Infineon Technologies S25FL512SDPMFVG10
- Part No.:
- S25FL512SDPMFVG10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL512SDPMFVG10.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:329
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL512SDPMFVG10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for boot code storage and firmware execution in embedded systems. It supports Quad Read up to 52 MBps, features 256-KB uniform sectors, 100,000 program-erase cycles, 20-year data retention, and operates from 2.7 V to 3.6 V core supply with 1.65–3.6 V I/O voltage.
For engineers reviewing the S25FL512SDPMFVG10 datasheet, S25FL512SDPMFVG10 pinout, S25FL512SDPMFVG10 application, or S25FL512SDPMFVG10 equivalent, key selection criteria include Quad DDR read performance (80 MBps), integrated ECC, AEC-Q100 Grade 2 qualification (–40°C to +105°C), SO16 package compatibility, and CFI/SFDP support for standardized configuration.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density, low-power NOR flash operation. Its dual-voltage domain (VCC and VIO) allows independent core and I/O rail control, supporting mixed-signal SoC interfacing and legacy 1.8 V host systems.
The command set is fully backward-compatible with S25FL-A/K/P families and extends support to DDR modes, extended 32-bit addressing, AutoBoot, and Advanced Sector Protection (ASP). Internal hardware ECC provides single-bit error correction without software overhead during read operations.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and secure boot partitions in industrial gateways and automotive ECUs. |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables fast XIP (eXecute-In-Place) execution directly from flash in microcontroller-based systems. |
| Erase Unit | Uniform 256-KB sectors - simplifies firmware update partitioning and wear leveling in OTA-capable devices. |
| Endurance | 100,000 program-erase cycles - supports frequent field updates in network infrastructure and industrial controllers. |
| Data Retention | 20 years minimum - ensures long-term reliability in unattended deployments such as smart meters and railway signaling. |
| Operating Temp | –40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - qualified for under-hood automotive and factory-floor environments. |
| Security | 1024-byte OTP + ASP + Block Protection - enables secure key storage and immutable bootloader protection. |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, standard footprint compatible with legacy S25FL-P series.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; supports daisy-chaining in multi-flash configurations. |
| SCK | Serial Clock Input | Drives all timing-critical operations; supports SDR up to 133 MHz and DDR up to 80 MHz. |
| SI / IO0 | Serial Input / I/O0 | Primary data input in single/dual/quad modes; functions as bidirectional I/O0 in Multi-I/O protocols. |
| SO / IO1 | Serial Output / I/O1 | Primary data output in single mode; bidirectional I/O1 in dual/quad; supports read data streaming at 52 MBps. |
| WP# / IO2 | Write Protect / I/O2 | Hardware-enabled sector lock; doubles as I/O2 in quad mode for full bus utilization. |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing transfers without deselecting chip; serves as I/O3 in quad mode for 4-bit parallel data path. |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; decoupling required per datasheet layout guidelines. |
| VIO | I/O Supply | 1.65–3.6 V rail for interface pins - enables interoperability with 1.8 V or 3.3 V host processors. |
| VSS | Ground | Common reference for both core and I/O domains; requires low-impedance PCB return path. |
| RESET# | Reset Input | Asynchronous active-low reset that clears internal state and reinitializes command parser. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot | Automatically executes Normal or Quad Read at power-up/reset from preconfigured address - eliminates external boot controller dependency. |
| Integrated ECC | On-the-fly single-bit error correction using dedicated hardware - no CPU overhead or latency penalty during reads. |
| CFI & SFDP Support | Standardized configuration access via Common Flash Interface and JEDEC JESD216 - enables plug-and-play driver integration in Linux/U-Boot. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - prevents unauthorized firmware modification in certified safety systems. |
| Quad-Input Page Programming | QPP reduces programming time in low-clock-rate hosts - maintains throughput even with 20 MHz SPI clocks. |
Applications
| Automotive ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot loader and safety-critical application firmware in engine control units requiring AEC-Q100 compliance. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with AutoBoot and ASP-enforced integrity verification at startup. Use Value: Enables deterministic cold-boot within <500 ms while preventing unauthorized reprogramming of calibrated engine parameters. | Use Scenario: Holds field-upgradable ladder logic and HMI assets in programmable logic controllers deployed in harsh factory environments. IC Role / Device Role / Timing Role: High-endurance firmware repository supporting over-the-air updates with rollback capability. Use Value: Delivers 100,000 erase cycles and 20-year retention - eliminating scheduled flash replacement in 15+ year PLC deployments. |
| Network Router Boot Image | Medical Imaging System Configuration |
Use Scenario: Hosts secure boot image and cryptographic keys for enterprise-grade routers with TLS acceleration. IC Role / Device Role / Timing Role: Trusted execution environment anchor with OTP-protected root-of-trust keys. Use Value: Leverages 1024-byte OTP and hardware ECC to meet FIPS 140-2 Level 2 requirements for key storage integrity. | Use Scenario: Stores calibration profiles, DICOM metadata templates, and UI skins in FDA-cleared diagnostic imaging equipment. IC Role / Device Role / Timing Role: Reliable configuration store with guaranteed data retention across 10+ year product lifecycles. Use Value: Meets IEC 62304 Class C software requirements via 20-year retention and AEC-Q100 Grade 1 option (-40°C to +125°C). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFV00 | Same die, identical electrical specs, but rated only to +85°C (Industrial grade); lacks AEC-Q100 certification. | Not suitable for automotive under-hood use; acceptable for commercial networking gear. | Select when cost sensitivity outweighs temperature or automotive qualification needs. |
| Winbond W25Q512JVIM | 512 Mb SPI NOR with Quad/Dual support, but no DDR mode, no AutoBoot, and no integrated ECC. | Requires external error handling and boot sequencing logic; lower security assurance. | Choose for cost-constrained consumer applications where ECC and deterministic boot are not mandatory. |
Compared with S25FL512SDPMFVG10, the Cypress alternative matches functionality but omits automotive qualification, while the Winbond part trades advanced features (DDR, AutoBoot, ECC) for lower unit cost - making Infineon's device optimal for safety- and performance-critical embedded firmware storage.
Availability
S25FL512SDPMFVG10 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware upgrades, and medical imaging system configuration storage requiring stable component supply across extended product lifecycles.
Supply support for S25FL512SDPMFVG10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor leader specializing in power management, sensing, and secure microcontrollers, with strong focus on automotive, industrial, and IoT markets.
The FL-S family targets high-reliability embedded systems needing fast, secure, and long-life nonvolatile storage - specifically engineered for boot code integrity, firmware resilience, and AEC-Q100-compliant operation.
FAQ
Is S25FL512SDPMFVG10 pin-compatible with earlier S25FL-P series devices?
Yes - it uses the same 16-pin SOIC (300 mil) footprint and signal mapping as S25FL-P devices. All control signals (CS#, SCK, SI/SO/WP#/HOLD#), power pins (VCC/VIO/VSS), and RESET# align exactly, enabling drop-in replacement without PCB redesign.
Does this part support Dual and Quad SPI modes simultaneously with DDR?
No - DDR operation is only supported in Fast, Dual, and Quad Read commands, not Normal Read. The device supports DDR in Fast Read DDR, Dual Read DDR, and Quad Read DDR modes, each requiring specific command sequences and clock phase alignment per datasheet Section 5.5.
What is the purpose of the VIO pin, and can it be tied to VCC?
VIO sets the I/O voltage level independently from VCC, enabling interface compatibility with 1.8 V or 3.3 V hosts. It may be tied to VCC if the host operates at the same voltage, but must remain within 1.65–3.6 V range; mismatched VIO/VCC introduces timing skew and violates AC specifications.
How does the AutoBoot feature initialize, and can its target address be modified?
AutoBoot triggers automatically after power-up or RESET# assertion, executing a preconfigured Normal or Quad Read command from an address stored in the Configuration Register (CR2[7:0]). That address is user-programmable via Write Status Register command and persists across power cycles.
S25FL512SDPMFVG10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 66 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL512SDPMFVG10 FAQ
1.How can I place an order for S25FL512SDPMFVG10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SDPMFVG10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SDPMFVG10 reliable?
The price and inventory of S25FL512SDPMFVG10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDPMFVG10 is usually 5 days.
3.What payment methods are accepted for S25FL512SDPMFVG10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDPMFVG10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SDPMFVG10?
S25FL512SDPMFVG10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SDPMFVG10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SDPMFVG10?
For technical support, including S25FL512SDPMFVG10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDPMFVG10 requirements.
6.How does Aetrix verify that S25FL512SDPMFVG10 is sourced from the original manufacturer or authorized distributors?
All S25FL512SDPMFVG10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDPMFVG10 meets industry standards.
7.What is the process for return or replacement of S25FL512SDPMFVG10?
All S25FL512SDPMFVG10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDPMFVG10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SDPMFVG10 part is unused and in its original packaging.
Return procedure for S25FL512SDPMFVG10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL512SDPMFVG10 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

