My Inquiry
My Account
Infineon Technologies S25FL512SDPBHV313
- Part No.:
- S25FL512SDPBHV313
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SDPBHV313.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,441
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL512SDPBHV313 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for high-reliability embedded boot code and firmware storage in industrial and automotive systems. It supports Quad Read up to 52 MBps, uniform 256-KB sector erase, 100,000 program-erase cycles, and operates across –40°C to +105°C (Industrial Plus grade). Its integrated hardware ECC and AutoBoot functionality enable robust, fail-safe startup in microcontroller-based edge devices.
For engineers reviewing the S25FL512SDPBHV313 datasheet, S25FL512SDPBHV313 pinout, S25FL512SDPBHV313 application, or S25FL512SDPBHV313 equivalent, key selection criteria include Quad DDR read performance (80 MBps), OTP security (1024-byte array), AEC-Q100 Grade 2 qualification, and SO16 package compatibility with legacy S25FL-P footprint designs.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling true single-bit ECC correction without software overhead. Its command set fully complies with JEDEC JESD216 SFDP v1.6 and Common Flash Interface (CFI), allowing automatic configuration by host boot ROMs and UEFI firmware.
The SPI interface supports all four clock modes (CPOL/CPHA 0/0 and 1/1), DDR operation at 80 MHz, and extended 32-bit addressing-eliminating need for bank switching in large-code applications. VIO and VCC are independently configurable (VIO: 1.65–3.6 V; VCC: 2.7–3.6 V), supporting mixed-voltage SoC interfacing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full Linux kernel + rootfs or dual-image OTA firmware in resource-constrained edge nodes |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables sub-100 ms boot time for 4 MB application image |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and avoids fragmentation in field-upgrade partitions |
| Endurance | 100,000 program-erase cycles - supports >10 years of daily firmware updates in industrial gateways |
| Data Retention | 20 years minimum at +85°C - meets long-lifecycle requirements for automotive ECUs and infrastructure controllers |
| Security | 1024-byte OTP + ASP - allows secure key storage and password-protected sector lockdown per ISO 15408 EAL4+ design patterns |
| Temperature Range | –40°C to +105°C (Industrial Plus) - qualified for under-hood automotive and outdoor telecom equipment |
| Voltage Support | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - interoperable with 1.8 V I/O SoCs (e.g., NXP i.MX RT) while maintaining 3.3 V core stability |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, standard JEDEC MS-012AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command execution; must be asserted before SCK edge to avoid bus contention |
| SCK | Serial Clock Input | Master-generated clock; supports up to 133 MHz SDR and 80 MHz DDR for timing-critical boot sequences |
| SI / IO0 | Serial Input / I/O0 | Primary data input in single/dual mode; functions as bidirectional I/O0 in Quad mode for address/data multiplexing |
| SO / IO1 | Serial Output / I/O1 | Primary data output in single/dual mode; bidirectional I/O1 in Quad mode; supports tri-state during HOLD# assertion |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; doubles as Quad I/O2 when WP# disabled via SR bit |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing read/write without deselecting chip; serves as Quad I/O3 when HOLD# disabled via SR bit |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; decoupling required within 5 mm of pin per layout guidelines |
| VIO | I/O Supply | 1.65–3.6 V supply for SI/SO/WP#/HOLD# pins; enables level-shifting between 1.8 V host and 3.3 V flash core |
| VSS | Ground | Common reference for VCC and VIO; requires dedicated low-impedance plane connection to minimize noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot | Automatically executes Normal or Quad Read at preconfigured address on power-up/reset - eliminates external boot controller and reduces BOM count |
| Hardware ECC | On-the-fly single-bit error correction with no CPU intervention - ensures data integrity in radiation-prone environments (e.g., avionics, satellite comms) |
| Quad-Input Page Programming (QPP) | Enables 512-byte page writes using all four I/O lines simultaneously - cuts programming time by 4× vs. single-line mode in low-clock MCU systems |
| Advanced Sector Protection (ASP) | Password- or boot-code-triggered individual sector lockdown - prevents unauthorized firmware modification in certified safety-critical applications (IEC 61508 SIL3) |
| JEDEC JESD216 SFDP v1.6 | Self-describing parameter table accessible via standard SPI commands - enables automatic driver initialization in Linux MTD and U-Boot without hard-coded timing constants |
Applications
| Automotive ADAS ECU Boot Storage | Industrial PLC Firmware Repository |
|---|---|
Use Scenario: Stores boot loader, safety monitor, and sensor fusion firmware for radar processing units requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with AutoBoot and hardware ECC ensuring deterministic <100 ms cold-start latency. Use Value: Eliminates external watchdog and ECC co-processor; 20-year retention guarantees firmware validity over vehicle lifetime. | Use Scenario: Holds dual-image firmware and configuration data for programmable logic controllers deployed in factory automation cabinets. IC Role / Device Role / Timing Role: Field-upgradable firmware storage with uniform 256-KB erase blocks enabling atomic OTA updates without runtime interruption. Use Value: 100,000-cycle endurance supports daily firmware validation cycles across 27 years of continuous operation. |
| Medical Imaging Device Configuration | Smart Grid Communication Module |
Use Scenario: Secures calibration tables, DICOM protocol stacks, and regulatory compliance certificates in FDA-cleared MRI subsystems. IC Role / Device Role / Timing Role: Trusted storage for immutable security assets using 1024-byte OTP and ASP-locked sectors. Use Value: Prevents tampering with medical device parameters; OTP write-once capability satisfies IEC 62304 traceability requirements. | Use Scenario: Stores DLMS/COSEM firmware and encryption keys for ANSI C12.22-compliant smart meters operating in outdoor substations. IC Role / Device Role / Timing Role: High-reliability code storage rated for –40°C to +105°C ambient with guaranteed 20-year data retention. Use Value: Meets IEEE 1377 thermal cycling requirements; SO16 package enables reflow-compatible repair in field-deployed units. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFV010 | Same die, identical electrical specs, but FBGA FAB024 (6×8 mm) package instead of SO16 | Requires PCB redesign for BGA routing and reflow profile; unsuitable for through-hole or manual repair scenarios | Select only when board space constraints prohibit SOIC or when higher-density interconnect is needed |
| Winbond W25Q512JVFIQ | 512 Mb density, Quad SPI, but lacks AutoBoot, hardware ECC, and ASP; max Quad Read = 40 MBps (vs. 52 MBps) | Not AEC-Q100 qualified; limited to commercial/industrial temp range (–40°C to +85°C) | Acceptable for cost-sensitive non-automotive applications where ECC and secure boot are handled in software |
Compared with S25FL512SDPBHV313, the Cypress alternative offers identical reliability in BGA form factor but sacrifices serviceability, while the Winbond part trades critical automotive-grade features for lower unit cost and simpler integration in non-safety-critical systems.
Availability
S25FL512SDPBHV313 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging subsystems, and smart grid communication modules requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S25FL512SDPBHV313 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and high-reliability memory solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.
The FL-S family targets mission-critical embedded systems needing deterministic boot, data integrity, and extended temperature operation - specifically engineered for automotive, industrial control, and medical electronics where firmware corruption is unacceptable.
FAQ
What is the maximum clock frequency supported in DDR mode?
The S25FL512SDPBHV313 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz, delivering 20 MBps, 40 MBps, and 80 MBps respectively. This requires VIO = VCC = 3.0–3.6 V and proper impedance-controlled PCB routing to meet setup/hold timing margins specified in Section 5.5 of the datasheet.
Does this device require external hardware ECC circuitry?
No. The device integrates dedicated hardware ECC logic that automatically detects and corrects single-bit errors during read operations without CPU involvement or external components. ECC is always active and transparent to the host system, covering the entire 512 Mb array including OTP and configuration registers.
Can the SOIC package be used in reflow soldering processes?
Yes. The S25FL512SDPBHV313 in 16-pin SOIC (300 mil) is RoHS-compliant and qualified for standard lead-free reflow profiles (J-STD-020, peak 260°C). Thermal pad is not present; standard SOIC land pattern per IPC-7351B is sufficient, with recommended stencil aperture 0.18 mm thick for optimal solder paste volume.
How is the AutoBoot address configured?
The AutoBoot address is stored in the Configuration Register (CR) bits [23:8] and is programmed via Write Configuration Register (WRCR) command. Default value is 0x000000, but it can be set to any 32-bit address aligned to 256-byte boundary. AutoBoot triggers on power-up or RESET# assertion only when AutoBoot Enable bit (CR[0]) is set to '1'.
S25FL512SDPBHV313 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 66 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FL512SDPBHV313 FAQ
1.How can I place an order for S25FL512SDPBHV313 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SDPBHV313 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SDPBHV313 reliable?
The price and inventory of S25FL512SDPBHV313 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDPBHV313 is usually 5 days.
3.What payment methods are accepted for S25FL512SDPBHV313?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDPBHV313 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SDPBHV313?
S25FL512SDPBHV313 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SDPBHV313 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SDPBHV313?
For technical support, including S25FL512SDPBHV313 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDPBHV313 requirements.
6.How does Aetrix verify that S25FL512SDPBHV313 is sourced from the original manufacturer or authorized distributors?
All S25FL512SDPBHV313 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDPBHV313 meets industry standards.
7.What is the process for return or replacement of S25FL512SDPBHV313?
All S25FL512SDPBHV313 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDPBHV313, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SDPBHV313 part is unused and in its original packaging.
Return procedure for S25FL512SDPBHV313:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL512SDPBHV313 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
