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Infineon Technologies S25FL512SDSBHV210
- Part No.:
- S25FL512SDSBHV210
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FL512SDSBHV210.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,331
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Product details
Overview
S25FL512SDSBHV210 from Infineon is a 512 Mb (64 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sector architecture, and integrated hardware ECC. It supports Quad Read up to 52 MBps, AutoBoot at power-up, and operates across industrial temperature range (–40°C to +85°C) in SO16 package. Used for firmware storage in embedded controllers and boot code execution in industrial gateways.
For engineers reviewing the S25FL512SDSBHV210 datasheet, S25FL512SDSBHV210 pinout, S25FL512SDSBHV210 application, or S25FL512SDSBHV210 equivalent, key selection criteria include Quad DDR read performance (80 MBps), OTP security (1024-byte array), AEC-Q100 Grade 3 qualification, and compatibility with S25FL-P family footprint and command set.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with single-bit error correction via on-die ECC logic. Its dual-voltage I/O (VIO = 1.65–3.6 V, VCC = 2.7–3.6 V) supports interoperability with mixed-signal SoCs and low-power microcontrollers.
The SPI interface supports all four clock modes (CPOL/CPHA 0/0 and 1/1), extended 32-bit addressing, and both SDR and DDR protocols. Command execution includes programmable AutoBoot from configurable address, CFI-compliant configuration registers, and JEDEC JESD216 SFDP support for dynamic parameter discovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - sufficient for full firmware images and secure boot partitions in resource-constrained edge devices. |
| Read Speed (Quad) | 52 MBps at VIO = VCC = 3.0–3.6 V - enables fast application loading without external parallel bus interface. |
| Erase Unit | Uniform 256-KB sectors - simplifies wear leveling and avoids fragmentation in OTA update systems. |
| Endurance | 100,000 program-erase cycles - supports frequent field firmware updates over 10+ year product lifecycle. |
| Data Retention | 20 years minimum - ensures long-term reliability in unpowered storage for industrial control logs and calibration data. |
| Security | 1024-byte OTP + ASP + Status Register block protection - provides immutable root-of-trust keys and selective sector lockdown. |
| Temperature Range | –40°C to +85°C (Industrial) - validated for deployment in factory automation PLCs and outdoor telecom equipment. |
Pinout & Package
Package: 16-pin SOIC (300 mil), Pb-free, RoHS-compliant, body size 10.16 × 7.5 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate transaction. |
| SCK | Serial Clock Input | Master-generated clock; supports up to 133 MHz SDR and 80 MHz DDR for timing-critical boot sequences. |
| SI / IO0 | Serial Input / I/O0 | Primary data input in standard SPI; functions as bidirectional I/O0 in Dual/Quad modes for bandwidth scaling. |
| SO / IO1 | Serial Output / I/O1 | Primary data output in standard SPI; serves as bidirectional I/O1 in Dual/Quad for concurrent read/write paths. |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection bits; doubles as I/O2 in Quad mode for 4-line data transfer. |
| HOLD# / IO3 | Hold Input / I/O3 | Pauses ongoing SPI transaction without deselecting chip; repurposed as I/O3 in Quad mode for full x4 I/O width. |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; decoupling required within 10 mm of pin per layout guidelines. |
| VIO | I/O Supply | 1.65–3.6 V independent I/O rail - allows direct interfacing with 1.8 V or 3.3 V host processors without level shifters. |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically executes Normal or Quad Read at power-up/reset from user-defined address - eliminates external boot controller and reduces BOM count. |
| Hardware ECC | On-die single-bit error correction with automatic syndrome generation - removes need for software ECC overhead in real-time boot loaders. |
| Quad DDR Interface | 80 MBps read throughput using double-data-rate on four I/O lines - matches bandwidth of legacy parallel NOR while retaining serial footprint. |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled individual sector locking - enables secure multi-tenant firmware partitioning in gateway platforms. |
| JEDEC JESD216 SFDP Support | Standardized parameter table accessible via SPI - allows runtime detection of density, timing, and feature set by host bootloader without hard-coded assumptions. |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing and executing ladder logic firmware and I/O configuration tables in programmable logic controllers deployed in harsh factory environments. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with AutoBoot and ECC-protected read path ensuring deterministic startup under voltage transients. Use Value: 20-year data retention and 100K endurance guarantee firmware integrity across decades of scheduled maintenance cycles without replacement. | Use Scenario: Hosting boot code and sensor fusion algorithms for camera-based driver assistance modules requiring AEC-Q100 Grade 2 qualification. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 (–40°C to +105°C) serial flash providing Quad Read DDR access to meet <500 ms cold-boot timing requirement. Use Value: 80 MBps DDR read speed and hardware ECC eliminate external RAM copy step and reduce boot latency by 35% vs. legacy SPI NOR. |
| Medical Imaging Control Board | Smart Grid Communication Module |
Use Scenario: Secure storage of FPGA configuration bitstreams and regulatory-compliant diagnostic firmware in portable ultrasound systems. IC Role / Device Role / Timing Role: Trusted execution anchor with 1024-byte OTP for cryptographic key injection and ASP for isolated diagnostic partition. Use Value: OTP-based root key storage prevents cloning; ASP enforces separation between FDA-certified and field-upgradable firmware regions. | Use Scenario: Firmware and communication stack storage in DIN-rail-mounted smart meters with remote OTA update capability. IC Role / Device Role / Timing Role: High-endurance flash supporting 10K+ field updates over 15-year service life, with uniform 256-KB erase blocks aligned to packet-based update protocol. Use Value: Uniform sector sizing simplifies delta-update implementation; 100K cycle rating exceeds IEC 62056-61 field update frequency requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL512SAGMFV201 | Same density and command set, but FBGA (FAB024) package and –40°C to +105°C Industrial Plus rating. | Preferred for space-constrained designs requiring thermal margin beyond 85°C ambient, e.g., enclosed motor drives. | Select when board area is limited and thermal derating headroom is needed; requires PCB redesign for BGA rework. |
| MX25L51245GZC-10G | 512 Mb Macronix part with 104 MHz Quad Read (52 MBps), no DDR mode, no AutoBoot, and no integrated ECC. | Suitable for cost-sensitive consumer IoT where firmware updates are infrequent and external ECC handling is acceptable. | Choose only if DDR, AutoBoot, and on-die ECC are not required; verify software compatibility with non-JEDEC SFDP parameter discovery. |
Compared with S25FL512SDSBHV210, the Infineon S25FL512SAGMFV201 offers identical functionality in a smaller BGA footprint with extended temperature range, while the Macronix MX25L51245GZC-10G sacrifices DDR, AutoBoot, and hardware ECC to reduce unit cost - making it viable only in non-safety-critical, thermally benign applications.
Availability
S25FL512SDSBHV210 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging control board applications requiring stable component supply, long-term lifecycle support, and AEC-Q100-compliant sourcing.
Supply support for S25FL512SDSBHV210 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and secure embedded solutions, with global R&D and manufacturing infrastructure.
The S25FL-S family targets high-reliability embedded systems requiring secure, high-speed serial flash with automotive-grade qualification, ECC resilience, and seamless migration from legacy parallel NOR architectures.
FAQ
What is the maximum clock frequency supported in Quad DDR mode?
The S25FL512SDSBHV210 supports Quad DDR operation at up to 80 MHz, delivering 80 MBps read throughput when VIO and VCC are both set to 3.0–3.6 V. This mode requires precise setup/hold timing compliance per AC specification Table 5-9 in the datasheet, and is enabled via Configuration Register bit CR3[1].
Does this part require an external voltage regulator for VIO?
No - VIO is independently configurable from 1.65 V to 3.6 V and may be tied directly to the host processor's I/O rail (e.g., 1.8 V or 3.3 V), eliminating need for dedicated LDO. However, separate decoupling capacitors (100 nF ceramic) are required adjacent to both VCC and VIO pins per layout recommendations.
How is the 1024-byte OTP array accessed and protected?
The OTP array is accessed via dedicated One-Time-Program commands (0x4B and 0x42) and resides at fixed address 0x00000000 in OTP address space. Once programmed, bits cannot be reset. Protection is enforced by Status Register bit SRP0/SRP1 and hardware WP# assertion - permanent lock occurs after OTP write completion unless SRP bits are cleared beforehand.
Can AutoBoot be disabled or reconfigured after initial programming?
Yes - AutoBoot behavior (Normal vs. Quad Read, start address, and enable/disable state) is stored in the Configuration Register (CR2[7:6] and CR3[7:0]) and can be modified via Write Enable + Write Configuration Register commands. Changes persist across power cycles and do not require OTP programming, allowing field-updatable boot strategies.
S25FL512SDSBHV210 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FL512SDSBHV210 FAQ
1.How can I place an order for S25FL512SDSBHV210 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SDSBHV210 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SDSBHV210 reliable?
The price and inventory of S25FL512SDSBHV210 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDSBHV210 is usually 5 days.
3.What payment methods are accepted for S25FL512SDSBHV210?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDSBHV210 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SDSBHV210?
S25FL512SDSBHV210 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SDSBHV210 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SDSBHV210?
For technical support, including S25FL512SDSBHV210 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDSBHV210 requirements.
6.How does Aetrix verify that S25FL512SDSBHV210 is sourced from the original manufacturer or authorized distributors?
All S25FL512SDSBHV210 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDSBHV210 meets industry standards.
7.What is the process for return or replacement of S25FL512SDSBHV210?
All S25FL512SDSBHV210 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDSBHV210, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SDSBHV210 part is unused and in its original packaging.
Return procedure for S25FL512SDSBHV210:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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