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Infineon Technologies S25FL512SAGMFMG13
- Part No.:
- S25FL512SAGMFMG13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL512SAGMFMG13.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:1,087
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Product details
Overview
S25FL512SAGMFMG13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC for single-bit error correction. It operates across industrial temperature range (–40°C to +85°C) in SO16 package and supports AutoBoot, CFI, and JEDEC SFDP.
For engineers reviewing the S25FL512SAGMFMG13 datasheet, S25FL512SAGMFMG13 pinout, S25FL512SAGMFMG13 application, or S25FL512SAGMFMG13 equivalent, key selection criteria include Quad/DDR read performance, 100K program-erase endurance, OTP-based security, sector protection granularity, and compatibility with legacy S25FL-A/K/P families.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing and low-power operation. Its dual-voltage I/O (VIO = 1.65–3.6 V) decouples interface signaling from core logic, supporting mixed-voltage host systems while maintaining full command set compatibility.
The control logic integrates dedicated state machines for AutoBoot execution, Quad-Input Page Programming (QPP), and Advanced Sector Protection (ASP) with password- or boot-code–controlled individual sector locking. All erase operations are uniform 256-KB sectors with no block or bank restrictions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for firmware images, boot code, and configuration data in resource-constrained embedded hosts |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables fast application loading without external parallel bus overhead |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and eliminates partial-block erase complexity |
| Endurance | 100,000 program-erase cycles - supports field-updatable firmware in industrial controllers and gateways |
| Data Retention | 20 years minimum - ensures long-term reliability in unattended infrastructure equipment |
| ECC | Internal hardware single-bit correction - eliminates need for software ECC layer in host MCU |
| Security | 1024-byte OTP + ASP + status register block protection - enables secure boot key storage and immutable configuration lockdown |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, industrial temperature grade (–40°C to +85°C).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command/address/data transfer; must be asserted before each command sequence |
| SCK | Serial Clock Input | Drives all synchronous operations; supports modes 0 and 3, up to 133 MHz SDR or 80 MHz DDR |
| SI / IO0 | Serial Input / I/O0 | Primary data input for commands and addresses; functions as bidirectional I/O0 in Multi-I/O mode |
| SO / IO1 | Serial Output / I/O1 | Primary data output during reads; functions as bidirectional I/O1 in Dual/Quad modes |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; doubles as I/O2 in Quad mode |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing transfer without deselecting device; doubles as I/O3 in Quad mode |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; independent of I/O voltage rail |
| VIO | I/O Supply | 1.65–3.6 V configurable rail for interface signaling-enables interoperability with 1.8 V or 3.3 V hosts |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically initiates Normal or Quad Read from preconfigured address on power-up/reset-reduces boot latency and host initialization code |
| Quad-Input Page Programming (QPP) | Enables efficient programming under slow clock conditions by using all four I/O lines for input-improves throughput where host clock is constrained |
| Common Flash Interface (CFI) | Provides standardized register-based identification and configuration data-simplifies driver portability across flash vendors |
| JEDEC JESD216 SFDP Support | Exposes parameter tables via standard serial flash discovery protocol-enables automatic host configuration without hard-coded timing values |
| Advanced Sector Protection (ASP) | Allows password- or boot-ROM–based locking of individual 256-KB sectors-supports hierarchical firmware partitioning and secure update zones |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing real-time control firmware and configuration parameters in programmable logic controllers with frequent field updates. IC Role / Device Role / Timing Role: Primary nonvolatile code storage with deterministic Quad Read access and AutoBoot execution at system startup. Use Value: 100K endurance and 20-year retention ensure reliable operation over 15+ year product lifecycles without replacement. | Use Scenario: Hosting boot code and safety-critical calibration data for camera and radar ECUs requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Secure boot memory with OTP key storage and ASP-enabled sector lockdown for ASIL-B compliant firmware partitions. Use Value: Hardware ECC and uniform sector erase simplify functional safety certification by eliminating soft-error accumulation and unpredictable erase latency. |
| Medical Imaging System Configuration | Smart Grid Communication Gateway |
Use Scenario: Holding FPGA bitstreams, sensor calibration tables, and regulatory-compliant audit logs in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: High-reliability configuration store with CFI/SFDP support for plug-and-play driver integration across multiple OEM platforms. Use Value: Dual-voltage I/O (1.65–3.6 V) allows direct interfacing with both 1.8 V FPGAs and 3.3 V microcontrollers without level shifters. | Use Scenario: Storing protocol stacks (DLMS/COSEM, IEC 61850), encryption keys, and firmware images in utility-grade IoT gateways deployed in harsh outdoor environments. IC Role / Device Role / Timing Role: Field-upgradable firmware repository with hardware write protection and sector-level ASP for secure OTA updates. Use Value: 256-KB uniform sectors align precisely with typical OTA packet sizes, minimizing partial-sector writes and maximizing update atomicity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGNFMG13 | Same die, identical electrical specs, but in 24-ball FAB024 BGA package instead of SO16 | Requires PCB redesign for BGA footprint; better thermal dissipation and higher density routing in space-constrained modules | Select when board layout prioritizes miniaturization over through-hole assembly or rework accessibility |
| Winbond W25Q512JVSIM | 512 Mb SPI NOR with Quad/Dual/DDR support, but no AutoBoot, no ASP, and only 10K endurance rating | Lacks secure boot and sector-level protection; suitable for cost-sensitive consumer devices without safety or longevity requirements | Select only for non-critical firmware storage where 10K cycles and absence of OTP/ASP are acceptable trade-offs |
Compared with S25FL512SAGNFMG13, the BGA variant offers identical functionality in compact packaging, while Winbond W25Q512JVSIM trades security, endurance, and boot automation for lower unit cost-making it unsuitable for industrial or automotive use cases demanding long-term reliability and secure boot integrity.
Availability
S25FL512SAGMFMG13 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging subsystems, and smart grid gateways requiring stable component supply, long-life availability, and AEC-Q100–qualified flash memory.
Supply support for S25FL512SAGMFMG13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and memory solutions for industrial, automotive, and IoT applications.
The S25FL-S family targets high-reliability embedded systems requiring deterministic boot behavior, secure firmware storage, and long-term data integrity-designed specifically for mission-critical firmware and configuration storage in harsh environments.
FAQ
What is the maximum clock frequency supported in DDR mode?
The S25FL512SAGMFMG13 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency, delivering 20 MBps, 40 MBps, and 80 MBps respectively-achievable only when both VIO and VCC are set to 3.0–3.6 V per datasheet specifications.
Does this part support hardware reset via the RESET# pin?
Yes, the RESET# pin provides asynchronous hardware reset functionality. When asserted low, it terminates all ongoing operations, clears internal state machines, and returns the device to standby mode-required for safe recovery after power brownouts or communication errors.
How is the 1024-byte OTP array accessed and protected?
The OTP array is accessed exclusively via dedicated One-Time-Program commands (0x4B and 0x42). Once programmed, bits cannot be erased. Protection is enforced by status register lock bits and requires Write Enable before any OTP operation-preventing accidental overwrite during normal firmware updates.
Can the device operate with VIO = 1.8 V while VCC = 3.3 V?
Yes, the device supports split-rail operation: VIO may be independently set between 1.65 V and 2.7 V (e.g., 1.8 V) while VCC remains within 2.7–3.6 V (e.g., 3.3 V). This enables direct interfacing with 1.8 V FPGAs or ASICs without external level shifters, as confirmed in Section 4.3 of the datasheet.
S25FL512SAGMFMG13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL512SAGMFMG13 FAQ
1.How can I place an order for S25FL512SAGMFMG13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SAGMFMG13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SAGMFMG13 reliable?
The price and inventory of S25FL512SAGMFMG13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGMFMG13 is usually 5 days.
3.What payment methods are accepted for S25FL512SAGMFMG13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGMFMG13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SAGMFMG13?
S25FL512SAGMFMG13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SAGMFMG13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SAGMFMG13?
For technical support, including S25FL512SAGMFMG13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGMFMG13 requirements.
6.How does Aetrix verify that S25FL512SAGMFMG13 is sourced from the original manufacturer or authorized distributors?
All S25FL512SAGMFMG13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGMFMG13 meets industry standards.
7.What is the process for return or replacement of S25FL512SAGMFMG13?
All S25FL512SAGMFMG13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGMFMG13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SAGMFMG13 part is unused and in its original packaging.
Return procedure for S25FL512SAGMFMG13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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