted for S25FL512SAGMFB013?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGMFB013 transactions.

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4.How is shipping managed for S25FL512SAGMFB013?

S25FL512SAGMFB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL512SAGMFB013 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL512SAGMFB013?

For technical support, including S25FL512SAGMFB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGMFB013 requirements.

6.How does Aetrix verify that S25FL512SAGMFB013 is sourced from the original manufacturer or authorized distributors?

All S25FL512SAGMFB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGMFB013 meets industry standards.

7.What is the process for return or replacement of S25FL512SAGMFB013?

All S25FL512SAGMFB013 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGMFB013, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL512SAGMFB013 part is unused and in its original packaging.

Return procedure for S25FL512SAGMFB013:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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