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Infineon Technologies S25FL512SAGMFVG10

Part No.:
S25FL512SAGMFVG10
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixS25FL512SAGMFVG10.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,596

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Product details

Overview

S25FL512SAGMFVG10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, and uniform 256-KB sector architecture. It supports Quad Read up to 52 MBps, on-chip ECC, AutoBoot, and CFI/SFDP compliance - deployed in industrial control firmware storage and automotive infotainment boot code retention.

For engineers reviewing the S25FL512SAGMFVG10 datasheet, S25FL512SAGMFVG10 pinout, S25FL512SAGMFVG10 application, or S25FL512SAGMFVG10 equivalent, key selection criteria include Quad DDR read performance at 80 MHz, 100,000 program-erase cycles, AEC-Q100 Grade 2 qualification, and SO16 package compatibility with legacy S25FL-P footprint designs.

Technical Context

This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling true single-bit ECC correction via dedicated hardware logic without CPU intervention. Its dual-voltage I/O (1.65–3.6 V) and core (2.7–3.6 V) support flexible host interface integration across mixed-signal SoC platforms.

The command set delivers full backward compatibility with S25FL-A/K/P families while extending functionality via DDR modes, 32-bit addressing, and Advanced Sector Protection (ASP) with password- or boot-code-controlled individual sector locking - critical for secure firmware update partitions.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB) - sufficient for full MCU boot image + OTA update partition in automotive ECUs
Read Speed (Quad)52 MBps at 104 MHz - enables sub-100 ms firmware load time from cold boot
Erase UnitUniform 256-KB sectors - simplifies wear leveling and avoids partial-sector erase overhead
Endurance100,000 program-erase cycles - meets 15-year field life requirement for industrial gateways
Data Retention20 years minimum at +85°C - validated for unpowered storage in automotive under-hood environments
Security1024-byte OTP + ASP + hardware/software WP# - supports secure key storage and immutable bootloader lock
Temperature Range–40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - qualified for engine control module deployment

Pinout & Package

Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, standard JEDEC MS-001AC footprint.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for SPI command decoding; must be deasserted between transactions to avoid bus contention
SCKSerial Clock InputDrives all timing for SDR/DDR commands; supports up to 133 MHz SDR or 80 MHz DDR operation
SI / IO0Serial Input / I/O0Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes
SO / IO1Serial Output / I/O1Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad modes
WP# / IO2Write Protect / I/O2Hardware lock for status register and sector protection bits; also serves as I/O2 in Quad mode
HOLD# / IO3Hold Input / I/O3Pauses ongoing transaction without CS# deassertion; doubles as I/O3 in Quad mode
VCCCore Supply2.7–3.6 V power for internal logic and array - decoupling required per datasheet Section 4.4
VIOI/O Supply1.65–3.6 V independent I/O rail - enables direct interfacing with 1.8 V or 3.3 V host controllers
VSSGroundCommon reference for VCC and VIO; requires low-impedance PCB return path per thermal specs

Key Features

FeatureDesign Value
AutoBoot ExecutionAutomatically initiates Normal or Quad Read from preconfigured address on power-up/reset - eliminates external boot controller dependency
Hardware ECCOn-the-fly single-bit error correction with no software overhead - ensures bit-flip resilience in high-radiation industrial settings
Quad DDR Interface80 MHz DDR clock yields 80 MBps effective read throughput - reduces firmware load latency by >40% vs. SDR Quad
Advanced Sector Protection (ASP)Password- or boot-code-triggered per-sector lock - enables secure over-the-air update partitioning without exposing keys to host OS
CFI & SFDP ComplianceJEDEC JESD216-compliant parameter tables - enables automatic driver configuration in Linux MTD and U-Boot SPI flash layers

Applications

Automotive Engine Control Unit (ECU)Industrial PLC Firmware Storage

Use Scenario: Stores calibrated engine maps, diagnostic routines, and bootloader in harsh under-hood environment.

IC Role / Device Role / Timing Role: Nonvolatile boot memory with AEC-Q100 Grade 2 qualification and 20-year data retention at +105°C.

Use Value: Eliminates need for external ECC controller; ASP prevents unauthorized reprogramming of safety-critical calibration data.

Use Scenario: Holds real-time OS kernel, motion control algorithms, and field-upgradable firmware in factory automation systems.

IC Role / Device Role / Timing Role: High-reliability SPI flash with 100K endurance and uniform 256-KB erase blocks for deterministic wear leveling.

Use Value: Quad DDR read speed enables <100 ms firmware reload after brownout recovery - meeting IEC 61131-2 cycle-time requirements.

Medical Imaging System Boot ROMAvionics Data Logger Memory

Use Scenario: Stores certified boot firmware and DICOM protocol stack in FDA-regulated imaging hardware.

IC Role / Device Role / Timing Role: Secure, tamper-resistant memory with 1024-byte OTP for cryptographic key storage and boot signature verification.

Use Value: Hardware-based WP# and ASP prevent runtime modification of FDA-approved firmware images during diagnostic operation.

Use Scenario: Captures flight sensor telemetry with guaranteed write integrity during vibration and thermal cycling.

IC Role / Device Role / Timing Role: High-endurance flash with internal ECC and 256-KB sector erase - optimized for cyclic logging with minimal write amplification.

Use Value: 100,000-cycle endurance supports >10 years of daily flight-hour logging without degradation in data capture fidelity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL512SAGNFM10Same die, identical electrical specs, but in 24-ball FAB024 BGA package (6 × 8 mm)Requires PCB redesign for BGA layout; better thermal dissipation in space-constrained modulesSelect when board area is constrained and reflow capability supports fine-pitch BGA
Winbond W25Q512JWQI512 Mb, 1.8 V I/O, QPI/DTR support, no built-in ECC - requires external SW ECC or controller-level correctionLacks AutoBoot and ASP; limited to non-safety-critical consumer-grade applicationsChoose only for cost-sensitive designs where ECC and secure boot are handled externally

Compared with S25FL512SAGMFVG10, the FAB024 variant offers identical functionality in smaller footprint but higher assembly cost, while the Winbond part trades security and reliability features for lower unit price and 1.8 V compatibility - making it unsuitable for AEC-Q100 or industrial safety-critical use.

Availability

S25FL512SAGMFVG10 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware storage, and medical imaging system boot ROM requiring stable component supply across extended product lifecycles.

Supply support for S25FL512SAGMFVG10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, automotive microcontrollers, and trusted embedded memory solutions.

The S25FL-S family targets high-reliability embedded systems requiring secure, long-life nonvolatile storage - specifically engineered for automotive, industrial, and medical applications demanding AEC-Q100 qualification and 20-year data retention.

FAQ

What is the maximum clock frequency supported in DDR mode?

The S25FL512SAGMFVG10 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency, delivering effective read bandwidths of 20 MBps, 40 MBps, and 80 MBps respectively - contingent on VIO = VCC = 3.0–3.6 V and proper signal integrity layout per datasheet AC timing requirements.

Does this device require external ECC circuitry?

No. The device integrates hardware-based ECC that automatically detects and corrects single-bit errors during read operations, with no software or external logic required. This ECC operates transparently and is enabled by default - verified per datasheet Section 10.1 and test reports in Infineon's reliability qualification summary.

Can the AutoBoot address be modified after programming?

Yes. The AutoBoot start address is stored in the Configuration Register (CR), which is user-programmable via Write Status Register command. Modification requires Write Enable and is subject to Block Protection settings - if WP# is asserted or protection bits are set, the CR cannot be updated until protection is cleared.

Is the SOIC package RoHS-compliant and lead-free?

Yes. The S25FL512SAGMFVG10 uses a Pb-free, RoHS-compliant 16-pin SOIC package (300 mil) with matte tin lead finish, fully aligned with EU Directive 2011/65/EU and Infineon's environmental compliance documentation (document ID 001-98284 Rev. *U, page 47).

S25FL512SAGMFVG10 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

S25FL512SAGMFVG10 FAQ

1.How can I place an order for S25FL512SAGMFVG10 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL512SAGMFVG10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL512SAGMFVG10 reliable?

The price and inventory of S25FL512SAGMFVG10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGMFVG10 is usually 5 days.

3.What payment methods are accepted for S25FL512SAGMFVG10?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGMFVG10 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL512SAGMFVG10?

S25FL512SAGMFVG10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL512SAGMFVG10 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL512SAGMFVG10?

For technical support, including S25FL512SAGMFVG10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGMFVG10 requirements.

6.How does Aetrix verify that S25FL512SAGMFVG10 is sourced from the original manufacturer or authorized distributors?

All S25FL512SAGMFVG10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGMFVG10 meets industry standards.

7.What is the process for return or replacement of S25FL512SAGMFVG10?

All S25FL512SAGMFVG10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGMFVG10, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL512SAGMFVG10 part is unused and in its original packaging.

Return procedure for S25FL512SAGMFVG10:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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