Infineon Technologies S25FL512SDSBHMC10
- Part No.:
- S25FL512SDSBHMC10
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SDSBHMC10.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
S25FL512SDSBHMC10 from Infineon is a 512 Mb (64 MB) SPI Multi-I/O serial NOR flash memory with 3.0 V core supply, supporting Quad and DDR read modes up to 80 MHz (80 MBps), uniform 256-KB sector erase, and integrated hardware ECC. It operates across industrial temperature range (–40°C to +85°C) in a 16-pin SOIC package and is used for firmware storage in embedded controllers and boot code execution in automotive ECUs.
For engineers reviewing the S25FL512SDSBHMC10 datasheet, S25FL512SDSBHMC10 pinout, S25FL512SDSBHMC10 application, or S25FL512SDSBHMC10 equivalent, key selection criteria include Quad/DDR read bandwidth, 256-KB uniform sector granularity, OTP-based secure boot configuration, AEC-Q100 Grade 3 qualification, and compatibility with legacy S25FL-A/K/P footprints.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing and low-power operation. Its dual-voltage I/O interface (VIO = 1.65–3.6 V, VCC = 2.7–3.6 V) supports mixed-signal SoC integration while maintaining full command set compatibility with prior FL-S families.
The control logic integrates AutoBoot functionality-configurable to execute Normal or Quad Read at power-up/reset-and supports Common Flash Interface (CFI) and JEDEC JESD216 SFDP for standardized parameter discovery. Hardware ECC corrects single-bit errors transparently during read operations without software overhead.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images including bootloader, OS, and application binaries in resource-constrained microcontrollers. |
| Read Bandwidth (Quad DDR) | 80 MBps at 80 MHz - enables sub-100 ms firmware load times for real-time boot sequences. |
| Erase Granularity | Uniform 256-KB sectors - simplifies wear leveling and avoids partial-sector update complexity in OTA firmware updates. |
| Endurance | 100,000 program-erase cycles - supports frequent field firmware upgrades over 10+ years of automotive ECU service life. |
| Data Retention | 20 years minimum at 85°C - ensures reliable long-term storage of calibration data and security keys without refresh. |
| Security | 1024-byte OTP array + ASP - allows immutable root-of-trust configuration and password-protected sector locking for secure boot enforcement. |
| Temperature Range | –40°C to +85°C (Industrial) - qualified for under-hood automotive modules and industrial HMIs without derating. |
| Supply Voltages | VCC: 2.7–3.6 V; VIO: 1.65–3.6 V - enables direct interfacing with 1.8 V or 3.3 V host processors without level shifters. |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, standard footprint compatible with legacy S25FL-A/K/P devices.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; supports daisy-chaining multiple flash devices on shared bus. |
| SCK | Serial Clock Input | Edge-triggered clock for SDR (modes 0/3) and DDR transfers; max 133 MHz for Fast Read, 80 MHz for DDR modes. |
| SI / IO0 | Serial Input / I/O0 | Primary data input in single/dual mode; functions as bidirectional I/O0 in Quad mode for address/data multiplexing. |
| SO / IO1 | Serial Output / I/O1 | Primary data output in single/dual mode; functions as bidirectional I/O1 in Quad mode. |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; doubles as I/O2 in Quad mode. |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing transfer without deselecting chip; doubles as I/O3 in Quad mode. |
| RESET# | Hardware Reset Input | Asynchronous reset of internal state machine; required for recovery after invalid command sequences. |
| VCC | Core Power Supply | 2.7–3.6 V supply powering array and logic; decoupling capacitor placement critical for stable erase/write margins. |
| VIO | I/O Power Supply | 1.65–3.6 V supply setting I/O voltage level; independent of VCC for mixed-voltage system interfacing. |
| VSS | Ground | Common reference for VCC and VIO; separate analog/digital ground routing recommended for noise-sensitive applications. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Configurable automatic Normal or Quad Read at power-up/reset from preselected address - eliminates host CPU boot delay and simplifies cold-start sequencing. |
| Hardware ECC | On-the-fly single-bit error correction during reads - removes need for external error-checking logic or software CRC overhead in safety-critical systems. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enforces secure firmware partitioning (e.g., bootloader vs. application) without permanent fuse commitment. |
| JEDEC JESD216 SFDP Support | Standardized parameter table accessible via SPI - enables automatic driver configuration in Linux MTD and RTOS flash abstraction layers without hard-coded timing constants. |
| Uniform 256-KB Erase Blocks | Fixed-size sectors simplify flash translation layer (FTL) design and eliminate fragmentation issues common in legacy flash with variable block sizes. |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores calibrated engine maps, diagnostic routines, and OTA update payloads in AEC-Q100 Grade 3 qualified module. IC Role / Device Role / Timing Role: Nonvolatile boot memory executing Quad Read at power-on to load bootloader into MCU SRAM within 50 ms. Use Value: 256-KB uniform sectors allow atomic firmware patching; 20-year retention guarantees calibration integrity over vehicle lifetime. | Use Scenario: Holds ladder logic firmware, HMI assets, and configuration databases in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: SPI-connected firmware repository accessed by ARM Cortex-M7 host via DMA-driven Quad Read bursts. Use Value: 80 MBps DDR read rate reduces firmware load latency by >60% vs. legacy SPI flash, improving PLC restart time. |
| Medical Imaging System Boot Loader | Avionics Display Processor Code Storage |
Use Scenario: Stores certified boot loader and FPGA configuration bitstreams in Class II medical device requiring traceable firmware integrity. IC Role / Device Role / Timing Role: Secure silicon region (OTP) holds cryptographic keys; ASP locks bootloader sector against unauthorized modification. Use Value: Hardware ECC ensures bitstream reliability during radiation-prone operation; 100K-cycle endurance supports periodic regulatory revalidation. | Use Scenario: Hosts display controller firmware and font libraries in DO-254-certified cockpit display units operating at –40°C to +70°C. IC Role / Device Role / Timing Role: Dual-voltage I/O (VIO = 1.8 V) interfaces directly with 1.8 V display ASIC without level shifters. Use Value: SOIC package enables manual rework in high-reliability assembly; AEC-Q100 Grade 2 qualification covers extended temperature margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFV00 | Same die, identical electrical specs and pinout; differs only in marking and tape-and-reel packaging. | No functional difference; suitable for drop-in replacement where packaging format is not constrained. | Select when sourcing from Cypress-distributed channels or requiring specific reel orientation. |
| Winbond W25Q512JVFIQ | 512 Mb Quad SPI flash with 4KB/32KB/64KB erase blocks; no DDR support; lacks ASP and OTP security features. | Lower-cost option for non-secure, non-automotive applications where uniform 256KB erase and hardware ECC are not required. | Choose only if security, endurance, and deterministic erase timing are not design requirements. |
Compared with S25FL512SDSBHMC10, the Cypress alternative offers identical functionality with packaging variance, while the Winbond part trades security and uniform erase for cost reduction - making it unsuitable for AEC-Q100 or safety-certified designs.
Availability
S25FL512SDSBHMC10 is available at Aetrix Electronics and suitable for automotive ECU firmware storage, industrial PLC boot loading, and medical imaging system boot loader applications requiring stable component supply and long-term lifecycle assurance.
Supply support for S25FL512SDSBHMC10 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure microcontrollers, with global R&D and manufacturing infrastructure.
The FL-S family targets high-reliability embedded systems requiring deterministic flash performance, AEC-Q100 qualification, and hardware-enforced security - specifically designed for automotive, industrial, and medical applications demanding long data retention and robust program-erase endurance.
FAQ
What is the maximum clock frequency supported for Quad DDR read operations?
The S25FL512SDSBHMC10 supports Quad DDR read operations at up to 80 MHz, delivering 80 MBps bandwidth when VIO = VCC = 3.0–3.6 V. This specification is validated per AC timing test conditions in the official Infineon datasheet (Rev. *U, Section 5.5), and requires strict setup/hold timing compliance on SCK edges for reliable DDR sampling.
Does this device support hardware reset via the RESET# pin, and what is its behavior?
Yes, the RESET# pin provides asynchronous hardware reset of the internal state machine and command parser. When asserted low, it terminates all ongoing operations (read, program, erase), clears status registers, and returns the device to standby mode. After release, the device remains in standby until CS# is asserted, with no automatic AutoBoot initiation unless previously configured.
How is the 1024-byte OTP array used in secure boot implementations?
The OTP array stores immutable configuration data such as public key hashes, boot policy flags, and cryptographic seeds. Once programmed, it cannot be erased or rewritten. In secure boot flows, the bootloader verifies firmware signatures using keys derived from OTP-stored values, enforcing chain-of-trust before execution - a capability confirmed in Infineon Application Note AN229324.
Can the S25FL512SDSBHMC10 operate with VIO = 1.8 V while VCC = 3.3 V, and is this configuration validated?
Yes, the device supports split-rail operation with VIO = 1.65–2.7 V (including 1.8 V) and VCC = 2.7–3.6 V (e.g., 3.3 V). This configuration is explicitly validated in the datasheet's "Operating Ranges" table (Section 4.3) and enables direct interfacing with 1.8 V FPGAs or ASICs without level-shifting circuitry, reducing BOM count and signal integrity risk.
S25FL512SDSBHMC10 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SDSBHMC10 FAQ
1.How can I place an order for S25FL512SDSBHMC10 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SDSBHMC10 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SDSBHMC10 reliable?
The price and inventory of S25FL512SDSBHMC10 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDSBHMC10 is usually 5 days.
3.What payment methods are accepted for S25FL512SDSBHMC10?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDSBHMC10 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SDSBHMC10?
S25FL512SDSBHMC10 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SDSBHMC10 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SDSBHMC10?
For technical support, including S25FL512SDSBHMC10 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDSBHMC10 requirements.
6.How does Aetrix verify that S25FL512SDSBHMC10 is sourced from the original manufacturer or authorized distributors?
All S25FL512SDSBHMC10 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDSBHMC10 meets industry standards.
7.What is the process for return or replacement of S25FL512SDSBHMC10?
All S25FL512SDSBHMC10 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDSBHMC10, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SDSBHMC10 part is unused and in its original packaging.
Return procedure for S25FL512SDSBHMC10:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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