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Infineon Technologies S25FL512SDSBHBC13
- Part No.:
- S25FL512SDSBHBC13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SDSBHBC13.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,170
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Product details
Overview
S25FL512SDSBHBC13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, and integrated hardware ECC. It supports Quad Read up to 52 MBps, AutoBoot at power-up, and operates across –40°C to +105°C (Industrial Plus grade). Used in boot code storage for embedded microcontrollers in industrial HMIs.
For engineers reviewing the S25FL512SDSBHBC13 datasheet, S25FL512SDSBHBC13 pinout, S25FL512SDSBHBC13 application, or S25FL512SDSBHBC13 equivalent, key selection factors include Quad DDR read speed (80 MBps), 100,000 program-erase cycles, OTP security array, AEC-Q100 Grade 2 qualification, and SO16 package compatibility with legacy S25FL-A/K/P families.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density NOR flash with single-bit error correction via on-die hardware ECC. Its command set fully supports JEDEC JESD216 SFDP and Common Flash Interface (CFI) for standardized configuration discovery.
The SPI interface supports all four clock modes (CPOL/CPHA 0/0 and 1/1), DDR operation, extended 32-bit addressing, and dual/quad I/O protocols - all footprint- and command-compatible with prior S25FL-P family devices, simplifying migration from 128–256 Mb variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and secure boot partitions in resource-constrained edge controllers. |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables sub-100 ms firmware load times from SPI bus without XIP acceleration. |
| Erase Unit | Uniform 256-KB sectors - eliminates erase granularity mismatch when porting applications from parallel NOR or eMMC boot partitions. |
| Endurance | 100,000 program-erase cycles - supports field firmware updates over 10+ years in industrial gateways with daily OTA cycles. |
| Data Retention | 20 years minimum - ensures boot code integrity across product lifecycle without refresh mechanisms. |
| Supply Range | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - allows direct interfacing with 1.8 V or 3.3 V host MCUs without level shifters. |
| Temperature Grade | Industrial Plus (–40°C to +105°C) - qualified for under-hood automotive ECUs and factory-floor PLCs without derating. |
| Security | 1024-byte OTP + ASP - enables immutable root-of-trust keys and per-sector password protection for secure boot enforcement. |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, standard JEDEC MS-012AC footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command latching; supports daisy-chaining with shared SCK/SO/SI lines. |
| SCK | Serial Clock Input | Drives internal state machine; supports up to 133 MHz SDR or 80 MHz DDR for timing-critical boot sequences. |
| SI / IO0 | Serial Input / Quad I/O 0 | Primary data input in single/dual mode; becomes bidirectional I/O0 in quad mode for address/data multiplexing. |
| SO / IO1 | Serial Output / Quad I/O 1 | Primary data output in single/dual mode; becomes bidirectional I/O1 in quad mode for full-duplex reads. |
| WP# / IO2 | Write Protect / Quad I/O 2 | Hardware lock for status register and sector protection bits; doubles as I/O2 in quad mode. |
| HOLD# / IO3 | Hold Input / Quad I/O 3 | Pauses ongoing read/write without deselecting chip; doubles as I/O3 in quad mode for 4-bit parallel transfers. |
| VCC | Core Supply | 2.7–3.6 V power for logic and array; decoupling required within 10 mm of pin per layout guidelines. |
| VIO | I/O Supply | Independent 1.65–3.6 V rail - enables mixed-voltage systems where host MCU I/O runs at 1.8 V while core remains at 3.3 V. |
| VSS | Ground | Dedicated analog/digital return path; two pins (pins 8 and 16) must be low-inductance connected to PCB ground plane. |
| RESET# | Hardware Reset Input | Asynchronous active-low reset that clears internal state and forces re-initialization of configuration registers. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot | Executes preconfigured Normal or Quad Read at power-up/reset - eliminates host MCU bootloader delay for immediate code execution. |
| Hardware ECC | On-die single-bit error correction with no software overhead - maintains data integrity without CPU intervention during critical boot phases. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enforces hierarchical firmware update policies in certified safety systems. |
| Quad DDR Read | 80 MBps throughput using double-data-rate on all four I/O lines - reduces boot time by >40% vs. standard Quad Read in high-clock systems. |
| CFI & SFDP Support | JEDEC-standardized parameter tables accessible via SPI - enables automatic driver configuration without hard-coded timing or geometry assumptions. |
Applications
| Industrial HMI Boot Storage | Automotive ADAS Sensor Hub |
|---|---|
Use Scenario: Stores bootloader, OS kernel, and GUI assets for ARM Cortex-A7-based panel PCs deployed in factory automation. IC Role / Device Role / Timing Role: Primary non-volatile boot medium with deterministic <150 ms cold-start latency via Quad DDR read. Use Value: 20-year retention and 105°C rating ensure uninterrupted operation in uncooled control cabinets near welding equipment. | Use Scenario: Holds sensor fusion firmware and calibration data for radar/Ethernet gateway modules in L2+ ADAS systems. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified boot flash with OTP-secured cryptographic keys for secure boot chain validation. Use Value: Hardware ECC prevents silent corruption of radar processing binaries during thermal cycling in engine bay environments. |
| Medical Imaging Control Board | Smart Grid RTU Firmware |
Use Scenario: Stores FPGA configuration bitstreams and real-time control firmware for ultrasound beamforming subsystems. IC Role / Device Role / Timing Role: High-reliability SPI flash with uniform 256-KB erase blocks aligned to FPGA partial reconfiguration boundaries. Use Value: 100,000-cycle endurance supports daily field upgrades of regulatory-compliant diagnostic algorithms without wear leveling. | Use Scenario: Hosts encrypted firmware images and metering calibration tables in ANSI C12.22-compliant remote terminal units. IC Role / Device Role / Timing Role: Secure boot storage with 1024-byte OTP for asymmetric key storage and ASP for write-protection of tariff tables. Use Value: Dual-voltage I/O (1.8 V host / 3.3 V core) eliminates external level shifters in legacy 32-bit ARM9 designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL256SAGMFV010 | 256 Mb density, same SO16 package, identical command set and timing - no hardware ECC or ASP. | Lacks OTP and hardware ECC; suitable only for cost-sensitive, non-security-critical boot storage. | Select when firmware size ≤32 MB and security certification (e.g., IEC 62443) is not required. |
| MX25L51245GZC-10G | Micron-compatible pinout but different SFDP structure; no AutoBoot or DDR support; max Quad Read = 40 MBps. | Requires modified driver initialization; lacks industrial temperature grade and AEC-Q100 qualification. | Choose only for existing Micron-based designs where board layout reuse is mandatory and performance margin exists. |
Compared with S25FL256SAGMFV010 and MX25L51245GZC-10G, the S25FL512SDSBHBC13 delivers higher density with built-in ECC and ASP - critical for safety-certified firmware storage - while maintaining full software compatibility with legacy S25FL-P designs.
Availability
S25FL512SDSBHBC13 is available at Aetrix Electronics and suitable for industrial HMIs, automotive ADAS sensor hubs, medical imaging control boards, and smart grid RTUs requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S25FL512SDSBHBC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D centers and ISO/TS 16949-certified wafer fabs.
The FL-S family targets high-reliability embedded boot storage, combining MIRRORBIT™ density scaling with automotive-grade reliability and standardized SPI interfaces for seamless MCU integration.
FAQ
What is the maximum clock frequency supported in DDR mode?
The S25FL512SDSBHBC13 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency, delivering 20 MBps, 40 MBps, and 80 MBps respectively. This requires VIO = VCC = 3.0–3.6 V and proper PCB layout with matched trace lengths for all four I/O lines to meet setup/hold timing.
Does this part require external hardware ECC circuitry?
No. The S25FL512SDSBHBC13 includes on-die hardware ECC that automatically detects and corrects single-bit errors during read operations. No external logic or software intervention is needed - correction occurs transparently within the flash die before data is presented on the I/O lines.
Can the AutoBoot address be changed after programming?
Yes. The AutoBoot start address is stored in a dedicated configuration register (CR3[7:0]) and can be updated via standard Write Enable + Write Status Register commands. Changes persist across power cycles and do not require sector erase - enabling field-upgradable boot configurations.
Is the SO16 package RoHS-compliant and lead-free?
Yes. The S25FL512SDSBHBC13 uses a Pb-free, RoHS-compliant 16-pin SOIC package with matte tin finish on leads. It meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL3) and is compatible with standard SnPb and lead-free reflow profiles per IPC-J-STD-020.
S25FL512SDSBHBC13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SDSBHBC13 FAQ
1.How can I place an order for S25FL512SDSBHBC13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SDSBHBC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SDSBHBC13 reliable?
The price and inventory of S25FL512SDSBHBC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDSBHBC13 is usually 5 days.
3.What payment methods are accepted for S25FL512SDSBHBC13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDSBHBC13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SDSBHBC13?
S25FL512SDSBHBC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SDSBHBC13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SDSBHBC13?
For technical support, including S25FL512SDSBHBC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDSBHBC13 requirements.
6.How does Aetrix verify that S25FL512SDSBHBC13 is sourced from the original manufacturer or authorized distributors?
All S25FL512SDSBHBC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDSBHBC13 meets industry standards.
7.What is the process for return or replacement of S25FL512SDSBHBC13?
All S25FL512SDSBHBC13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDSBHBC13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SDSBHBC13 part is unused and in its original packaging.
Return procedure for S25FL512SDSBHBC13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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