My Inquiry
My Account
Infineon Technologies S25FL512SAGMFIR11
- Part No.:
- S25FL512SAGMFIR11
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL512SAGMFIR11.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,323
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL512SAGMFIR11 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sector erase architecture, Quad-Input Page Programming, and integrated hardware ECC. It supports Fast/Quad/DDR read modes up to 80 MHz (80 MBps Quad DDR), operates from –40°C to +105°C (Industrial Plus grade), and is used in boot code storage for embedded microcontrollers in industrial control systems.
For engineers reviewing the S25FL512SAGMFIR11 datasheet, S25FL512SAGMFIR11 pinout, S25FL512SAGMFIR11 application, or S25FL512SAGMFIR11 equivalent, key selection criteria include uniform sector size, Quad DDR read throughput, AEC-Q100 Grade 2 qualification, OTP security array, and compatibility with S25FL-P family footprints.
Technical Context
This FL-S series flash implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling single-bit error correction via on-die ECC logic and supporting both standard SPI (modes 0/3) and DDR command protocols. Its dual-voltage I/O (VIO = 1.65–3.6 V) allows interoperability with 1.8 V and 3.3 V host controllers without level shifters.
The device integrates AutoBoot functionality-configurable to execute Normal or Quad Read at power-up/reset-and supports Common Flash Interface (CFI) and JEDEC JESD216 SFDP for automatic configuration discovery. Sector protection is implemented via status register bits and Advanced Sector Protection (ASP) with password- or boot-code-controlled individual sector locking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images including bootloader, OS, and application binaries in resource-constrained edge devices. |
| Read Throughput | 80 MBps (Quad DDR @ 80 MHz) - enables fast code execution directly from flash (XIP) in real-time industrial controllers. |
| Erase Unit | Uniform 256-KB sectors - simplifies firmware update partitioning and eliminates need for wear-leveling software. |
| Endurance | 100,000 program-erase cycles - supports field firmware updates over 10+ years in deployed industrial gateways. |
| Data Retention | 20 years minimum - ensures long-term reliability of stored calibration data and configuration parameters without refresh. |
| Security | 1024-byte OTP array + ASP - allows permanent storage of cryptographic keys and per-sector write-lock enforcement via firmware commands. |
| Supply Range | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - supports mixed-voltage system integration with 1.8 V FPGAs or 3.3 V MCUs without external regulators. |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, industrial-plus temperature range (–40°C to +105°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command latching; must be asserted before SCK edge to initiate valid transaction. |
| SCK | Serial Clock Input | Drives all timing for command/address/data transfer; supports up to 133 MHz SDR or 80 MHz DDR operation. |
| SI / IO0 | Serial Input / I/O0 | Primary data input for commands and addresses; also functions as bidirectional I/O0 in Quad mode. |
| SO / IO1 | Serial Output / I/O1 | Primary data output during reads; also functions as bidirectional I/O1 in Dual/Quad modes. |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; doubles as I/O2 in Quad mode when WP# disabled. |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing read/write without deselecting chip; doubles as I/O3 in Quad mode when HOLD# disabled. |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that clears internal state and reinitializes flash controller to known condition. |
| VCC | Core Supply | 2.7–3.6 V power for memory array and control logic; decoupling capacitor required per datasheet layout guidelines. |
| VIO | I/O Supply | 1.65–3.6 V supply for all signal pins; independent of VCC, enabling voltage translation between host and flash. |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance connection to PCB ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Quad DDR Read Mode | Enables 80 MBps sustained read bandwidth using double-data-rate clocking on four I/O lines-critical for XIP performance in Cortex-M7/M33 applications. |
| AutoBoot Function | Configurable to launch Quad Read from fixed address at power-on, eliminating boot ROM dependency and reducing BOM count in cost-sensitive designs. |
| Integrated Hardware ECC | Automatic single-bit error correction during read operations without CPU intervention-reduces firmware overhead and improves system MTBF. |
| Advanced Sector Protection (ASP) | Per-sector lock controlled by password or boot code, preventing unauthorized firmware modification while allowing selective field updates. |
| JEDEC JESD216 SFDP Support | Self-describing parameter table accessible via standard SPI commands-enables automatic driver initialization without hard-coded timing or geometry assumptions. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware, configuration tables, and calibration data in programmable logic controllers operating in harsh factory environments. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory executing XIP code directly from Quad DDR interface at startup and runtime. Use Value: 256-KB uniform sectors simplify OTA update partitioning; 20-year retention ensures data integrity across extended maintenance cycles. | Use Scenario: Holding boot code and safety-critical sensor fusion algorithms in radar/EPS ECUs certified to ISO 26262 ASIL-B. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified SPI flash providing deterministic boot latency and secure OTP key storage. Use Value: Integrated ECC and ASP prevent bit-flip-induced corruption and unauthorized reprogramming-meeting functional safety requirements. |
| Medical Imaging System Configuration | Smart Grid Communication Module |
Use Scenario: Storing DICOM protocol stacks, image processing profiles, and regulatory compliance logs in portable ultrasound devices. IC Role / Device Role / Timing Role: High-reliability serial flash with 100K endurance supporting frequent calibration updates and audit trail writes. Use Value: 1024-byte OTP securely stores device-specific encryption keys; uniform erase avoids fragmentation in cyclic logging. | Use Scenario: Hosting firmware and communication stack (DLMS/COSEM) in ANSI C12.18-compatible smart meters deployed in utility substations. IC Role / Device Role / Timing Role: Industrial-plus temperature-rated flash interfacing with ARM Cortex-A53 SoC via Quad SPI bus. Use Value: Dual-voltage I/O (1.8 V/3.3 V) eliminates level shifters; CFI/SFDP support enables plug-and-play driver compatibility across meter generations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SDSMFIR10 | Same die, identical electrical specs, but SOIC package with different moisture sensitivity level (MSL3 vs MSL1) and no AEC-Q100 qualification. | Limited to commercial/industrial use; unsuitable for automotive or safety-critical deployments requiring Grade 2 validation. | Select only if automotive qualification and extended temperature operation are not required. |
| Winbond W25Q512JWIM > 16 | 512 Mb density, 1.8 V I/O only (no 3.3 V VIO), lacks DDR mode and hardware ECC; uses 4-byte addressing by default. | Requires host-side ECC implementation and external level shifting for 3.3 V systems; lower max read speed (40 MBps Quad). | Choose only for cost-sensitive 1.8 V-only designs where DDR and ECC are not needed. |
Compared with S25FL512SDSMFIR10 and W25Q512JWIM > 16, the S25FL512SAGMFIR11 uniquely combines AEC-Q100 Grade 2 qualification, Quad DDR throughput, on-die ECC, and dual-voltage I/O-making it the only option qualified for safety-critical automotive boot and industrial edge AI inference firmware storage.
Availability
S25FL512SAGMFIR11 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging subsystems, and smart grid communication modules requiring stable component supply across extended product lifecycles.
Supply support for S25FL512SAGMFIR11 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The FL-S flash product line targets high-reliability embedded systems requiring fast, secure, and long-life nonvolatile storage-specifically designed for boot code, firmware, and configuration data in automotive, industrial, and medical applications.
FAQ
What is the maximum clock frequency supported in Quad DDR mode?
The S25FL512SAGMFIR11 supports Quad DDR operation at up to 80 MHz, delivering 80 MBps effective read throughput. This is validated under VIO = VCC = 3.0–3.6 V conditions per datasheet Rev. *U section 3. Performance summary. Operation above 80 MHz in DDR mode is not specified and may result in timing violations or data corruption.
Does this part require external hardware ECC circuitry?
No. The S25FL512SAGMFIR11 includes fully integrated hardware ECC logic that automatically detects and corrects single-bit errors during read operations. No external circuitry or firmware intervention is required-correction occurs transparently within the flash controller before data is presented on the I/O lines.
Can the AutoBoot address be changed after programming?
Yes. The AutoBoot start address is stored in a dedicated configuration register (CR3[7:0]) and can be modified using the Write Status Register command (01h) after issuing Write Enable (06h). Changes persist across power cycles and do not require OTP programming or device reset to take effect.
Is the SOIC package RoHS-compliant and lead-free?
Yes. The S25FL512SAGMFIR11 in 16-pin SOIC (300 mil) packaging is Pb-free and RoHS-compliant, as confirmed in the "Packages (all Pb-free)" section of the datasheet (page 3). It meets JEDEC J-STD-020 moisture sensitivity level 1 (MSL1), allowing unlimited floor life at ≤30°C/60% RH.
S25FL512SAGMFIR11 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL512SAGMFIR11 FAQ
1.How can I place an order for S25FL512SAGMFIR11 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGMFIR11 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGMFIR11 reliable?
The price and inventory of S25FL512SAGMFIR11 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGMFIR11 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGMFIR11?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGMFIR11 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGMFIR11?
S25FL512SAGMFIR11 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGMFIR11 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGMFIR11?
For technical support, including S25FL512SAGMFIR11 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGMFIR11 requirements.
6.How does Aetrix verify that S25FL512SAGMFIR11 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGMFIR11 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGMFIR11 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGMFIR11?
All S25FL512SAGMFIR11 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGMFIR11, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGMFIR11 part is unused and in its original packaging.
Return procedure for S25FL512SAGMFIR11:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL512SAGMFIR11 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
