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Infineon Technologies S25FL512SDSBHBC10
- Part No.:
- S25FL512SDSBHBC10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SDSBHBC10.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,467
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Product details
Overview
S25FL512SDSBHBC10 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, designed for embedded boot code storage and firmware execution in resource-constrained systems. It supports Quad Read at up to 52 MBps, features 256-KB uniform sectors, 100,000 program-erase cycles, 20-year data retention, and operates across –40°C to +105°C (Industrial Plus grade).
For engineers reviewing the S25FL512SDSBHBC10 datasheet, S25FL512SDSBHBC10 pinout, S25FL512SDSBHBC10 application, or S25FL512SDSBHBC10 equivalent, this device delivers deterministic boot timing via AutoBoot, hardware ECC for single-bit correction, and CFI/SFDP-compliant configuration - critical for industrial control, automotive infotainment, and secure IoT edge devices.
Technical Context
This SPI flash implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with low-power operation. It supports standard SPI modes 0/3 and DDR variants, 32-bit extended addressing, and dual/quad I/O command sets compatible with legacy S25FL-P family footprints.
The device integrates dedicated control logic for AutoBoot execution on power-up/reset, configurable block protection via status register bits, and advanced sector protection (ASP) with password- or boot-code–controlled individual sector locking - all managed through standardized JEDEC JESD216 SFDP and Common Flash Interface descriptors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and multi-application partitioning in microcontroller-based systems |
| Read Speed (Quad) | 52 MBps at VIO = VCC = 3.0–3.6 V - enables fast boot and real-time code execution without external RAM caching |
| Erase Unit | Uniform 256-KB sectors - simplifies firmware update logic and avoids fragmentation in OTA upgrade implementations |
| Endurance | 100,000 program-erase cycles - supports frequent field updates in industrial gateways and telematics units |
| Data Retention | 20 years minimum at +85°C - ensures long-term reliability in unattended infrastructure equipment |
| Voltage Range | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - allows interoperability with both 1.8 V and 3.3 V host controllers |
| Temperature Grade | Industrial Plus (–40°C to +105°C) - qualified for under-hood automotive ECUs and factory automation controllers |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, with 1.27 mm pitch and standard JEDEC MS-001AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction |
| SCK | Serial Clock Input | Drives all synchronous operations; supports up to 133 MHz SDR and 80 MHz DDR clock rates |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad mode |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad mode |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for top/bottom sectors when WP# is low; serves as I/O2 in Quad mode |
| HOLD# / IO3 | Hold Input / I/O3 | Suspends ongoing read without deselecting chip; doubles as I/O3 in Quad mode |
| VCC | Core Supply | 2.7–3.6 V core voltage; powers internal logic, array, and ECC engine |
| VIO | I/O Supply | 1.65–3.6 V independent I/O rail - enables mixed-voltage system interfacing |
| VSS | Ground | Common reference for VCC and VIO; requires low-impedance PCB return path |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically initiates Normal or Quad Read from preconfigured address on power-up/reset - eliminates host-side boot loader delay |
| Hardware ECC | On-the-fly single-bit error correction with no software overhead - maintains data integrity during extended temperature cycling |
| Advanced Sector Protection (ASP) | Password- or boot-code–enabled per-sector write/erase lock - enforces secure firmware update boundaries |
| CFI & SFDP Compliance | JEDEC JESD216-compliant SFDP table and Common Flash Interface data - enables automatic driver configuration in Linux/U-Boot |
| OTP Array | 1024-byte one-time-programmable region - stores cryptographic keys, calibration data, or device-specific identifiers |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing boot firmware and real-time control logic in programmable logic controllers deployed in factory environments. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory executing directly from flash (XIP) with deterministic latency under thermal stress. Use Value: 256-KB uniform sectors simplify firmware patching; 100K-cycle endurance supports quarterly security updates over 10+ year product life. | Use Scenario: Hosting boot code and sensor fusion algorithms for camera/radar processing units in Level 2+ ADAS systems. IC Role / Device Role / Timing Role: High-reliability boot memory operating at +105°C with AutoBoot-triggered Quad Read for sub-100ms cold start. Use Value: Industrial Plus temperature rating and hardware ECC ensure functional safety compliance (ISO 26262 ASIL-B) without external error scrubbing. |
| Secure IoT Edge Gateway | Medical Imaging Control Module |
Use Scenario: Storing encrypted firmware images and device identity keys in cellular-connected edge gateways for remote health monitoring. IC Role / Device Role / Timing Role: Secure storage element with OTP key vault and ASP-enforced firmware partitioning. Use Value: 1024-byte OTP and password-controlled ASP prevent unauthorized firmware modification - meeting HIPAA-aligned device attestation requirements. | Use Scenario: Holding calibrated timing sequences and diagnostic firmware in portable ultrasound and MRI control modules. IC Role / Device Role / Timing Role: Nonvolatile memory with guaranteed 20-year data retention at +85°C for lifetime-critical medical data logs. Use Value: 20-year retention specification validated per JEDEC JESD22-A117 - eliminates recalibration drift risk in Class IIa medical devices. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGNFI010 | Same die, identical pinout and command set; differs only in marking and tape/reel packaging (no functional difference) | No impact - drop-in replacement in all PCB layouts and firmware stacks | Select when requiring Cypress-branded logistics or specific reel size (2000 pcs/reel vs. Infineon's 1000 pcs/reel) |
| Winbond W25Q512JWQI | 512 Mb, 1.8 V I/O capable; lacks AutoBoot, ASP, and hardware ECC; uses different SFDP layout | Not suitable for safety-critical boot paths requiring deterministic startup or ECC protection | Consider only for cost-sensitive consumer applications where firmware integrity checks are handled in software |
Compared with S25FL512SDSBHBC10, the Cypress alternative offers identical functionality with logistics differentiation, while the Winbond part trades robustness (no AutoBoot/ECC/ASP) for lower cost - making it viable only where host-side error handling and manual boot sequencing are acceptable.
Availability
S25FL512SDSBHBC10 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, secure IoT gateways, and medical imaging control systems requiring stable component supply, long-lifecycle support, and AEC-Q100 Grade 2 qualification.
Supply support for S25FL512SDSBHBC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, connectivity, and security solutions for automotive, industrial, and IoT markets.
The S25FL512SDSBHBC10 belongs to Infineon's FL-S family of high-performance SPI NOR flash memories, engineered specifically for deterministic boot, firmware resilience, and secure field updates in mission-critical embedded systems.
FAQ
What is the AutoBoot function and how is it configured?
AutoBoot executes a preselected Normal or Quad Read command automatically after power-up or reset. Configuration is done by programming the AutoBoot Address Register (ABAR) and AutoBoot Configuration Register (ABCR) via standard SPI commands. The feature requires no host intervention and reduces boot latency by eliminating initial command handshaking.
Does S25FL512SDSBHBC10 support Dual/Quad SPI modes on all package types?
Yes - Dual and Quad SPI modes are supported across both SOIC-16 and FBGA packages. Pin multiplexing (IO0–IO3) is identical in all variants; no package-dependent limitations exist. Mode selection is controlled entirely by instruction opcode and status register settings, not physical layout.
How does hardware ECC operate and what error scenarios does it cover?
Hardware ECC generates and verifies Hamming codes on every 512-byte page during read/write. It corrects any single-bit error and detects double-bit errors. ECC is always active - no enable/disable register - and applies to main array, OTP, and configuration registers, ensuring end-to-end data integrity without software overhead.
Is the 20-year data retention specification validated at maximum operating temperature?
Yes - the 20-year minimum retention is specified and tested at +85°C ambient per JEDEC JESD22-A117. At +105°C (Industrial Plus grade), retention is extrapolated using Arrhenius modeling and confirmed to exceed 10 years, with full qualification data available in Infineon's reliability report 001-98284 Rev. *U Annex A.
S25FL512SDSBHBC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SDSBHBC10 FAQ
1.How can I place an order for S25FL512SDSBHBC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SDSBHBC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SDSBHBC10 reliable?
The price and inventory of S25FL512SDSBHBC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDSBHBC10 is usually 5 days.
3.What payment methods are accepted for S25FL512SDSBHBC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDSBHBC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SDSBHBC10?
S25FL512SDSBHBC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SDSBHBC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SDSBHBC10?
For technical support, including S25FL512SDSBHBC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDSBHBC10 requirements.
6.How does Aetrix verify that S25FL512SDSBHBC10 is sourced from the original manufacturer or authorized distributors?
All S25FL512SDSBHBC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDSBHBC10 meets industry standards.
7.What is the process for return or replacement of S25FL512SDSBHBC10?
All S25FL512SDSBHBC10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDSBHBC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SDSBHBC10 part is unused and in its original packaging.
Return procedure for S25FL512SDSBHBC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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