Infineon Technologies S25FS064SAGMFB011

Overview

S25FS064SAGMFB011 from Infineon is a 64 Mb (8 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V supply. It supports DDR Quad I/O read up to 80 MBps, features hardware ECC for single-bit error correction, and offers hybrid sector erase (eight 4 KB + one 32 KB sectors) alongside uniform 64 KB/256 KB blocks. Used in industrial microcontroller boot code storage requiring fast XIP-capable read performance and AEC-Q100 Grade 2 qualification.

For engineers reviewing the S25FS064SAGMFB011 datasheet, S25FS064SAGMFB011 pinout, S25FS064SAGMFB011 application, or S25FS064SAGMFB011 equivalent, key selection criteria include DDR Quad I/O throughput, 100,000 program-erase cycles, OTP array size, SFDP/CFI support for auto-configuration, and compatibility with S25FL-S family footprint and command set.

Technical Context

This device implements Infineon's 65-nm MIRRORBIT™ technology with ECLIPSE architecture, enabling high-density, low-voltage operation across –40°C to +105°C (Industrial Plus). Its dual-mode SPI interface supports both legacy single-data-rate (SDR) and double-data-rate (DDR) protocols, with QPI mode enabling quad-pin instruction execution.

The internal control logic integrates automatic ECC generation, program/erase suspend-resume capability, and configurable sector protection via status register bits, hardware WP#, and advanced sector protection (ASP) with password-controlled read access - all managed through standard SPI command subsets compatible with S25FL1-K/S25FL-P/S25FL-S families.

Key Specifications

Pinout & Package

Package: 24-ball BGA (6 × 8 mm, 5 × 5 ball array, FAB024 footprint), Pb-free, RoHS-compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Compared with S25FS064SAGNFB010, this BGA variant enables higher thermal dissipation and automotive qualification; versus S25FL132K0XMFI001, it delivers 2× density, 1.8 V operation, DDR bandwidth, and hardware ECC - critical for next-gen secure boot architectures.

Availability

S25FS064SAGMFB011 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware upgrades, and medical imaging device production requiring stable component supply and long-term lifecycle assurance.

Supply support for S25FS064SAGMFB011 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.

The S25FS-S family targets high-reliability embedded systems needing fast, secure, and thermally robust serial NOR flash - specifically engineered for AEC-Q100-compliant boot memory and firmware storage in safety-critical environments.

FAQ

What is the maximum DDR Quad I/O read speed supported by S25FS064SAGMFB011?

The device achieves 80 MBps DDR Quad I/O read throughput at 80 MHz clock frequency, confirmed in Table 1 of the official Infineon datasheet (002-03631 Rev. *I). This performance requires proper PCB layout for signal integrity, matched trace lengths, and termination per the recommended design guidelines.

Does S25FS064SAGMFB011 support execute-in-place (XIP) operation?

Yes - the device supports Continuous Read mode (XIP) with burst wrap capability, allowing direct code execution from flash without loading into RAM. This is enabled via standard SPI commands and requires host controller support for continuous address incrementing and latency management.

How is the 1024-byte OTP array used in practice?

The OTP array is programmed once during manufacturing or field provisioning to store immutable data such as cryptographic keys, device serial numbers, or calibration coefficients. Once written, bits cannot be reversed; verification is performed via dedicated read command (0x4B), and access may be restricted via Advanced Sector Protection settings.

Is the BGA package (FAB024) compatible with standard reflow profiles?

Yes - the Pb-free 24-ball BGA uses JEDEC J-STD-020-compliant moisture sensitivity level (MSL) 3 packaging and is qualified for standard lead-free reflow profiles (peak 260°C). Board design must follow Infineon's recommended pad layout, stencil aperture, and thermal relief guidelines to ensure void-free solder joints.