My Inquiry
My Account
Infineon Technologies S25FL512SDPBHBC10
- Part No.:
- S25FL512SDPBHBC10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SDPBHBC10.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,977
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL512SDPBHBC10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, designed for embedded boot code storage and firmware execution in resource-constrained systems. It supports Quad Read at up to 52 MBps, features hardware ECC, 256-KB uniform sector erase, 100,000 program-erase cycles, and operates across –40°C to +105°C (Industrial Plus grade).
For engineers reviewing the S25FL512SDPBHBC10 datasheet, S25FL512SDPBHBC10 pinout, S25FL512SDPBHBC10 application, or S25FL512SDPBHBC10 equivalent, this device is selected for high-reliability boot storage where DDR-capable SPI bandwidth, OTP security, and AEC-Q100 Grade 2 qualification are required.
Technical Context
This FL-S family flash uses Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling true single-bit ECC correction via on-die hardware without host intervention. Its command set is fully compatible with S25FL-P series, supporting both legacy SPI modes (0/3) and DDR read operations up to 80 MHz.
The device implements dual power domains: core VCC (2.7–3.6 V) and versatile I/O VIO (1.65–3.6 V), allowing interoperability with 1.8 V or 3.3 V controllers. Sector protection is enforced via status register bits and Advanced Sector Protection (ASP), enabling password- or boot-code-controlled individual sector locking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and parameter tables in industrial gateways and automotive ECUs |
| Read Bandwidth (Quad) | 52 MBps at 104 MHz - enables fast boot execution from SPI without external RAM prefetch |
| Erase Unit | Uniform 256-KB sectors - simplifies firmware update partitioning and wear leveling in OTA applications |
| Endurance | 100,000 program-erase cycles - supports frequent field updates in network infrastructure equipment |
| Data Retention | 20 years minimum - ensures long-term reliability in unattended deployments like smart meters |
| Temperature Range | –40°C to +105°C (Industrial Plus) - qualified for under-hood automotive and outdoor industrial environments |
| Security | 1024-byte OTP array + ASP - allows secure key storage and per-sector write lock independent of status register settings |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, body size 10.16 × 7.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction |
| SCK | Serial Clock Input | Edge-triggered clock for all SPI transfers; supports up to 133 MHz SDR and 80 MHz DDR operation |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad modes |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; doubles as I/O2 in Quad mode |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing SPI transfer without deselecting device; doubles as I/O3 in Quad mode |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; decoupling capacitor required per datasheet layout guidelines |
| VIO | I/O Supply | 1.65–3.6 V supply for all I/O pins - enables mixed-voltage system interfacing |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance PCB return path |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Function | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates host initialization delay for deterministic boot timing |
| Hardware ECC | On-the-fly single-bit error correction with no software overhead - maintains data integrity without CPU intervention |
| Extended Addressing | 32-bit address space support - enables full 512 Mb addressing without bank switching complexity |
| CFI & SFDP Compliance | JEDEC JESD216-compliant SFDP table and Common Flash Interface - enables automatic driver configuration in Linux and RTOS bootloaders |
| Advanced Sector Protection | Password- or boot-code-controlled individual sector lock - prevents unauthorized firmware modification in certified safety-critical systems |
Applications
| Automotive ECU Boot Storage | Industrial PLC Firmware Image |
|---|---|
Use Scenario: Storing boot loader and safety-critical application firmware in engine control units requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory executing Quad Read at reset to load executable code into microcontroller SRAM. Use Value: 20-year data retention and 100K endurance ensure firmware integrity over vehicle lifetime without refresh cycles. | Use Scenario: Holding field-upgradable firmware and configuration parameters in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: SPI-connected firmware repository accessed by ARM Cortex-M7 host during cold start and OTA update sequences. Use Value: Uniform 256-KB sectors simplify delta-update implementation and reduce risk of partial erase corruption. |
| Network Edge Router Configuration | Medical Diagnostic Imaging Boot |
Use Scenario: Storing bootloader, OS kernel, and network stack binaries in carrier-grade edge routers operating continuously in telecom cabinets. IC Role / Device Role / Timing Role: High-bandwidth Quad Read source enabling sub-200ms boot time under thermal stress (85°C ambient). Use Value: 52 MBps read rate and DDR support eliminate need for parallel NOR, reducing PCB layer count and BOM cost. | Use Scenario: Securing boot firmware and calibration data in FDA-cleared imaging devices where data integrity is regulated. IC Role / Device Role / Timing Role: Trusted storage for signed firmware images and cryptographic keys using 1024-byte OTP and ASP lockdown. Use Value: Hardware-enforced sector protection prevents runtime tampering during diagnostic procedure execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFV00 | Same die, identical pinout and command set; differs only in marking and tape/reel packaging | No functional difference - direct drop-in replacement in existing designs | Select when sourcing from Cypress-distributed channels or requiring legacy part number continuity |
| Winbond W25Q512JVFIQ | 512 Mb density, but lacks DDR read, AutoBoot, and ASP; uses different SFDP structure and OTP layout | Suitable for cost-sensitive consumer applications; not qualified for Industrial Plus or AEC-Q100 | Choose only if DDR, OTP security, or extended temperature operation are not required |
Compared with S25FL512SDPBHBC10, the Cypress alternative offers identical functionality and qualification, while the Winbond part trades advanced features for lower cost and broader commercial availability - making it viable only where automotive or industrial reliability is not mandated.
Availability
S25FL512SDPBHBC10 is available at Aetrix Electronics and suitable for automotive ECU boot storage, industrial PLC firmware image retention, and medical diagnostic imaging boot applications requiring stable component supply across extended temperature and long lifecycle requirements.
Supply support for S25FL512SDPBHBC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.
The FL-S flash product line delivers high-reliability, SPI-compatible NOR memory optimized for deterministic boot performance, secure firmware storage, and extended temperature operation in safety-critical systems.
FAQ
What is the maximum clock frequency supported for DDR read operations?
The S25FL512SDPBHBC10 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz with VIO = VCC = 3.0–3.6 V, delivering up to 80 MBps effective bandwidth. DDR mode requires proper setup via configuration registers and is not enabled by default after power-on reset.
Does this device require external hardware ECC circuitry?
No. The device integrates on-die ECC hardware that automatically detects and corrects single-bit errors during read operations. No external circuitry or host software intervention is needed - correction occurs transparently within the flash's data path before output.
Can the 1024-byte OTP area be reprogrammed after initial programming?
No. The OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses and cannot be erased or rewritten. Once written, its contents remain immutable - making it suitable for storing cryptographic keys, device IDs, or calibration constants requiring write-protection assurance.
Is the SOIC package RoHS-compliant and lead-free?
Yes. The S25FL512SDPBHBC10 in 16-pin SOIC (300 mil) packaging is fully RoHS-compliant and Pb-free, meeting JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) and qualified for reflow soldering per IPC/JEDEC J-STD-020 standards.
S25FL512SDPBHBC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- -
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR (SLC)
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 66 MHz
- Write Cycle Time - Word, Page:
- 750µs
- Access Time:
- 6.5 ns
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SDPBHBC10 FAQ
1.How can I place an order for S25FL512SDPBHBC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SDPBHBC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SDPBHBC10 reliable?
The price and inventory of S25FL512SDPBHBC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDPBHBC10 is usually 5 days.
3.What payment methods are accepted for S25FL512SDPBHBC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDPBHBC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SDPBHBC10?
S25FL512SDPBHBC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SDPBHBC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SDPBHBC10?
For technical support, including S25FL512SDPBHBC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDPBHBC10 requirements.
6.How does Aetrix verify that S25FL512SDPBHBC10 is sourced from the original manufacturer or authorized distributors?
All S25FL512SDPBHBC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDPBHBC10 meets industry standards.
7.What is the process for return or replacement of S25FL512SDPBHBC10?
All S25FL512SDPBHBC10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDPBHBC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SDPBHBC10 part is unused and in its original packaging.
Return procedure for S25FL512SDPBHBC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL512SDPBHBC10 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
