Infineon Technologies S25FL512SDSBHI210
- Part No.:
- S25FL512SDSBHI210
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SDSBHI210.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,838
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FL512SDSBHI210 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC. It supports AutoBoot, CFI, and extended 32-bit addressing for boot code storage in embedded controllers and FPGA configuration.
For engineers reviewing the S25FL512SDSBHI210 datasheet, S25FL512SDSBHI210 pinout, S25FL512SDSBHI210 application, or S25FL512SDSBHI210 equivalent, key selection criteria include Quad DDR read performance (80 MBps), 100,000 program-erase cycles, AEC-Q100 Grade 2 qualification (–40°C to +105°C), OTP security, and SOIC-16 package compatibility with legacy S25FL-A/K/P families.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing and low-power operation. Its dual-voltage I/O (1.65–3.6 V) and core (2.7–3.6 V) support flexible system integration across industrial and automotive platforms.
The command set includes full backward compatibility with S25FL-A/K/P families and extends functionality via DDR modes, AutoBoot execution at power-up/reset, and Advanced Sector Protection (ASP) with password- or boot-code-controlled sector locking - all managed through standard SPI protocols without external logic.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full FPGA bitstreams or multi-stage bootloader images |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables fast firmware decompression and real-time code execution from flash |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and avoids partial-sector erase overhead |
| Endurance | 100,000 program-erase cycles - supports field firmware updates over 10+ years in industrial gateways |
| Data Retention | 20 years minimum - ensures long-term reliability in unpowered storage applications |
| Security | 1024-byte OTP + ASP - allows secure key storage and per-sector write protection without software intervention |
| Temperature Range | –40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - qualified for under-hood automotive ECUs and edge AI accelerators |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, pin-compatible with legacy S25FL-A/K/P devices.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; supports daisy-chaining in multi-device systems |
| SCK | Serial Clock Input | Drives all SPI timing; supports SDR (up to 133 MHz) and DDR (up to 80 MHz) modes |
| SI / IO0 | Serial Input / I/O0 | Primary data input in single/dual/quad modes; functions as bidirectional I/O0 in Multi-I/O mode |
| SO / IO1 | Serial Output / I/O1 | Primary data output in single/dual/quad modes; functions as bidirectional I/O1 in Multi-I/O mode |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection; doubles as I/O2 in quad mode |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing SPI transfer without deselecting chip; doubles as I/O3 in quad mode |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array - decoupling required per datasheet layout guidelines |
| VIO | I/O Supply | 1.65–3.6 V independent I/O voltage - enables interfacing with 1.8 V or 3.3 V host controllers |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically initiates Normal or Quad Read from preconfigured address on power-up/reset - eliminates boot ROM dependency in SoC designs |
| Hardware ECC | On-the-fly single-bit error correction with no CPU overhead - improves reliability in high-radiation or thermally stressed environments |
| Extended Addressing | 32-bit address space - supports >16 MB addressing beyond legacy 24-bit SPI flash limits |
| Advanced Sector Protection | Password- or boot-code-triggered individual sector locking - prevents unauthorized firmware modification during field updates |
| CFI & SFDP Support | Standardized configuration discovery via JEDEC JESD216 - enables automatic driver initialization in Linux and RTOS bootloaders |
Applications
| Automotive ADAS ECU Boot Storage | Industrial PLC Firmware Repository |
|---|---|
Use Scenario: Stores boot firmware and safety-critical calibration data for radar processing units in Level 2+ ADAS systems. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with AEC-Q100 Grade 2 qualification and AutoBoot execution at cold start. Use Value: Ensures deterministic boot within 100 ms using Quad Read (52 MBps), while OTP secures cryptographic keys against tampering. | Use Scenario: Holds field-upgradable ladder logic, HMI assets, and motion control algorithms in modular PLC backplanes. IC Role / Device Role / Timing Role: High-endurance flash for frequent firmware patches; uniform 256-KB sectors simplify update partitioning. Use Value: 100,000 program-erase cycles and 20-year retention guarantee operational continuity across 15+ year product lifecycles. |
| FPGA Configuration Memory | Edge AI Inference Accelerator Code Store |
Use Scenario: Loads bitstream into Xilinx Zynq or Intel Agilex FPGAs during power-on reset in telecom baseband units. IC Role / Device Role / Timing Role: SPI Multi-I/O interface delivers high-speed configuration data; CFI/SFDP enables auto-detection by FPGA configuration controller. Use Value: Quad DDR read at 80 MBps reduces configuration time by >60% vs. legacy SPI flash, accelerating system readiness. | Use Scenario: Stores neural network weights and inference runtime binaries for vision-based smart cameras deployed in factory automation. IC Role / Device Role / Timing Role: Secure, high-bandwidth code store supporting over-the-air model updates with ASP-protected critical layers. Use Value: Integrated hardware ECC and OTP prevent corruption of AI model parameters during wireless updates in electrically noisy environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFI200 | Same die, identical electrical specs, but SOIC-16 package with different suffix (no internal pull-ups on WP#/HOLD#) | Requires external pull-ups for WP#/HOLD# if used in legacy designs expecting internal ones | Select when sourcing from Cypress-branded channels or requiring legacy footprint alignment without functional change |
| Winbond W25Q512JVFIQ | 512 Mb Quad SPI flash with 4KB/32KB/64KB erase blocks; no AutoBoot or ASP; 80 MBps Quad DDR only at 1.8 V I/O | Lacks AutoBoot and advanced sector protection; requires host-side boot management and software-based security | Choose for cost-sensitive consumer applications where hardware security and deterministic boot are not required |
Compared with S25FL512SDSBHI210, the Cypress alternative offers identical functionality with minor packaging differences, while the Winbond part trades hardware security and AutoBoot for lower cost and broader vendor availability - making it suitable only where those features are omitted from system requirements.
Availability
S25FL512SDSBHI210 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, FPGA configuration systems, and edge AI accelerators requiring stable component supply, long-term lifecycle support, and AEC-Q100 compliance.
Supply support for S25FL512SDSBHI210 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.
The FL-S family targets high-reliability embedded systems requiring deterministic boot, hardware security, and extended temperature operation - designed specifically for automotive ECUs, industrial controllers, and FPGA configuration where legacy SPI flash falls short.
FAQ
What is the maximum clock frequency supported in Quad DDR mode?
The S25FL512SDSBHI210 supports Quad DDR read operations at up to 80 MHz, delivering 80 MBps throughput when VIO = VCC = 3.0–3.6 V. This mode requires strict PCB layout adherence to differential clock routing rules and proper termination to maintain signal integrity across the SPI bus.
Does this device require external hardware for ECC correction?
No. The device includes fully integrated hardware ECC that automatically detects and corrects single-bit errors during read operations without CPU involvement or external circuitry. No additional components or firmware drivers are needed to enable this feature - it operates transparently on every read access.
Can the AutoBoot address be reprogrammed in the field?
Yes. The AutoBoot address is stored in a dedicated configuration register (CR3[7:0]) and can be updated via standard SPI Write Register commands. Changes persist across power cycles and do not require OTP programming - enabling dynamic boot source selection during firmware updates or recovery sequences.
Is the SOIC-16 package RoHS-compliant and lead-free?
Yes. The S25FL512SDSBHI210 uses a Pb-free, RoHS-compliant 16-pin SOIC package with matte tin plating. It meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) and is qualified for reflow soldering per IPC/JEDEC J-STD-020 standards without special handling requirements.
S25FL512SDSBHI210 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SDSBHI210 FAQ
1.How can I place an order for S25FL512SDSBHI210 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SDSBHI210 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SDSBHI210 reliable?
The price and inventory of S25FL512SDSBHI210 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDSBHI210 is usually 5 days.
3.What payment methods are accepted for S25FL512SDSBHI210?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDSBHI210 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SDSBHI210?
S25FL512SDSBHI210 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SDSBHI210 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SDSBHI210?
For technical support, including S25FL512SDSBHI210 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDSBHI210 requirements.
6.How does Aetrix verify that S25FL512SDSBHI210 is sourced from the original manufacturer or authorized distributors?
All S25FL512SDSBHI210 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDSBHI210 meets industry standards.
7.What is the process for return or replacement of S25FL512SDSBHI210?
All S25FL512SDSBHI210 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDSBHI210, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SDSBHI210 part is unused and in its original packaging.
Return procedure for S25FL512SDSBHI210:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FL512SDSBHI210 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

