Infineon Technologies S25FL512SDSMFBG13
- Part No.:
- S25FL512SDSMFBG13
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 16-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
S25FL512SDSMFBG13.pdf
- Description:
- IC FLASH 512MBIT SPI/QUAD 16SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:2,301
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Product details
Overview
S25FL512SDSMFBG13 from Infineon is a 512 Mb (64 MB) serial NOR flash memory with SPI Multi-I/O interface, 3.0 V core supply, uniform 256-KB sectors, Quad Read up to 52 MBps, and integrated hardware ECC for single-bit error correction. It supports AutoBoot, CFI, and DDR read modes, and is qualified for Industrial Plus (–40°C to +105°C) operation in FBGA package.
For engineers reviewing the S25FL512SDSMFBG13 datasheet, S25FL512SDSMFBG13 pinout, S25FL512SDSMFBG13 application, or S25FL512SDSMFBG13 equivalent, key selection criteria include Quad/DDR read performance, 100K program-erase cycles, OTP security, sector protection granularity, and AEC-Q100 Grade 2 qualification for extended-temperature embedded systems.
Technical Context
This device implements Infineon's 65 nm MIRRORBIT™ technology with Eclipse™ architecture, enabling high-density nonvolatile storage with deterministic timing and low-latency command execution. Its dual-voltage I/O (1.65–3.6 V) and core (2.7–3.6 V) support flexible system-level voltage scaling while maintaining full SPI command compatibility across S25FL-A/K/P families.
The logic block integrates SRAM latches, X/Y decoders, and dedicated control logic for simultaneous address decoding and data path management. All read, program, and erase operations are managed by on-die state machines with automatic ECC generation and verification-no host-side firmware intervention required for bit-error recovery.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 512 Mb (64 MB) - supports boot code, firmware image, and configuration storage in resource-constrained embedded hosts |
| Read Speed (Quad) | 52 MBps at 104 MHz - enables fast application loading and real-time firmware updates over standard SPI |
| Erase Unit | Uniform 256-KB sectors - simplifies partitioning for OTA update staging and secure firmware rollback |
| Endurance | 100,000 program-erase cycles - ensures reliable field operation over 10+ years in industrial logging or gateway firmware storage |
| Data Retention | 20 years minimum - guarantees long-term integrity of calibration data, device identity, and encrypted keys |
| ECC | On-die hardware single-bit correction - eliminates need for external error-handling logic or redundant storage layers |
| Temperature Range | –40°C to +105°C (Industrial Plus) - validated for continuous operation in enclosed edge compute enclosures and automotive ECUs |
Pinout & Package
Package: 24-ball FBGA (FAB024 footprint, 6 × 8 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select Input | Active-low enable for SPI command decoding; must be asserted before SCK edge to initiate valid transaction |
| SCK | Serial Clock Input | Drives all timing-critical operations; supports up to 133 MHz SDR and 80 MHz DDR modes |
| IO0 (SI) | Serial Input / I/O0 | Primary data input during programming; also serves as first I/O line in Dual/Quad modes |
| IO1 (SO) | Serial Output / I/O1 | Primary data output during reads; functions as second I/O line in multi-I/O commands |
| IO2 (WP#) | Write Protect / I/O2 | Hardware-enabled sector lock when pulled low; doubles as third I/O line in Quad mode |
| IO3 (HOLD#) | Hold Input / I/O3 | Pauses ongoing read without deselecting device; also acts as fourth I/O line in Quad mode |
| VCC | Core Supply | 2.7–3.6 V power for internal logic and array; independent of I/O voltage rail |
| VIO | I/O Supply | 1.65–3.6 V selectable rail for interface signaling-enables mixed-voltage system integration |
| RESET# | Hardware Reset | Asynchronous active-low reset that clears internal state and reinitializes command parser |
| VSS | Ground | Common reference for both core and I/O domains; requires low-impedance PCB return path |
Key Features
| Feature | Design Value |
|---|---|
| AutoBoot Execution | Automatically executes Normal or Quad Read at power-up/reset from preconfigured address-reduces boot loader complexity and startup latency |
| Quad-Input Page Programming (QPP) | Enables full 512-byte page writes using all four I/O lines simultaneously-improves write throughput in low-clock-rate microcontrollers |
| Advanced Sector Protection (ASP) | Per-sector lock controlled via boot code or password-supports hierarchical firmware security models without external secure elements |
| OTP Array (1024 bytes) | Dedicated one-time-programmable space for cryptographic keys, device serials, or calibration constants-physically isolated from main array |
| JEDEC JESD216 SFDP Support | Standardized parameter table accessible via SPI-enables automatic driver configuration and runtime flash characterization |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware images and configuration tables for programmable logic controllers operating in factory-floor environments with wide temperature swings and EMI exposure. IC Role / Device Role / Timing Role: Primary nonvolatile boot and runtime code storage with deterministic read latency and sector-level update isolation. Use Value: 256-KB uniform sectors allow atomic firmware swaps; 100K endurance supports frequent field updates; +105°C rating ensures reliability in uncooled control cabinets. | Use Scenario: Hosting boot code and sensor fusion algorithms for camera/radar processing units in advanced driver-assistance systems. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified boot memory providing secure, fast Quad Read access to critical startup routines. Use Value: Hardware ECC prevents silent corruption of safety-critical code; ASP and OTP protect bootloader integrity against tampering or accidental overwrite. |
| Edge Gateway OTA Update Storage | Medical Imaging System Configuration |
Use Scenario: Holding staged firmware images and delta patches for secure over-the-air updates in cellular-connected industrial gateways. IC Role / Device Role / Timing Role: Dual-bank capable storage with independent sector locking-enables background download while running current firmware. Use Value: Uniform 256-KB erase blocks simplify patch alignment; 20-year retention preserves calibration and regulatory compliance data across product lifecycle. | Use Scenario: Storing DICOM configuration profiles, calibration coefficients, and user interface assets in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: High-reliability, low-power nonvolatile memory for medical-grade data persistence with audit-trail requirements. Use Value: 0.07 mA standby current extends battery life in portable devices; OTP secures FDA-mandated device identity and revision history. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL512SAGMFI10 | Same die, SOIC-16 package (300 mil); lacks FBGA thermal performance and board-space efficiency | Better suited for prototyping or legacy PCBs with through-hole or wide-pitch layouts | Select when mechanical compatibility with existing SOIC footprints is required over thermal or density optimization |
| Winbond W25Q512JWQI | 512 Mb, 1.8 V core, Quad SPI only (no DDR), no AutoBoot or ASP; JEDEC SFDP v1.6 compliant | Limited to 1.8 V systems; lacks advanced security features and deterministic boot behavior | Choose for cost-sensitive, low-voltage consumer designs where ECC and sector-level protection are not mandated |
Compared with S25FL512SDSMFBG13, the SOIC variant trades thermal robustness for ease of hand-soldering, while the Winbond part reduces voltage flexibility and security depth to meet lower-tier industrial cost targets-neither matches the combined AEC-Q100 Grade 2 qualification, DDR capability, and OTP-secured boot chain of the Infineon device.
Availability
S25FL512SDSMFBG13 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and edge gateway OTA update storage requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for S25FL512SDSMFBG13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and connectivity solutions for automotive, industrial, and IoT markets.
The S25FL-S family delivers high-reliability serial NOR flash optimized for mission-critical boot and firmware storage in extended-temperature, safety-aware systems-designed specifically for AEC-Q100 and industrial certification paths.
FAQ
What is the maximum clock frequency supported in DDR mode?
The S25FL512SDSMFBG13 supports Fast Read DDR, Dual Read DDR, and Quad Read DDR at up to 80 MHz clock frequency, delivering 20 MBps, 40 MBps, and 80 MBps respectively when VIO = VCC = 3.0–3.6 V. DDR timing requires strict setup/hold margins per datasheet Section 5.5 and is not supported below 3.0 V I/O supply.
Does this device require external hardware for ECC correction?
No. The device includes fully autonomous on-die ECC hardware that automatically detects and corrects single-bit errors during read operations and generates ECC codes during programming. No external logic, software overhead, or additional memory overhead is required for basic ECC functionality.
How is Advanced Sector Protection (ASP) configured and enforced?
ASP is configured via dedicated commands (0x2C/0x2F) that write protection status to sector-specific lock bits stored in the secure silicon region. Enforcement is hardware-based: once locked, sectors cannot be programmed or erased until unlocked via password or boot code authentication-bypassing standard status register protection mechanisms.
Can the device operate with different core and I/O voltages simultaneously?
Yes. VCC (core) operates independently from VIO (I/O) within specified ranges: VCC = 2.7–3.6 V and VIO = 1.65–3.6 V. This allows interfacing with 1.8 V or 3.3 V microcontrollers while maintaining full internal performance-verified across all command modes and temperature grades in the official datasheet.
S25FL512SDSMFBG13 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FL-S
- Package/Case:
- 16-SOIC (0.295", 7.50mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 512Mbit
- Memory Organization:
- 64M x 8
- Memory Interface:
- SPI - Quad I/O
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 16-SOIC
S25FL512SDSMFBG13 FAQ
1.How can I place an order for S25FL512SDSMFBG13 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FL512SDSMFBG13 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FL512SDSMFBG13 reliable?
The price and inventory of S25FL512SDSMFBG13 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FL512SDSMFBG13 is usually 5 days.
3.What payment methods are accepted for S25FL512SDSMFBG13?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FL512SDSMFBG13 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FL512SDSMFBG13?
S25FL512SDSMFBG13 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FL512SDSMFBG13 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FL512SDSMFBG13?
For technical support, including S25FL512SDSMFBG13 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FL512SDSMFBG13 requirements.
6.How does Aetrix verify that S25FL512SDSMFBG13 is sourced from the original manufacturer or authorized distributors?
All S25FL512SDSMFBG13 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FL512SDSMFBG13 meets industry standards.
7.What is the process for return or replacement of S25FL512SDSMFBG13?
All S25FL512SDSMFBG13 units undergo pre-shipment inspection (PSI). If there is an issue with S25FL512SDSMFBG13, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FL512SDSMFBG13 part is unused and in its original packaging.
Return procedure for S25FL512SDSMFBG13:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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