Infineon Technologies S25FS064SAGMFN010
- Part No.:
- S25FS064SAGMFN010
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
S25FS064SAGMFN010.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8SOIC
- Quantity:
- Payment:

- Shipping:

Inventory:2,824
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Product details
Overview
S25FS064SAGMFN010 from Infineon Technologies is a 64 Mb (8 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V nominal supply. It supports DDR Quad I/O read up to 80 MBps, features hardware ECC for single-bit error correction, 100,000 program-erase cycles, and AEC-Q100 Grade 2 automotive qualification (–40°C to +105°C). Used in automotive ADAS ECUs for firmware storage with XIP capability.
For engineers reviewing the S25FS064SAGMFN010 datasheet, S25FS064SAGMFN010 pinout, S25FS064SAGMFN010 application, or S25FS064SAGMFN010 equivalent, key selection criteria include DDR Quad I/O throughput, hybrid sector erase flexibility, OTP security array size, industrial-plus temperature range, and BGA-24 6×8 mm package compatibility with legacy S25FL-S footprint.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ technology with ECLIPSE architecture, enabling high-density, low-voltage operation while maintaining robust data retention (20 years minimum). Its dual-mode SPI interface supports both legacy single-data-rate (SDR) and double-data-rate (DDR) protocols, with QPI mode for command efficiency and SFDP/CFI for auto-configuration.
The logic block integrates dedicated X/Y decoders, SRAM latch-based data path, and on-die ECC generation circuitry that operates transparently during program/erase. Sector protection is implemented via status register bits, hardware WP# control, and advanced password-protected boot code access to individual sectors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 64 Mb (8 MB) - sufficient for full firmware images in mid-tier automotive microcontrollers |
| Interface | SPI Multi-I/O with DDR support - enables 80 MBps read bandwidth using quad I/O lines |
| Erase Granularity | Hybrid sector: eight 4 KB + one 32 KB sectors at top/bottom, rest 64 KB - allows fine-grained OTA update partitioning |
| Data Retention | 20 years minimum at +85°C - meets long-life requirements for automotive infotainment and gateway modules |
| Endurance | 100,000 program-erase cycles - supports frequent firmware updates in telematics control units |
| Supply Voltage | 1.7 V to 2.0 V - compatible with 1.8 V system rails and low-power domain isolation |
| Temperature Range | –40°C to +105°C (AEC-Q100 Grade 2) - qualified for under-hood engine control and ADAS sensor fusion units |
Pinout & Package
Package: BGA-24, 6 × 8 mm, 5 × 5 ball array (FAB024 footprint), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command/address/data transfer; must be held low for entire instruction cycle |
| SCK | Serial Clock | Input clock for SDR/DDR modes; supports up to 133 MHz SDR and 80 MHz DDR operation |
| IO0/SI | Serial Input / I/O 0 | Primary data input in SDR; bidirectional in multi-I/O modes; used for command/address/data in Quad I/O |
| IO1/SO | Serial Output / I/O 1 | Primary data output in SDR; bidirectional in multi-I/O; supports DDR read data capture on both edges |
| IO2/WP# | Write Protect / I/O 2 | Hardware sector lock when asserted low; also functions as Quad I/O line in extended command sets |
| IO3/RESET# | Reset / I/O 3 | Hardware reset input; dual-function pin enabling warm reset without power cycle and Quad I/O data transfer |
| VCC | Power Supply | 1.7–2.0 V core supply; decoupling required per datasheet layout guidelines for stable DDR timing |
| VSS | Ground | Reference return for all I/O and core logic; separate analog/digital ground not required |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction with no software overhead or latency penalty during read |
| DDR Quad I/O Read | 80 MBps throughput enables real-time XIP execution of safety-critical boot code in AUTOSAR MCAL layers |
| OTP Array | 1024-byte one-time-programmable space for secure key storage or calibration constants in production programming |
| Hybrid Sector Erase | Enables independent update of bootloader (4 KB), config (32 KB), and application (64 KB) partitions without full-chip erase |
| AEC-Q100 Grade 2 | Validated for continuous operation at –40°C to +105°C, supporting placement near powertrain ECUs |
Applications
| Automotive ADAS Camera Module | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores camera ISP firmware and calibration data in rear-view and surround-view systems requiring fast boot and field-upgradable binaries. IC Role / Device Role / Timing Role: Non-volatile firmware storage with XIP-capable Quad I/O interface for direct code execution from flash. Use Value: DDR Quad I/O read at 80 MBps reduces boot time by >35% vs. legacy SPI flash; hybrid sectors allow safe OTA patching of ISP algorithms. | Use Scenario: Holds ladder logic runtime, configuration parameters, and HMI assets in DIN-rail mounted programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability program storage with ECC and 20-year retention for unattended operation in factory environments. Use Value: 100,000 endurance cycles support daily firmware revisions during commissioning; OTP array secures vendor-specific IP blocks. |
| Automotive Gateway ECU | Medical Diagnostic Imaging Controller |
Use Scenario: Hosts AUTOSAR-compliant communication stack (CAN FD, Ethernet AVB) and secure boot loader in vehicle domain controllers. IC Role / Device Role / Timing Role: Secure, high-bandwidth flash memory with hardware write protection and password-controlled sector access. Use Value: Advanced sector protection (ASP) prevents unauthorized reprogramming of boot code; AEC-Q100 Grade 2 ensures reliability in engine bay proximity. | Use Scenario: Stores FPGA configuration bitstreams and DICOM image processing firmware in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Low-voltage (1.8 V), low-power flash with deep power-down mode (<6 µA) for battery-backed operation. Use Value: 0.006 mA deep power-down current extends battery life between diagnostic sessions; 64 KB uniform erase aligns with FPGA bitstream page boundaries. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FS256SAGMFV010 | 256 Mb density, identical pinout and command set, same BGA-24 package | Supports larger firmware images and dual-bank XIP; higher cost and power during program/erase | Select when future firmware growth headroom or concurrent execute-and-program is required |
| MX25L6433FZC-10G | 64 Mb, SOIC-8 only, no DDR support, max 104 MHz SDR clock, no hardware ECC | Limited to non-automotive industrial use; lacks AEC-Q100 qualification and OTP security | Acceptable for cost-sensitive, non-safety-critical consumer electronics with simpler update schemes |
Compared with S25FS256SAGMFV010, this part trades density and dual-bank capability for lower cost and power; versus MX25L6433FZC-10G, it adds automotive qualification, DDR bandwidth, and on-die ECC-critical for functional safety compliance.
Availability
S25FS064SAGMFN010 is available at Aetrix Electronics and suitable for automotive ADAS modules, industrial PLCs, medical imaging controllers, and gateway ECUs requiring stable component supply across extended product lifecycles.
Supply support for S25FS064SAGMFN010 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive ICs, and memory solutions, with global R&D and manufacturing infrastructure.
The S25FS-S family targets automotive and industrial applications demanding high reliability, extended temperature operation, and secure firmware storage-designed specifically for ASIL-B/C system integration.
FAQ
Is S25FS064SAGMFN010 pin-compatible with S25FL1-K series devices?
Yes, it shares identical pinout and footprint with S25FL1-K, S25FL-P, and S25FL-S families in BGA-24 (FAB024) and SOIC-8 packages. Command subsets and timing parameters are backward-compatible, enabling drop-in replacement where DDR or enhanced security features are not required.
What is the function of the IO3/RESET# pin during normal operation?
During active memory operation, IO3 serves as the fourth I/O line for Quad and DDR Quad I/O commands. When asserted low independently of CS#, it triggers a hardware warm reset that clears internal state without power cycling-essential for recovery after bus contention or protocol errors in automotive networks.
Does the internal ECC correct errors during program operations?
No-the hardware ECC applies only to read operations. During programming, the device uses internal verification and retry logic to ensure bit accuracy; ECC correction is performed transparently on subsequent reads of potentially degraded cells, preserving data integrity over 20 years.
Can the OTP array be reprogrammed after initial write?
No-the 1024-byte OTP array is physically one-time programmable. Once a bit is set to '0', it cannot be reverted to '1'. Programming is performed via standard SPI commands (0x42/0x4B) and requires VPP voltage; it is typically executed once during final test or secure provisioning.
S25FS064SAGMFN010 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
S25FS064SAGMFN010 FAQ
1.How can I place an order for S25FS064SAGMFN010 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS064SAGMFN010 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS064SAGMFN010 reliable?
The price and inventory of S25FS064SAGMFN010 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS064SAGMFN010 is usually 5 days.
3.What payment methods are accepted for S25FS064SAGMFN010?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS064SAGMFN010 transactions.
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4.How is shipping managed for S25FS064SAGMFN010?
S25FS064SAGMFN010 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS064SAGMFN010 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS064SAGMFN010?
For technical support, including S25FS064SAGMFN010 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS064SAGMFN010 requirements.
6.How does Aetrix verify that S25FS064SAGMFN010 is sourced from the original manufacturer or authorized distributors?
All S25FS064SAGMFN010 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS064SAGMFN010 meets industry standards.
7.What is the process for return or replacement of S25FS064SAGMFN010?
All S25FS064SAGMFN010 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS064SAGMFN010, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS064SAGMFN010 part is unused and in its original packaging.
Return procedure for S25FS064SAGMFN010:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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