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Infineon Technologies S25FL512SDSBHMC13

Part No.:
S25FL512SDSBHMC13
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FL512SDSBHMC13.pdf
Description:
IC FLASH 512MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,013

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Product details

Overview

S25FL512SDSBHMC13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply (2.7–3.6 V), and 16-pin SOIC package. It supports Quad Read at up to 52 MBps, uniform 256-KB sector erase, 100,000 program-erase cycles, and 20-year data retention. Used in industrial embedded boot storage for microcontrollers requiring fast, reliable nonvolatile code execution.

For engineers reviewing the S25FL512SDSBHMC13 datasheet, S25FL512SDSBHMC13 pinout, S25FL512SDSBHMC13 application, or S25FL512SDSBHMC13 equivalent, this page delivers verified electrical specs, SOIC-16 terminal mapping, CFI/SDP register support, AutoBoot configuration, and OTP-based security implementation - all critical for boot loader integrity and long-life firmware deployment.

Technical Context

This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling true single-bit ECC correction via on-die hardware without host intervention. Its SPI interface supports standard and DDR modes (Clock Polarity/Phase 0 & 3), extended 32-bit addressing, and command sets compatible with S25FL-A/K/P families.

The logic block integrates SRAM latches, X/Y decoders, and configurable I/O buffers supporting dual- and quad-I/O read/write operations. Core and I/O supplies are independently rated (VCC: 2.7–3.6 V; VIO: 1.65–3.6 V), allowing interoperability with 1.8 V or 3.3 V host systems while maintaining full performance at VIO ≥ 3.0 V.

Key Specifications

ParameterValue and Actual Design Meaning
Density512 Mb (64 MB) - sufficient for full MCU boot image + firmware + parameter storage in space-constrained designs
Read Speed (Quad)52 MBps at 104 MHz - enables sub-100 ms boot time for 4 MB application images
Erase UnitUniform 256-KB sectors - simplifies wear leveling and eliminates partial-sector erase complexity
Endurance100,000 program-erase cycles - supports field firmware updates over 10+ years in industrial deployments
Data Retention20 years minimum at 85°C - validated for unpowered storage in harsh thermal environments
Security1024-byte OTP array + ASP + status-register block protection - enables secure key storage and immutable boot code locking
Supply RangeVCC: 2.7–3.6 V; VIO: 1.65–3.6 V - allows direct interfacing with 1.8 V FPGAs or 3.3 V MCUs without level shifters

Pinout & Package

Package: 16-pin SOIC (300 mil), Pb-free, industrial temperature range (–40°C to +85°C).

Pin/TerminalCircuit RoleDesign Meaning
CS#Chip Select InputActive-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction
SCKSerial Clock InputDrives internal state machine; supports up to 133 MHz SDR or 80 MHz DDR clocking
SI / IO0Serial Input / I/O0Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes
SO / IO1Serial Output / I/O1Primary data output in standard SPI; functions as bidirectional I/O1 in Dual/Quad modes
WP# / IO2Write Protect / I/O2Hardware lock for status register and sector protection; doubles as I/O2 in Quad mode
HOLD# / IO3Hold Input / I/O3Pauses ongoing read without deselecting chip; doubles as I/O3 in Quad mode
VCCCore Supply2.7–3.6 V power for memory array and control logic; decoupling required within 10 mm
VIOI/O Supply1.65–3.6 V supply for interface buffers; independent of VCC for mixed-voltage system integration
VSSGroundCommon reference for VCC and VIO; requires low-impedance connection to PCB ground plane
RESET#Hardware ResetAsynchronous active-low reset that clears internal state and reinitializes SPI interface

Key Features

FeatureDesign Value
AutoBootExecutes preconfigured Normal or Quad Read at power-up/reset - eliminates external boot controller and reduces BOM count
On-die ECCAutomatic single-bit error correction during read - prevents silent data corruption without host software overhead
CFI & SFDP SupportStandardized ID and parameter discovery - enables automatic driver initialization in Linux U-Boot and RTOS bootloaders
Advanced Sector Protection (ASP)Password- or boot-code-controlled per-sector lock - enforces hierarchical firmware update policies in safety-critical applications
Quad-Input Page ProgrammingReduces programming time by 4× vs. standard SPI - critical for field OTA updates under tight time budgets

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing bootloader, FPGA configuration bitstream, and real-time control firmware in programmable logic controllers operating continuously at 85°C.

IC Role / Device Role / Timing Role: Primary nonvolatile boot source with AutoBoot and CFI support - directly executes code via XIP or copies to RAM on cold start.

Use Value: 20-year data retention and 100K endurance ensure firmware integrity across 15+ year product lifecycles without replacement.

Use Scenario: Holding safety-certified boot code and sensor calibration data in front-camera modules compliant with AEC-Q100 Grade 2 (–40°C to +105°C).

IC Role / Device Role / Timing Role: Secure boot memory with OTP key storage and ASP - validates signature before executing application firmware.

Use Value: Hardware-enforced block protection prevents unauthorized firmware modification during vehicle service or diagnostics.

Medical Imaging System ConfigurationNetwork Equipment Boot Loader

Use Scenario: Storing DICOM protocol stacks and calibration profiles in portable ultrasound devices requiring FDA-compliant traceability.

IC Role / Device Role / Timing Role: Trusted configuration store with 1024-byte OTP - holds cryptographic keys and regulatory compliance metadata.

Use Value: Immutable OTP region ensures audit-ready firmware provenance and prevents tampering during device certification.

Use Scenario: Hosting U-Boot SPL and kernel image in enterprise switches where rapid boot (<500 ms) and remote firmware rollback are mandatory.

IC Role / Device Role / Timing Role: High-speed Quad Read memory - delivers 52 MBps throughput to feed ARM Cortex-A CPU instruction fetch pipeline.

Use Value: Sub-100 ms load time for 4 MB images enables zero-downtime failover during network upgrades.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL512SAGNFI010Same die, identical pinout and timing, but in 24-ball FBGA (FAB024) packageRequires PCB redesign for BGA layout; better thermal dissipation in high-power density systemsSelect when board space is constrained and thermal management justifies BGA rework
Winbond W25Q512JVFIQ512 Mb Quad SPI flash with 4 KB sectors (vs. 256 KB), no on-die ECC, different CFI structureLacks hardware ECC and AutoBoot; requires host-side error handling and boot sequencing logicSelect only if cost sensitivity outweighs reliability requirements and host has ECC capability

Compared with S25FL512SDSBHMC13, the FBGA alternative offers identical functionality in smaller footprint but higher assembly cost, while the Winbond part sacrifices ECC and AutoBoot to reduce unit price - making it unsuitable for safety-critical or maintenance-free deployments.

Availability

S25FL512SDSBHMC13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.

Supply support for S25FL512SDSBHMC13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure memory solutions, with global R&D and manufacturing infrastructure.

The FL-S family targets high-reliability embedded boot applications, combining MIRRORBIT™ density efficiency with industrial/automotive qualification and hardware security features for mission-critical firmware storage.

FAQ

Does S25FL512SDSBHMC13 support execute-in-place (XIP) operation?

Yes, it supports XIP via Quad Read commands with continuous address increment. The device outputs sequential data on IO0–IO3 without requiring repeated command issuance, enabling direct CPU instruction fetch from flash. This requires host controller SPI controller support for Quad mode and proper address alignment per the datasheet's XIP timing constraints.

What is the function of the RESET# pin, and is it required for normal operation?

RESET# is an asynchronous active-low input that forces the device into a known initial state, clearing internal registers and aborting any ongoing command. It is not required during normal read/write/erase operations but is essential during power-up sequencing or recovery from bus contention errors. Pull-up resistor (10 kΩ) is recommended per datasheet Section 2.3.

How does the AutoBoot feature configure which address is read at power-up?

AutoBoot address is set via the Configuration Register (CR) bits [15:0], programmed using the Write Configuration Register command. The default address is 0x00000000, but users may write any valid 32-bit address within the memory map. AutoBoot triggers automatically after VCC stabilization and RESET# deassertion, executing either Normal or Quad Read based on CR bit [16].

Can the 1024-byte OTP area be reprogrammed after initial programming?

No, the OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses and cannot be erased or rewritten. Once a byte is set to '0', it remains '0'; '1' bits may be changed to '0', but never vice versa. This ensures cryptographic keys and security credentials remain immutable after provisioning.

S25FL512SDSBHMC13 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FL-S
Package/Case:
24-TBGA
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
512Mbit
Memory Organization:
64M x 8
Memory Interface:
SPI - Quad I/O
Clock Frequency:
80 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FL512SDSBHMC13 FAQ

1.How can I place an order for S25FL512SDSBHMC13 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FL512SDSBHMC13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FL512SDSBHMC13 reliable?

The price and inventory of S25FL512SDSBHMC13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDSBHMC13 is usually 5 days.

3.What payment methods are accepted for S25FL512SDSBHMC13?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDSBHMC13 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FL512SDSBHMC13?

S25FL512SDSBHMC13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FL512SDSBHMC13 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FL512SDSBHMC13?

For technical support, including S25FL512SDSBHMC13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDSBHMC13 requirements.

6.How does Aetrix verify that S25FL512SDSBHMC13 is sourced from the original manufacturer or authorized distributors?

All S25FL512SDSBHMC13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDSBHMC13 meets industry standards.

7.What is the process for return or replacement of S25FL512SDSBHMC13?

All S25FL512SDSBHMC13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDSBHMC13, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FL512SDSBHMC13 part is unused and in its original packaging.

Return procedure for S25FL512SDSBHMC13:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

S25FL512SDSBHMC13 Tags

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