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Infineon Technologies S25FL512SAGMFI010
- Part No.:
- S25FL512SAGMFI010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL512SAGMFI010.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:817
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Product details
Overview
S25FL512SAGMFI010 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, and uniform 256-KB sector architecture. It supports Quad Read up to 52 MBps, AutoBoot at power-up, hardware/software block protection, and internal ECC for single-bit error correction. Used in industrial control firmware storage where high reliability and fast boot execution are required.
For engineers reviewing the S25FL512SAGMFI010 datasheet, S25FL512SAGMFI010 pinout, S25FL512SAGMFI010 application, or S25FL512SAGMFI010 equivalent, key selection factors include Quad DDR read performance (80 MBps), AEC-Q100 Grade 2 qualification (–40°C to +105°C), 100,000 program-erase cycles, OTP security array, and SO16/FBGA package compatibility with legacy S25FL-P designs.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling true NOR random-access reads and execute-in-place (XIP) capability. Its dual-voltage design separates core (2.7–3.6 V) and I/O (1.65–3.6 V) supplies, supporting interoperability with 1.8 V and 3.3 V host controllers without level shifters.
The command set is fully compatible with JEDEC JESD216 SFDP and Common Flash Interface (CFI), allowing automatic configuration discovery by bootloader firmware. Sector erase is exclusively uniform (256 KB), eliminating variable-block complexity while maintaining deterministic timing for real-time systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images including bootloader, RTOS, and application binaries in space-constrained embedded systems |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables sub-100 ms firmware load time for 4 MB images over standard SPI |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and eliminates need for complex erase mapping logic |
| Endurance | 100,000 program-erase cycles - supports field firmware updates over 10+ years in industrial gateways |
| Data Retention | 20 years minimum - ensures long-term reliability without refresh in unpowered storage applications |
| Security | 1024-byte OTP + Advanced Sector Protection - allows secure key storage and password-controlled sector locking |
| Temperature Range | –40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs and factory-floor PLCs |
| Voltage Support | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - interoperable with both 1.8 V microcontrollers and 3.3 V FPGAs |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant. Pin count and layout match industry-standard SPI flash footprint for drop-in replacement in existing PCB designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; supports daisy-chaining when used with HOLD# for multi-device arbitration |
| SCK | Serial Clock Input | Drives all synchronous operations; supports modes 0 and 3, plus DDR clocking up to 80 MHz for doubled throughput |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI; becomes bidirectional I/O0 in Dual/Quad mode for parallel data lanes |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; becomes bidirectional I/O1 in Dual/Quad mode; supports tri-state during hold |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; doubles as I/O2 in Quad mode for full 4-lane operation |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing command without deselecting chip; doubles as I/O3 in Quad mode for full 4-lane operation |
| VCC | Core Supply | 2.7–3.6 V power for memory array and control logic; decoupling required per datasheet Section 4.5 |
| VIO | I/O Supply | 1.65–3.6 V independent supply for signal buffers - enables mixed-voltage system interfacing |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance connection to minimize noise on read/write margins |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Function | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates external boot controller and reduces BOM count |
| Internal Hardware ECC | Single-bit error correction with no software overhead - maintains data integrity without CPU intervention during reads |
| Quad-Input Page Programming (QPP) | Enables high-speed programming even with slow host clocks (<20 MHz) - improves production programming throughput |
| Advanced Sector Protection (ASP) | Password- or boot-code controlled individual sector locking - prevents unauthorized firmware modification in deployed devices |
| JEDEC JESD216 SFDP Support | Self-describing parameter table accessible via standard SPI commands - enables automatic driver initialization without hard-coded timing values |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware and configuration data for programmable logic controllers operating in factory environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with XIP-capable Quad Read for deterministic boot latency under 200 ms. Use Value: 256-KB uniform sectors simplify firmware update partitioning; 100K endurance supports daily field updates over 10+ years. | Use Scenario: Holding boot code and safety-critical sensor fusion algorithms in radar/EPS ECUs requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Secure boot memory with OTP-stored cryptographic keys and ASP-locked boot sectors to prevent tampering. Use Value: –40°C to +105°C operation ensures reliability in engine bay mounting; internal ECC guarantees bit-level integrity during vehicle lifetime. |
| Medical Imaging System BIOS | Network Switch Bootloader Storage |
Use Scenario: Storing diagnostic firmware and calibration tables in portable ultrasound and MRI subsystems subject to strict regulatory retention requirements. IC Role / Device Role / Timing Role: Long-term archival memory with 20-year data retention guarantee and CFI/SFDP metadata for automated version validation. Use Value: 1024-byte OTP stores device-specific calibration signatures; Quad DDR read (80 MBps) accelerates system self-test sequences. | Use Scenario: Hosting U-Boot and Linux kernel images in enterprise-grade Ethernet switches requiring rapid failover and hot-swap resilience. IC Role / Device Role / Timing Role: High-throughput boot memory supporting dual-image redundancy and atomic firmware updates via sector swap. Use Value: Uniform 256-KB erase enables atomic image switching without partial-write risk; SO16 package fits legacy switch PCB footprints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGNFI010 | Same die, identical electrical specs, but in 24-ball FBGA (FAB024) package instead of SO16 | Used where board space is constrained and BGA reflow is available; lacks through-hole SOIC option | Select when migrating to higher-density layouts or requiring thermal performance advantages of BGA |
| Winbond W25Q512JVFIQ | 512 Mb Quad SPI flash with similar read speed (52 MBps), but no AutoBoot, no internal ECC, and only 10K endurance cycles | Suitable for cost-sensitive consumer applications; not qualified for automotive or industrial extended-temp use | Select only for non-safety-critical, short-lifecycle products where OTP security and 100K endurance are unnecessary |
Compared with S25FL512SAGMFI010, the FBGA variant offers identical functionality in compact packaging, while the Winbond part trades critical reliability features (ECC, endurance, AutoBoot) for lower cost - making it unsuitable for mission-critical firmware storage.
Availability
S25FL512SAGMFI010 is available at Aetrix Electronics and suitable for industrial automation, automotive ECU boot, medical imaging firmware, and network infrastructure requiring stable component supply across extended product lifecycles.
Supply support for S25FL512SAGMFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure memory solutions, with global R&D and manufacturing infrastructure.
The S25FL-S family targets high-reliability embedded systems needing deterministic boot, long-term data retention, and hardware-enforced security - designed specifically for industrial, automotive, and medical applications demanding AEC-Q100 or extended temperature compliance.
FAQ
Is S25FL512SAGMFI010 pin-compatible with earlier S25FL-P series devices?
Yes - it uses the same 16-pin SOIC footprint and SPI command set as S25FL-P devices, including identical pin functions (CS#, SCK, SI/SO/WP#/HOLD#), voltage tolerances, and timing parameters. No PCB redesign is needed for migration from S25FL256S or S25FL128S.
Does this device support Execute-in-Place (XIP) operation?
Yes - its true NOR architecture and low-latency Quad Read (52 MBps) enable direct code execution from flash without copying to RAM. XIP is supported across all read modes including Fast, Dual, and Quad, with consistent access timing per datasheet Section 5.4.
What is the purpose of the 1024-byte OTP array?
The OTP array stores immutable data such as cryptographic keys, device serial numbers, calibration coefficients, or secure boot hashes. Once programmed, it cannot be erased or rewritten, providing hardware-rooted trust for secure boot chains and anti-counterfeiting measures.
Can S25FL512SAGMFI010 operate with a 1.8 V I/O supply while using 3.3 V core voltage?
Yes - VIO supports 1.65–3.6 V independently of VCC (2.7–3.6 V), enabling direct interface with 1.8 V microcontrollers or FPGAs without external level shifters. Signal thresholds and timing comply with SPI specifications across this full VIO range.
S25FL512SAGMFI010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL512SAGMFI010 FAQ
1.How can I place an order for S25FL512SAGMFI010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGMFI010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGMFI010 reliable?
The price and inventory of S25FL512SAGMFI010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGMFI010 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGMFI010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGMFI010 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGMFI010?
S25FL512SAGMFI010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGMFI010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGMFI010?
For technical support, including S25FL512SAGMFI010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGMFI010 requirements.
6.How does Aetrix verify that S25FL512SAGMFI010 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGMFI010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGMFI010 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGMFI010?
All S25FL512SAGMFI010 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGMFI010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGMFI010 part is unused and in its original packaging.
Return procedure for S25FL512SAGMFI010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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