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Infineon Technologies S25FL512SAGMFVR13

Part No.:
S25FL512SAGMFVR13
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
16-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixS25FL512SAGMFVR13.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 16SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,841

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Product details

Overview

S25FL512SAGMFVR13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad-Input Page Programming, and integrated hardware ECC. It supports Fast/Quad/DDR read modes up to 80 MHz DDR clock (80 MBps Quad Read DDR), operates from –40°C to +105°C (Industrial Plus), and is packaged in 16-pin SOIC (300 mil).

For engineers reviewing the S25FL512SAGMFVR13 datasheet, S25FL512SAGMFVR13 pinout, S25FL512SAGMFVR13 application, or S25FL512SAGMFVR13 equivalent, key selection criteria include SPI Multi-I/O timing compatibility with S25FL-P family, AutoBoot address configuration, OTP security array size, sector protection granularity, and AEC-Q100 Grade 2 qualification for automotive use.

Technical Context

This FL-S series flash implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling single-bit error correction via on-die ECC logic and supporting both standard SPI (modes 0/3) and DDR command protocols. The device uses a 32-bit extended addressing scheme and maintains CFI and JEDEC JESD216 SFDP compliance for standardized configuration discovery.

Its dual-supply design separates core (VCC: 2.7–3.6 V) and I/O (VIO: 1.65–3.6 V) rails, allowing interoperability with 1.8 V or 3.3 V host controllers. The control logic integrates dedicated registers for Advanced Sector Protection (ASP), block-level write/erase lock, and programmable AutoBoot execution at power-up or reset.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB) - supports firmware images, boot code, and configuration data for mid-to-high-end embedded systems.
Read Speed (Quad DDR)80 MBps at 80 MHz DDR clock - enables fast application loading in real-time OS boot sequences.
Page Programming Rate1500 KBps - achieves full 512-byte page writes in ≤340 µs, reducing firmware update latency.
Sector Erase SizeUniform 256 KB sectors - simplifies partitioning for OTA updates and secure boot regions without variable erase overhead.
Cycling Endurance100,000 program-erase cycles - meets long-life requirements for industrial logging and automotive ECU reprogramming.
Data Retention20 years minimum - ensures reliability across product lifecycles without refresh mechanisms.
Operating Temp–40°C to +105°C (Industrial Plus) - qualified for under-hood automotive and high-ambient industrial environments.

Pinout & Package

Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, with standard footprint compatible with legacy S25FL-A/K/P families.

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction.
SCKSerial Clock InputDrives all timing for SDR (up to 133 MHz) and DDR (up to 80 MHz) modes; phase/polarity configurable per SPI mode 0/3.
SI / IO0Serial Input / I/O0Primary data input for commands and addresses in single-line mode; functions as bidirectional I/O0 in Dual/Quad modes.
SO / IO1Serial Output / I/O1Primary data output during reads; functions as bidirectional I/O1 in Dual/Quad modes; supports tri-state when CS# deasserted.
WP# / IO2Write Protect / I/O2Hardware lock for status register and sector protection bits; doubles as I/O2 in Quad mode for parallel data transfer.
HOLD# / IO3Hold Input / I/O3Suspends ongoing SPI transaction without resetting internal state; repurposed as I/O3 in Quad mode.
VCCCore Supply2.7–3.6 V power for memory array and control logic; independent of I/O voltage for mixed-voltage system interfacing.
VIOI/O Supply1.65–3.6 V rail for all signal pins; enables direct connection to 1.8 V microcontrollers without level shifters.

Key Features

FeatureDesign Value
AutoBoot ExecutionConfigurable Normal or Quad Read at power-up/reset from preselected address - eliminates external boot controller dependency in space-constrained designs.
Integrated Hardware ECCOn-die single-bit error correction with automatic generation - removes need for software ECC overhead and improves system MTBF.
Advanced Sector Protection (ASP)Password- or boot-code-controlled individual sector locking - enables fine-grained firmware partitioning for secure OTA updates.
OTP Array1024-byte one-time-programmable region - stores cryptographic keys, calibration data, or device-specific identifiers with permanent write-lock capability.
Extended Addressing32-bit address support - required for full 512 Mb address space access beyond 24-bit legacy SPI limits.

Applications

Automotive ADAS ECUsIndustrial PLC Firmware Storage

Use Scenario: Storing radar processing firmware and calibration tables in front-camera modules requiring AEC-Q100 Grade 2 qualification.

IC Role / Device Role / Timing Role: Primary nonvolatile storage for boot code and runtime firmware; executes AutoBoot at power-on to load DSP binaries within <50 ms.

Use Value: 256 KB uniform sectors allow atomic OTA patching of safety-critical modules without erasing unrelated partitions.

Use Scenario: Holding ladder logic programs and I/O mapping configurations in modular PLC backplanes operating continuously at 85°C ambient.

IC Role / Device Role / Timing Role: High-reliability firmware repository with 20-year data retention and 100K cycle endurance for field-upgradable logic engines.

Use Value: Dual-supply (VCC/VIO) operation enables direct interface with 1.8 V FPGA configuration managers without level-shifting components.

Medical Imaging Boot Memory5G Small Cell Baseband Storage

Use Scenario: Secure boot image storage in portable ultrasound devices where tamper resistance and long-term data integrity are FDA-regulated.

IC Role / Device Role / Timing Role: Trusted execution root using OTP-stored public keys and ASP-protected bootloader sectors.

Use Value: Hardware ECC and 1024-byte OTP eliminate software-based crypto key management, reducing BOM cost and certification effort.

Use Scenario: Loading FPGA bitstreams and protocol stacks in outdoor 5G small cells exposed to thermal cycling and vibration.

IC Role / Device Role / Timing Role: High-speed Quad DDR read (80 MBps) source for baseband processor initialization under tight boot-time budgets.

Use Value: SOIC package provides mechanical robustness and solder-joint reliability superior to BGA in thermally stressed RF enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL512SAGNFM101Same die, identical electrical specs, but in 24-ball FAB024 BGA package (6 × 8 mm) instead of SOIC.Requires PCB redesign for BGA layout and reflow profile; better for space-constrained, high-density boards.Select when board area is constrained and thermal performance justifies BGA assembly complexity.
Winbond W25Q512JWIM > 512Mb512 Mb density, 1.8 V I/O only (no VIO flexibility), no AutoBoot, no ASP, and 64 KB sector granularity (not 256 KB).Lacks automotive qualification and advanced protection features; suited for cost-sensitive consumer IoT, not safety-critical systems.Choose only for non-automotive, non-industrial applications where 64 KB erase granularity and absence of OTP/ASP are acceptable.

Compared with S25FL512SAGMFVR13, the FAB024 BGA variant offers identical functionality in smaller footprint but higher assembly cost, while the Winbond alternative trades critical automotive/security features for lower unit price and simpler integration in less demanding environments.

Availability

S25FL512SAGMFVR13 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLC firmware storage, and medical imaging boot memory requiring stable component supply, long-lifecycle assurance, and AEC-Q100 Grade 2 qualification.

Supply support for S25FL512SAGMFVR13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor leader specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.

The FL-S Flash product line delivers high-performance, secure, and automotive-qualified serial NOR flash targeting boot code storage, firmware updates, and configuration data in safety-critical embedded systems.

FAQ

What is the maximum supported clock frequency for Quad Read DDR mode?

The S25FL512SAGMFVR13 supports Quad Read DDR at up to 80 MHz clock frequency, delivering 80 MBps effective throughput when VIO = VCC = 3.0–3.6 V. This is confirmed in the Performance Summary table (Datasheet Rev. *U, page 3) and requires proper DDR timing setup including tDQSH and tDQSL parameters per AC specifications section.

Does this part support hardware write protection independent of software commands?

Yes - WP# pin provides hardware-level write protection for status register bits and sector protection registers. When WP# is held low, it prevents modification of BP bits and SRWD, regardless of software command issuance. This behavior is defined in Section 2.8 and Section 8.3 of the datasheet and remains active across power cycles.

Can the AutoBoot feature execute from any address in the memory array?

No - AutoBoot is configurable only to launch a Normal or Quad Read command from one of four predefined addresses: 0x000000, 0x000001, 0x000002, or 0x000003. These addresses are selected via STATUS REGISTER bits [11:10] (BOOT_ADD[1:0]) and cannot be programmed to arbitrary locations.

Is the 1024-byte OTP array permanently locked after programming?

Yes - once any byte in the 1024-byte OTP array is written, the entire array becomes permanently read-only. There is no provision for erasure or reprogramming. This irreversible behavior is enforced by on-die fuses and documented in Section 8.1 and Section 9.7 of the datasheet.

S25FL512SAGMFVR13 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
16-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-SOIC

S25FL512SAGMFVR13 FAQ

1.How can I place an order for S25FL512SAGMFVR13 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL512SAGMFVR13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL512SAGMFVR13 reliable?

The price and inventory of S25FL512SAGMFVR13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SAGMFVR13 is usually 5 days.

3.What payment methods are accepted for S25FL512SAGMFVR13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SAGMFVR13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL512SAGMFVR13?

S25FL512SAGMFVR13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL512SAGMFVR13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL512SAGMFVR13?

For technical support, including S25FL512SAGMFVR13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SAGMFVR13 requirements.

6.How does Aetrix verify that S25FL512SAGMFVR13 is sourced from the original manufacturer or authorized distributors?

All S25FL512SAGMFVR13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SAGMFVR13 meets industry standards.

7.What is the process for return or replacement of S25FL512SAGMFVR13?

All S25FL512SAGMFVR13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SAGMFVR13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL512SAGMFVR13 part is unused and in its original packaging.

Return procedure for S25FL512SAGMFVR13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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