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Infineon Technologies S25FL512SAGMFIG11
- Part No.:
- S25FL512SAGMFIG11
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL512SAGMFIG11.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:207
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Product details
Overview
S25FL512SAGMFIG11 from Infineon is a 512 Mb (64 MB) SPI Multi-I/O serial NOR flash memory with 3.0 V core supply, supporting Quad and DDR read modes up to 80 MHz (80 MBps), uniform 256-KB sector erase, and integrated hardware ECC. It operates across industrial (–40°C to +85°C) and automotive AEC-Q100 Grade 2 (–40°C to +105°C) temperature ranges and is used in boot code storage for microcontrollers in automotive infotainment systems.
For engineers reviewing the S25FL512SAGMFIG11 datasheet, S25FL512SAGMFIG11 pinout, S25FL512SAGMFIG11 application, or S25FL512SAGMFIG11 equivalent, key selection criteria include Quad/DDR read bandwidth, 256-KB uniform sector granularity, OTP-based secure boot configuration, AEC-Q100 Grade 2 qualification, and SO16/FBGA package compatibility with legacy S25FL-P designs.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling true single-bit ECC correction during program/erase without software overhead. Its command set supports extended 32-bit addressing and is footprint- and register-compatible with S25FL-A/K/P families, allowing drop-in migration in existing SPI flash interfaces.
The dual-voltage I/O architecture (VIO = 1.65–3.6 V, VCC = 2.7–3.6 V) enables interoperability with 1.8 V and 3.3 V host controllers. AutoBoot functionality executes preconfigured Normal or Quad Read at power-up or reset, reducing boot latency in safety-critical automotive ECUs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 512 Mb (64 MB) - supports full firmware images for mid-tier automotive MCUs |
| Read Bandwidth (Quad DDR) | 80 MBps at 80 MHz - enables sub-100 ms boot time for 8 MB application binaries |
| Erase Granularity | Uniform 256-KB sectors - simplifies wear leveling and OTA update partitioning |
| Endurance | 100,000 program-erase cycles - meets 15-year field life requirement for telematics modules |
| Data Retention | 20 years minimum at +85°C - validated for under-hood automotive deployment |
| Security | 1024-byte OTP array + ASP - stores immutable boot keys and enables password-locked sector protection |
| Temperature Range | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for engine control unit environments |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command latching; must be deasserted between commands to avoid bus contention |
| SCK | Serial Clock Input | Drives all timing for SDR/DDR operations; supports up to 133 MHz for Fast Read (SDR) and 80 MHz for DDR modes |
| SI / IO0 | Serial Input / I/O0 | Primary data input for standard SPI; functions as bidirectional I/O0 in Dual/Quad modes |
| SO / IO1 | Serial Output / I/O1 | Primary data output for standard SPI; functions as bidirectional I/O1 in Dual/Quad modes |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; doubles as Quad I/O2 when enabled |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing read without deselecting chip; doubles as Quad I/O3 when enabled |
| VCC | Core Supply | 2.7–3.6 V power for flash array and logic; decoupling required within 10 mm of pin |
| VIO | I/O Supply | 1.65–3.6 V independent I/O rail - allows interfacing with 1.8 V FPGAs or 3.3 V microcontrollers |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically initiates Normal or Quad Read from user-defined address on power-up/reset - eliminates external boot controller dependency |
| Hardware ECC | On-the-fly single-bit error correction with no CPU intervention - ensures data integrity in high-radiation automotive environments |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - prevents unauthorized firmware modification in OTA update scenarios |
| CFI & SFDP Support | JEDEC JESD216-compliant SFDP table and Common Flash Interface - enables automatic driver configuration in Linux and AUTOSAR OS |
| Multi-Voltage I/O | Independent VIO rail (1.65–3.6 V) - supports mixed-signal SoC integration without level shifters |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores calibrated engine maps, diagnostic routines, and bootloader in an AEC-Q100 Grade 2 ECU operating continuously at +105°C. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with AutoBoot and hardware ECC ensuring deterministic startup and runtime data integrity. Use Value: 20-year data retention and 100K-cycle endurance meet ISO 26262 ASIL-B requirements for safety-related firmware storage. | Use Scenario: Holds firmware, configuration tables, and HMI assets in modular industrial PLCs deployed in factory automation cabinets. IC Role / Device Role / Timing Role: High-reliability SPI flash providing fast Quad Read access to real-time task scheduler and I/O driver binaries. Use Value: Uniform 256-KB sectors simplify field firmware updates via RS-485 without erasing operational control logic. |
| Automotive Infotainment Head Unit | Medical Imaging Device Boot Memory |
Use Scenario: Stores Android Automotive OS kernel, HAL drivers, and UI assets in head units requiring <150 ms cold boot time. IC Role / Device Role / Timing Role: High-bandwidth Quad DDR flash delivering 80 MBps reads to reduce boot latency and improve user experience. Use Value: SO16 package enables direct PCB replacement of legacy S25FL-P devices without layout redesign. | Use Scenario: Hosts certified DICOM stack and FPGA configuration bitstreams in portable ultrasound systems with strict EMC and reliability mandates. IC Role / Device Role / Timing Role: Secure boot memory using 1024-byte OTP to store cryptographic keys and enforce signed firmware validation. Use Value: ASP and block protection prevent tampering with FDA-cleared imaging algorithms during service or upgrade. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGNFI010 | Same die, identical electrical specs, but SO16 package with different moisture sensitivity level (MSL3 vs MSL1) | Not qualified to AEC-Q100; limited to industrial temperature range only | Select when automotive qualification is not required and cost optimization is prioritized |
| Winbond W25Q512JWIM > 1000 | 512 Mb, 1.8 V I/O, QPI/DTR support, no DDR mode; lacks ASP and OTP security features | Targets consumer IoT gateways; not AEC-Q100 qualified | Select for low-power 1.8 V host systems where security and automotive compliance are non-critical |
Compared with S25FL512SAGNFI010 and W25Q512JWIM > 1000, the S25FL512SAGMFIG11 uniquely combines AEC-Q100 Grade 2 qualification, hardware ECC, ASP, and Quad DDR performance - making it the only option for safety-critical automotive boot memory requiring both speed and security.
Availability
S25FL512SAGMFIG11 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, and medical imaging device boot memory requiring stable component supply across extended temperature and long lifecycle programs.
Supply support for S25FL512SAGMFIG11 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure memory solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.
The S25FL-S family targets automotive and industrial applications demanding high reliability, security, and seamless migration from legacy SPI flash - designed specifically for AEC-Q100-compliant boot memory in ADAS, powertrain, and industrial control systems.
FAQ
What is the maximum clock frequency supported in Quad DDR mode?
The S25FL512SAGMFIG11 supports Quad DDR read operations at up to 80 MHz, delivering 80 MBps throughput. This is validated under VIO = VCC = 3.0–3.6 V conditions per the official Infineon datasheet Rev. *U. Operation above 80 MHz in DDR mode is not specified and may result in data corruption or timing violations.
Does this part support 32-bit addressing for accessing the full 512 Mb array?
Yes, the device implements extended 32-bit addressing via the 4-Byte Address Instruction (0xB7), enabling full access to all 64 MB of memory space. Legacy 3-byte addressing (0x03/0x0B) is also supported for backward compatibility with older host drivers.
How is the 1024-byte OTP array used in secure boot implementations?
The OTP array stores immutable values such as public key hashes, boot policy flags, and cryptographic seeds. Once programmed, it cannot be erased or rewritten. In secure boot flows, the ROM bootloader validates firmware signatures against OTP-stored keys before execution, preventing unauthorized code injection.
Is the SO16 package of S25FL512SAGMFIG11 pin-compatible with earlier S25FL-P series devices?
Yes - the SO16 pinout matches S25FL-P devices (e.g., S25FL256S), including identical CS#, SCK, IO0–IO3, RESET#, WP#, HOLD#, VCC, VIO, and VSS assignments. No PCB redesign is needed for migration, though voltage and timing margins should be re-verified per application conditions.
S25FL512SAGMFIG11 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL512SAGMFIG11 FAQ
1.How can I place an order for S25FL512SAGMFIG11 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGMFIG11 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGMFIG11 reliable?
The price and inventory of S25FL512SAGMFIG11 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGMFIG11 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGMFIG11?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGMFIG11 transactions.
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4.How is shipping managed for S25FL512SAGMFIG11?
S25FL512SAGMFIG11 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGMFIG11 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGMFIG11?
For technical support, including S25FL512SAGMFIG11 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGMFIG11 requirements.
6.How does Aetrix verify that S25FL512SAGMFIG11 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGMFIG11 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGMFIG11 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGMFIG11?
All S25FL512SAGMFIG11 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGMFIG11, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGMFIG11 part is unused and in its original packaging.
Return procedure for S25FL512SAGMFIG11:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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