Infineon Technologies S25FL512SDPBHB213
- Part No.:
- S25FL512SDPBHB213
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SDPBHB213.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,092
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Product details
Overview
S25FL512SDPBHB213 from Infineon is a 512 Mb (64 MB) SPI Multi-I/O serial NOR flash memory with 3.0 V core supply, supporting Quad and DDR read modes up to 80 MHz, uniform 256-KB sector erase, and integrated hardware ECC. It operates across industrial and automotive temperature ranges (–40°C to +105°C), and is commonly used for firmware storage in embedded controllers and boot code execution in industrial gateways.
For engineers reviewing the S25FL512SDPBHB213 datasheet, S25FL512SDPBHB213 pinout, S25FL512SDPBHB213 application, or S25FL512SDPBHB213 equivalent, key selection criteria include Quad/DDR read throughput (up to 80 MBps), 100,000 program-erase cycles, OTP security features, AEC-Q100 Grade 2 qualification, and SO16 package compatibility with legacy S25FL-P designs.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing and low-latency command execution. Its dual-voltage I/O interface (VIO = 1.65–3.6 V, VCC = 2.7–3.6 V) supports mixed-signal SoC integration while maintaining backward compatibility with S25FL-A/K/P families via identical command sets and footprint.
The logic block diagram confirms dedicated control paths for AutoBoot, CFI register access, and OTP array management. Internal hardware ECC performs single-bit correction on-the-fly during read operations, and Advanced Sector Protection allows password- or boot-code-controlled individual sector locking-critical for secure firmware updates in automotive ECUs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images including bootloader, OS, and application binaries in resource-constrained edge devices. |
| Read Throughput (Quad DDR) | 80 MBps at 80 MHz - enables sub-100 ms firmware load times for real-time boot sequences. |
| Erase Unit | Uniform 256-KB sectors - simplifies partitioning and wear-leveling algorithms in host firmware. |
| Endurance | 100,000 program-erase cycles - supports field-upgradable systems requiring frequent OTA updates over 10+ years. |
| Data Retention | 20 years minimum - ensures long-term reliability without refresh in unpowered storage applications. |
| Security | 1024-byte OTP + ASP + Block Protection - provides immutable root-of-trust storage and fine-grained write lock control. |
| Temperature Range | –40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - qualified for under-hood automotive and industrial control environments. |
| Supply Voltages | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - enables direct interfacing with 1.8 V or 3.3 V host processors without level shifters. |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, body size 10.16 × 7.49 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate valid transaction. |
| SCK | Serial Clock Input | Master-generated clock; supports SDR (up to 133 MHz) and DDR (up to 80 MHz) modes with configurable polarity/phase. |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes for command/address/data transfer. |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; serves as bidirectional I/O1 in Dual/Quad modes for parallel data lanes. |
| WP# / IO2 | Write Protect Input / I/O2 | Hardware lock for status register and sector protection bits; doubles as I/O2 in Quad mode for expanded bus width. |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing transaction without deselecting device; repurposed as I/O3 in Quad mode for full 4-lane data transfer. |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; decoupling required within 10 mm of pin per datasheet layout guidelines. |
| VIO | I/O Supply | 1.65–3.6 V supply for all I/O pins; independent of VCC, enabling voltage translation between host and flash. |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance connection to PCB ground plane. |
| RESET# | Reset Input | Asynchronous active-low reset that clears internal state and reinitializes command parser and status registers. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically initiates Normal or Quad Read from preconfigured address on power-up or reset-eliminates host CPU polling and reduces boot latency by ~15 ms. |
| Hardware ECC | On-the-fly single-bit error correction using internal logic-no software overhead or external syndrome calculation required. |
| Extended Addressing | 32-bit addressing support-enables full 512 Mb address space access without bank switching or address remapping. |
| Common Flash Interface (CFI) | Standardized JEDEC-compliant configuration data structure-allows runtime detection of density, timings, and protection settings by host bootloader. |
| Advanced Sector Protection (ASP) | Password- or boot-code-triggered per-sector lock-prevents unauthorized firmware modification while permitting selective update of non-critical partitions. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware, configuration tables, and calibration data in programmable logic controllers deployed in factory automation environments. IC Role / Device Role / Timing Role: Nonvolatile boot memory providing deterministic <100 ms cold-start time with AutoBoot and Quad Read. Use Value: Uniform 256-KB sectors simplify firmware partitioning; 20-year retention ensures data integrity across equipment lifecycle without maintenance. | Use Scenario: Hosting boot code and safety-critical sensor fusion firmware in camera/radar ECUs operating under hood conditions. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified SPI flash serving as primary boot source with hardware ECC and ASP for ASIL-B compliance. Use Value: Integrated ECC eliminates need for external error-checking logic; OTP stores cryptographic keys for secure boot verification. |
| Medical Imaging System Configuration | Smart Energy Meter Firmware |
Use Scenario: Holding FPGA configuration bitstreams and calibration profiles in portable ultrasound and X-ray imaging devices. IC Role / Device Role / Timing Role: High-reliability serial flash with 100,000-cycle endurance supporting frequent field calibration updates. Use Value: Dual-voltage I/O (1.8 V host compatible) reduces BOM count; SO16 package fits legacy board layouts without redesign. | Use Scenario: Storing tariff tables, communication stack firmware, and tamper logs in ANSI C12.22-compliant smart meters. IC Role / Device Role / Timing Role: Secure firmware storage with OTP-based key storage and block protection against unauthorized reprogramming. Use Value: ASP enables utility-controlled sector locking; 20-year retention meets ANSI 12.22 lifetime requirements for field-deployed meters. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFI101 | Same die, FBGA-24 (FAB024) package; no SO16 option; slightly higher standby current (0.1 mA vs. 0.07 mA). | Targeted at space-constrained modules where BGA mounting is preferred; lacks through-hole SO16 compatibility. | Select when board area is critical and BGA assembly capability exists. |
| MX25L51245GMI-10G | Macronix part; same density and SO16 package; supports only SDR and Dual I/O (no Quad DDR); no ASP or OTP. | Lacks advanced security features and DDR performance; suitable for cost-sensitive, non-secure applications. | Select only if Quad DDR and hardware security are not required and BOM cost is primary constraint. |
Compared with S25FL512SDPBHB213, the FBGA alternative offers identical functionality in smaller form factor but sacrifices through-hole assembly flexibility, while the Macronix part trades security and speed for lower unit cost-making it viable only in non-safety-critical, low-performance contexts.
Availability
S25FL512SDPBHB213 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging systems, and smart energy meters requiring stable component supply, long-term lifecycle support, and AEC-Q100 qualified flash memory.
Supply support for S25FL512SDPBHB213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The FL-S family targets high-reliability embedded systems requiring fast, secure, and long-life nonvolatile storage-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 qualification and hardware-based data integrity.
FAQ
What is the maximum clock frequency supported in Quad DDR mode?
The S25FL512SDPBHB213 supports Quad DDR read operations at up to 80 MHz, delivering 80 MBps throughput when VIO = VCC = 3.0–3.6 V. This mode requires proper setup of the configuration register (CR) bit [1] and uses double-data-rate sampling on both SCK edges. Timing margins must comply with tSHQD and tSLQD specifications per the datasheet Section 5.5.
Does this part support hardware reset via the RESET# pin?
Yes, the RESET# pin provides asynchronous active-low hardware reset. Asserting RESET# clears internal command state, resets status registers, disables write protection, and forces the device into standby mode. After deassertion, the device requires a minimum tRSTH (100 ns) before accepting new commands, and AutoBoot behavior resumes based on stored configuration.
How is the 1024-byte OTP array accessed and protected?
The OTP array is accessed via dedicated One-Time-Program commands (0x4B and 0x42) and resides at fixed address 0x00000000 in the OTP address space. Once programmed, bits cannot be erased. Protection is enforced by Status Register bit SRP0/SRP1 and hardware WP# assertion; OTP programming is disabled unless both conditions are met, preventing accidental overwrite during normal operation.
Can this flash be used with a 1.8 V host processor without level shifters?
Yes, the S25FL512SDPBHB213 supports VIO = 1.65–2.7 V, making it fully compatible with 1.8 V host I/Os. The device automatically adapts drive strength and input thresholds to the applied VIO voltage. No external level shifters are needed when VIO = 1.8 V and VCC = 3.3 V, provided host timing margins meet the reduced SDR/DDR rates specified for 1.65–2.7 V VIO operation.
S25FL512SDPBHB213 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 66 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SDPBHB213 FAQ
1.How can I place an order for S25FL512SDPBHB213 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SDPBHB213 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SDPBHB213 reliable?
The price and inventory of S25FL512SDPBHB213 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDPBHB213 is usually 5 days.
3.What payment methods are accepted for S25FL512SDPBHB213?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDPBHB213 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SDPBHB213?
S25FL512SDPBHB213 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SDPBHB213 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SDPBHB213?
For technical support, including S25FL512SDPBHB213 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDPBHB213 requirements.
6.How does Aetrix verify that S25FL512SDPBHB213 is sourced from the original manufacturer or authorized distributors?
All S25FL512SDPBHB213 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDPBHB213 meets industry standards.
7.What is the process for return or replacement of S25FL512SDPBHB213?
All S25FL512SDPBHB213 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDPBHB213, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SDPBHB213 part is unused and in its original packaging.
Return procedure for S25FL512SDPBHB213:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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