My Inquiry
My Account
Infineon Technologies S25FS064SDSMFB013
- Part No.:
- S25FS064SDSMFB013
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
S25FS064SDSMFB013.pdf
- Description:
- IC FLASH 64MBIT SPI/QUAD 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:4,447
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FS064SDSMFB013 from Infineon is a 64 Mb (8 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V single-supply operation, and industrial temperature range (–40°C to +85°C). It supports DDR Quad I/O read at 80 MHz (80 MBps), 256/512-byte page programming, hardware ECC, hybrid/uniform sector erase, and AEC-Q100 Grade 3 automotive qualification.
For engineers reviewing the S25FS064SDSMFB013 datasheet, S25FS064SDSMFB013 pinout, S25FS064SDSMFB013 application, or S25FS064SDSMFB013 equivalent, key selection criteria include SPI-MIO bandwidth, on-die ECC capability, 64 KB/256 KB uniform erase block sizing, OTP array size, and SOIC-8 vs. BGA-24 package compatibility in space-constrained embedded systems.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ technology with ECLIPSE architecture, enabling high-density nonvolatile storage with deterministic latency for XIP (eXecute-In-Place) operation. Its dual-mode SPI interface supports legacy single-data-rate (SDR) and double-data-rate (DDR) protocols, including QPI mode and SFDP/CFI configuration registers for automatic initialization.
The logic block includes dedicated X/Y decoders, data latch, SRAM buffer, and control logic managing hybrid sector layout (eight 4 KB + one 32 KB sectors at top/bottom) and uniform 64 KB or 256 KB erase blocks. Erase and program suspend/resume functions enable real-time background operations without host interruption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory density | 64 Mb (8 MB) - sufficient for firmware images, boot code, and configuration data in microcontroller-based edge devices |
| Interface | SPI Multi-I/O with DDR support - enables 80 MBps read throughput in DDR Quad I/O mode for low-latency code execution |
| Voltage range | 1.7 V to 2.0 V - compatible with modern low-power SoCs and battery-backed industrial controllers |
| Erase endurance | 100,000 program-erase cycles - supports field firmware updates over multi-year product lifecycles |
| Data retention | 20 years minimum - ensures long-term reliability in unpowered storage applications |
| Temperature grade | Industrial (–40°C to +85°C) - validated for deployment in factory automation, motor drives, and outdoor gateways |
| Security features | 1024-byte OTP array + hardware/software block protection + ASP - enables secure boot key storage and selective sector lockdown |
Pinout & Package
Package: 8-lead SOIC 208 mil (SOC008), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command decoding; must be asserted before clocking any instruction |
| SCK | Serial Clock | Input clock for SDR/DDR modes; supports up to 133 MHz for Fast/Quad Read and 80 MHz for DDR Quad I/O |
| IO0 (SI) | Serial Input / Data In | Primary input for commands, addresses, and write data in single/dual/quad modes |
| IO1 (SO) | Serial Output / Data Out | Primary output for read data; bidirectional in Dual/Quad I/O configurations |
| IO2 (WP#) | Write Protect / I/O2 | Hardware write protection when pulled low; functions as quad I/O line when enabled in MIO mode |
| IO3 (RESET#) | Reset / I/O3 | Hardware reset input; also serves as fourth I/O line in Quad/DDR Quad modes |
| VCC | Power Supply | 1.7–2.0 V supply; requires local 100 nF bypass capacitor per datasheet layout guidelines |
| VSS | Ground | Reference return path for all I/O and core logic; must be low-impedance connection to PCB ground plane |
Key Features
| Feature | Design Value |
|---|---|
| On-die ECC | Automatic single-bit error correction with no host software overhead - improves system-level data integrity in noisy environments |
| Hybrid sector architecture | Eight 4 KB + one 32 KB sectors at address boundaries - enables fine-grained firmware partitioning while preserving legacy 64 KB block compatibility |
| Program/erase suspend | Allows host to pause active programming or erasing to service higher-priority interrupts - essential for real-time OS integration |
| QPI mode support | Four-wire full-duplex interface with command compression - reduces instruction overhead and increases effective bandwidth over standard SPI |
| Deep power-down mode | 6 µA typical current draw - extends battery life in always-on IoT endpoints during extended idle periods |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing ladder logic, motion profiles, and safety-critical firmware in programmable logic controllers deployed in harsh factory environments. IC Role / Device Role / Timing Role: Nonvolatile boot memory providing XIP-capable instruction fetch with ≤100 ns random access latency. Use Value: 20-year data retention and 100K-cycle endurance ensure firmware integrity across decades of unattended operation without refresh. | Use Scenario: Holding boot code and sensor calibration tables for radar/EPS ECUs requiring AEC-Q100 Grade 2 qualification (–40°C to +105°C). IC Role / Device Role / Timing Role: Qualified SPI flash supporting fast Quad I/O reads to meet ASIL-B boot timing constraints under cold-start conditions. Use Value: Hardware ECC and ASP prevent unauthorized modification of safety-critical boot assets, satisfying ISO 26262 requirements. |
| Medical Imaging System Configuration | Smart Grid Communication Module |
Use Scenario: Storing DICOM metadata templates, calibration coefficients, and regulatory compliance logs in portable ultrasound and MRI subsystems. IC Role / Device Role / Timing Role: Secure parameter storage with OTP array for cryptographic keys and tamper-proof calibration data. Use Value: 1024-byte OTP space enables immutable root-of-trust establishment, meeting FDA 21 CFR Part 11 audit trail requirements. | Use Scenario: Hosting protocol stacks (DLMS/COSEM, IEC 61850) and firmware updates in utility-grade smart meters and substation RTUs. IC Role / Device Role / Timing Role: High-reliability code storage with deep power-down mode for battery-buffered communication during grid outages. Use Value: 6 µA deep power-down current extends backup battery life beyond 10 years, reducing field maintenance costs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| S25FL064L0XMFI000 | 65 nm process, 3.0 V supply, no DDR support, lower max clock (80 MHz SDR only) | Lacks DDR and QPI modes; unsuitable for bandwidth-sensitive XIP use cases | Select when legacy 3.0 V systems require footprint compatibility without performance upgrade |
| MX25L6433FZNI-10G | 2.7–3.6 V supply, no on-die ECC, no ASP, 64 KB uniform erase only | Requires external ECC handling; lacks advanced security features for regulated markets | Choose for cost-sensitive consumer applications where security and ECC are not mandated |
Compared with S25FL064L and MX25L6433F, the S25FS064SDSMFB013 delivers superior bandwidth via DDR Quad I/O, built-in ECC for functional safety, and ASP for secure boot-making it optimal for industrial and automotive designs demanding reliability, speed, and security in a single 1.8 V package.
Availability
S25FS064SDSMFB013 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply across extended product lifecycles.
Supply support for S25FS064SDSMFB013 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and connectivity solutions for automotive, industrial, and IoT markets.
The S25FS-S family targets high-reliability embedded systems needing fast, secure, and long-life nonvolatile memory with advanced SPI features and automotive qualification.
FAQ
What is the maximum clock frequency supported in DDR Quad I/O mode?
The S25FS064SDSMFB013 supports up to 80 MHz in DDR Quad I/O mode, delivering 80 MBps effective read throughput. This is confirmed in Table 1 of the official Infineon datasheet (002-03631 Rev. *I), and requires proper impedance-controlled PCB routing and termination per the layout guidelines in Section 7.2.
Does this part support execute-in-place (XIP) operation?
Yes, the S25FS064SDSMFB013 supports continuous read mode for XIP operation, allowing direct code execution from flash without copying to RAM. The device provides burst wrap addressing and low-latency read commands (e.g., Fast Read, Quad I/O) required for deterministic instruction fetch timing in real-time microcontrollers.
How is the 1024-byte OTP array used in practice?
The 1024-byte OTP array is programmed once during manufacturing or initial provisioning and stores immutable data such as cryptographic keys, device serial numbers, or calibration constants. Once locked, it cannot be erased or rewritten, providing hardware-enforced root-of-trust for secure boot and regulatory compliance in medical and industrial applications.
Is the SOIC-8 package (DSMFB013) pin-compatible with prior S25FL-S generation devices?
Yes, the S25FS064SDSMFB013 in SOIC-8 is footprint-compatible with S25FL1-K, S25FL-P, and S25FL-S families per datasheet Section 1.2.1. However, DDR mode and QPI command sets require updated host driver support; legacy SDR-only firmware may operate without changes but will not leverage performance enhancements.
S25FS064SDSMFB013 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 64Mbit
- Memory Organization:
- 8M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 80 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
S25FS064SDSMFB013 FAQ
1.How can I place an order for S25FS064SDSMFB013 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS064SDSMFB013 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS064SDSMFB013 reliable?
The price and inventory of S25FS064SDSMFB013 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS064SDSMFB013 is usually 5 days.
3.What payment methods are accepted for S25FS064SDSMFB013?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS064SDSMFB013 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS064SDSMFB013?
S25FS064SDSMFB013 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS064SDSMFB013 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS064SDSMFB013?
For technical support, including S25FS064SDSMFB013 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS064SDSMFB013 requirements.
6.How does Aetrix verify that S25FS064SDSMFB013 is sourced from the original manufacturer or authorized distributors?
All S25FS064SDSMFB013 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS064SDSMFB013 meets industry standards.
7.What is the process for return or replacement of S25FS064SDSMFB013?
All S25FS064SDSMFB013 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS064SDSMFB013, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS064SDSMFB013 part is unused and in its original packaging.
Return procedure for S25FS064SDSMFB013:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS064SDSMFB013 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…
