Infineon Technologies S25FS064SAGMFI010

Overview

S25FS064SAGMFI010 from Infineon is a 64 Mb (8 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V single-supply operation, and industrial temperature range (–40°C to +85°C). It supports DDR Quad I/O read at 80 MBps, 256/512-byte page programming, hardware ECC, hybrid/uniform sector erase, and AEC-Q100 Grade 3 automotive qualification.

For engineers reviewing the S25FS064SAGMFI010 datasheet, S25FS064SAGMFI010 pinout, S25FS064SAGMFI010 application, or S25FS064SAGMFI010 equivalent, key selection criteria include SPI-MIO timing compliance, 1.7–2.0 V supply tolerance, OTP array size, sector protection granularity, and QPI mode support for XIP-capable embedded boot systems.

Technical Context

This device implements Infineon's 65-nm MIRRORBIT™ technology with ECLIPSE architecture, enabling high-density nonvolatile storage with integrated error correction. It supports both legacy SPI and quad peripheral interface (QPI) modes, with configurable 24-/32-bit addressing and SFDP/CFI for auto-configuration.

The logic block integrates dual decoders (X/Y), data latch, control logic, and SRAM buffer for command execution. Its multi-I/O command subset ensures footprint compatibility with S25FL1-K, S25FL-P, and S25FL-S families, while DDR capability enables deterministic latency in real-time firmware fetch scenarios.

Key Specifications

Pinout & Package

Package: 8-lead SOIC 208 mil (SOC008), Pb-free, industrial temperature grade.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Compared with S25FL132K0XMFI010 and W25Q64JWIM TR, the S25FS064SAGMFI010 uniquely delivers DDR-enabled 80 MBps reads, QPI mode for reduced instruction overhead, and AEC-Q100 Grade 3 qualification-making it the only option meeting automotive boot latency and safety certification requirements among the three.

Availability

S25FS064SAGMFI010 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware updates, and medical imaging device configuration requiring stable component supply across extended product lifecycles.

Supply support for S25FS064SAGMFI010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and security solutions for automotive, industrial, and IoT markets.

The S25FS064SAGMFI010 belongs to Infineon's FS-S Flash family, designed specifically for high-reliability, low-voltage embedded boot and firmware storage in safety-critical systems requiring AEC-Q100 qualification and deterministic timing.

FAQ

Does S25FS064SAGMFI010 support execute-in-place (XIP) operation?

Yes. The device supports continuous read mode and QPI mode, both enabling true XIP operation where the host processor executes code directly from flash without copying to RAM. Burst wrap addressing and low-latency Quad I/O/DDR interfaces ensure deterministic instruction fetch timing essential for real-time control loops.

What is the function of the RESET#/IO3 pin in normal operation?

In active mode, RESET#/IO3 serves as IO3 for Quad I/O and DDR Quad I/O commands. It reverts to asynchronous hardware reset only when driven low externally while CS# is high. Internal pull-up ensures default reset deassertion; no external resistor is required unless custom reset timing is needed.

How does the hybrid sector option affect firmware update architecture?

The hybrid sector option provides eight 4 KB sectors plus one 32 KB sector at either end of the address space, allowing small, frequent updates (e.g., calibration data) in 4 KB regions while reserving larger 64 KB uniform sectors for infrequent application code upgrades-reducing wear on critical partitions and extending overall flash lifetime.

Is the 1024-byte OTP array field-programmable after soldering?

Yes. The OTP array can be programmed in-system using standard SPI commands (0x42/0x4B) after board assembly. Once any byte is written, that byte cannot be altered; full array locking is irreversible. Programming requires VCC ≥1.8 V and occurs at standard operating speed-no special voltage or timing sequence is needed.