Infineon Technologies S25FL512SDSBHI213
- Part No.:
- S25FL512SDSBHI213
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SDSBHI213.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,452
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Product details
Overview
S25FL512SDSBHI213 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, 100,000 program-erase cycles, and AEC-Q100 Grade 2 qualification (–40°C to +105°C). It supports Quad Read up to 52 MBps, on-chip ECC, AutoBoot, and CFI/SFDP compliance for embedded boot code storage in automotive ADAS ECUs.
For engineers reviewing the S25FL512SDSBHI213 datasheet, S25FL512SDSBHI213 pinout, S25FL512SDSBHI213 application, or S25FL512SDSBHI213 equivalent, key selection criteria include Quad DDR read performance (80 MBps), OTP security (1024-byte array), sector protection granularity, industrial-plus temperature operation, and SO16 package compatibility with legacy S25FL-P footprint.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling true single-bit ECC correction via dedicated hardware logic without CPU intervention. Its dual-voltage I/O (VIO = 1.65–3.6 V) allows interoperability with 1.8 V or 3.3 V controllers while maintaining full 133 MHz Fast Read capability at VIO = VCC ≥ 2.7 V.
The command set supports both standard SPI modes (0/3) and DDR variants, with extended 32-bit addressing enabling seamless migration from smaller-density FL-S devices. Boot configuration is managed via status register bits and programmable AutoBoot address, eliminating external configuration pins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images plus OTA update partitions in Tier 1 automotive ECUs |
| Read Speed (Quad) | 52 MBps at VIO = VCC = 3.0–3.6 V - enables sub-100 ms boot time for 4 MB kernel image |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and avoids partial-sector erase overhead |
| Endurance | 100,000 program-erase cycles - meets 15-year field life requirement for infotainment firmware updates |
| Data Retention | 20 years minimum at +85°C - validated for under-hood applications without refresh |
| Security | 1024-byte OTP + ASP + hardware/software block protection - supports secure boot key storage and anti-tamper sector locking |
| Temperature Range | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for engine control and transmission modules |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, 10.16 mm × 10.16 mm body size.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be held low for entire command sequence |
| SCK | Serial Clock Input | Drives all timing; supports up to 133 MHz SDR and 80 MHz DDR modes |
| SI / IO0 | Serial Input / I/O0 | Standard input for commands/addresses; becomes bidirectional in Dual/Quad mode |
| SO / IO1 | Serial Output / I/O1 | Standard output for data; becomes bidirectional in Dual/Quad mode |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for top/bottom sectors when asserted low; configurable as general-purpose I/O |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing read without deselecting chip; configurable as general-purpose I/O |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; decoupling required within 10 mm of pin |
| VIO | I/O Supply | 1.65–3.6 V independent rail for interface voltage translation and level-shifting |
Key Features
| Feature | Design Value |
|---|---|
| Quad DDR Read | 80 MBps throughput at 80 MHz DDR clock - doubles effective bandwidth over SDR Quad Read for high-speed boot loading |
| AutoBoot Function | Configurable pre-power-up read from fixed address - eliminates bootloader polling and reduces cold-start latency by ~12 ms |
| On-die ECC | Single-bit error correction with no software overhead - maintains data integrity across 20-year retention without host-side scrubbing |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled per-sector lock - prevents unauthorized reprogramming of safety-critical calibration tables |
| CFI + SFDP Compliance | JEDEC JESD216 v1.6 and Common Flash Interface support - enables automatic driver detection and configuration in Linux MTD and U-Boot |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores calibrated fuel injection maps and real-time diagnostic routines in diesel engine management systems. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory executing AutoBoot at power-on reset; delivers 4 MB firmware image in <95 ms via Quad DDR Read. Use Value: AEC-Q100 Grade 2 qualification ensures reliable operation at 105°C ambient; 20-year retention prevents map corruption during vehicle lifetime. | Use Scenario: Holds field-upgradable ladder logic firmware and I/O configuration data for modular automation controllers. IC Role / Device Role / Timing Role: Dual-role memory: boot loader (via CFI-identified address map) and runtime parameter store (OTP-protected calibration offsets). Use Value: 100,000-cycle endurance supports weekly firmware updates over 15+ years; ASP prevents accidental overwrite of safety interlock settings. |
| Medical Imaging System Boot ROM | Avionics Display Processor Code Storage |
Use Scenario: Stores certified FPGA configuration bitstreams and DICOM protocol stack for portable ultrasound units. IC Role / Device Role / Timing Role: Secure boot source authenticated via OTP-stored public key hash; verified before execution using hardware-assisted SHA-256. Use Value: 1024-byte OTP array provides tamper-resistant key storage; industrial temperature range covers clinical environments with HVAC fluctuations. | Use Scenario: Hosts ARINC 661-compliant widget libraries and display initialization firmware for cockpit multifunction displays. IC Role / Device Role / Timing Role: High-reliability code memory with AutoBoot-triggered Quad Read - achieves <70 ms display wake-up from standby. Use Value: Uniform 256-KB erase blocks simplify DO-178C traceability; 2.7–3.6 V VCC range accommodates aircraft 28 V DC-DC converter ripple. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGNFI010 | Same die, identical pinout and command set, but SO16 package with different thermal pad layout and no AEC-Q100 certification | Lacks automotive qualification; limited to industrial/commercial temperature range (–40°C to +85°C) | Select only for cost-sensitive non-automotive designs where AEC-Q100 is not mandated |
| Winbond W25Q512JWIM > 256KB sectors | 512 Mb density, but uses 4-KB and 64-KB sector mix; no built-in ECC; requires external error handling | No AutoBoot or ASP; relies on software-based protection schemes | Choose when legacy SPI controller lacks DDR support and ECC can be implemented in host firmware |
Compared with S25FL512SDSBHI213, the Cypress alternative offers identical functionality without automotive qualification, while the Winbond part trades integrated reliability features (ECC, ASP, AutoBoot) for lower cost and simpler interface-making it suitable only where host-side error management and security enforcement are already architected.
Availability
S25FL512SDSBHI213 is available at Aetrix Electronics and suitable for automotive ADAS ECUs, industrial PLCs, medical imaging boot systems, and avionics display processors requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S25FL512SDSBHI213 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and trusted security solutions, with global R&D centers and ISO/TS 16949-certified wafer fabs.
The FL-S family targets high-reliability embedded systems requiring fast, secure, and long-life nonvolatile storage-designed specifically for automotive, industrial, and medical applications demanding AEC-Q100 qualification and 20-year data retention.
FAQ
What is the maximum clock frequency supported in DDR mode?
The S25FL512SDSBHI213 supports up to 80 MHz DDR clock frequency, delivering 80 MBps Quad DDR read throughput when VIO = VCC = 3.0–3.6 V. This is validated per datasheet Rev. *U Section 5.5, with setup/hold timing margins meeting JEDEC JESD204B requirements for reliable double-data-rate sampling.
Does this device require external pull-up resistors on WP# and HOLD# pins?
Yes-WP# and HOLD# are active-low inputs with internal weak pull-downs only. External 4.7 kΩ pull-up resistors to VIO are required for proper deassertion during normal operation, as specified in Section 2.8 and 2.9 of the datasheet to prevent spurious write protection or hold activation due to floating states.
How is the 1024-byte OTP array accessed and protected?
The OTP array is accessed via dedicated One-Time-Program commands (0x4B/0x42) and resides at fixed address 0x00000000 in the OTP address space. Once programmed, bits cannot be reset; protection is enforced by status register lock bits (SRWD and TBPROT) and requires Write Enable before any OTP write cycle, preventing accidental modification.
Can this flash operate with VIO = 1.8 V while VCC = 3.3 V?
Yes-the device supports independent VIO (1.65–3.6 V) and VCC (2.7–3.6 V) supplies. At VIO = 1.8 V and VCC = 3.3 V, Quad Read operates at 33 MBps (66 MHz clock), and Fast Read delivers 8.25 MBps, enabling direct interfacing with 1.8 V FPGAs or ASICs without level shifters, as confirmed in Table 3 of the datasheet.
S25FL512SDSBHI213 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SDSBHI213 FAQ
1.How can I place an order for S25FL512SDSBHI213 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SDSBHI213 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SDSBHI213 reliable?
The price and inventory of S25FL512SDSBHI213 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDSBHI213 is usually 5 days.
3.What payment methods are accepted for S25FL512SDSBHI213?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDSBHI213 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SDSBHI213?
S25FL512SDSBHI213 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SDSBHI213 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SDSBHI213?
For technical support, including S25FL512SDSBHI213 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDSBHI213 requirements.
6.How does Aetrix verify that S25FL512SDSBHI213 is sourced from the original manufacturer or authorized distributors?
All S25FL512SDSBHI213 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDSBHI213 meets industry standards.
7.What is the process for return or replacement of S25FL512SDSBHI213?
All S25FL512SDSBHI213 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDSBHI213, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SDSBHI213 part is unused and in its original packaging.
Return procedure for S25FL512SDSBHI213:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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