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Infineon Technologies S25FS128SAGBHB200

Part No.:
S25FS128SAGBHB200
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
24-TBGA
Datasheet:
AetrixS25FS128SAGBHB200.pdf
Description:
IC FLASH 128MBIT SPI/QUAD 24BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,178

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Product details

Overview

S25FS128SAGBHB200 from Infineon is a 128 Mb (16 MB) serial NOR flash memory with SPI Multi-I/O interface, 1.8 V supply, industrial temperature grade (–40°C to +85°C), and WSON 6 × 8 mm package. It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 256-byte/512-byte page programming, hardware ECC, and hybrid/uniform sector erase options. Used for firmware storage in embedded controllers requiring XIP-capable, high-reliability nonvolatile memory.

For engineers reviewing the S25FS128SAGBHB200 datasheet, S25FS128SAGBHB200 pinout, S25FS128SAGBHB200 application, or S25FS128SAGBHB200 equivalent, key selection criteria include SPI-MIO timing compliance, SFDP/CFI configuration support, OTP array usage, hybrid sector layout flexibility, and AEC-Q100 grade compatibility for automotive control modules.

Technical Context

This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling true XIP operation via Continuous Read mode and Burst Wrap addressing. It supports both standard SPI (modes 0/3) and enhanced protocols including QPI and DDR Quad I/O, with configurable 24-/32-bit addressing.

Internal hardware ECC provides single-bit error correction without host intervention, while program/erase suspend-resume enables concurrent background operations. Sector protection combines status register bits, hardware WP#, and Advanced Sector Protection (ASP) with password-controlled access to boot sectors.

Key Specifications

ParameterValue and Actual Design Meaning
Density128 Mbit (16 MB) - fixed capacity for boot code + application image storage in space-constrained designs
Supply Voltage1.7 V to 2.0 V - optimized for low-power 1.8 V system rails, not compatible with 3.3 V SPI hosts
Max Read Rate80 MBps (DDR Quad I/O @ 80 MHz) - enables real-time execution of firmware from flash without local RAM copy
Erase Endurance100,000 program-erase cycles - supports field firmware updates over full product lifecycle
Data Retention20 years minimum at +85°C - validated for long-term deployment in industrial control systems
Temperature GradeIndustrial (–40°C to +85°C) - qualified per JEDEC JESD22-A104, suitable for non-automotive embedded use
PackageWSON 6 × 8 mm (WNH008), 8-pin, exposed pad - thermally enhanced for sustained read/write in enclosed enclosures

Pinout & Package

Package: WSON 6 × 8 mm (WNH008), 8-lead, Pb-free, moisture sensitivity level 3 (MSL3), thermal pad on underside for PCB heat dissipation.

Pin/TerminalCircuit RoleDesign Meaning
1 (CS#)Chip SelectActive-low enable for command/address/data transfer; must be deasserted between commands to reset internal state machine
2 (DO/IO1)Serial Output / I/O1Primary data output in standard SPI; bidirectional in Dual/Quad I/O modes; requires pull-up for tri-state behavior during CS# high
3 (WP#/IO2)Write Protect / I/O2Hardware sector lock when low; functions as second I/O line in multi-I/O commands; tied high for full write enable
4 (VSS)GroundSignal and power reference plane; connected to thermal pad for thermal management
5 (VCC)Power Supply1.8 V ±0.1 V core supply; decoupling capacitor (100 nF) required within 5 mm of pin
6 (SI/IO0)Serial Input / I/O0Command/address/data input in standard SPI; bidirectional in multi-I/O; default I/O0 in Quad mode
7 (SCK)Serial ClockInput clock driving all SPI transactions; supports up to 133 MHz SDR or 80 MHz DDR; duty cycle 40–60%
8 (RESET#/IO3)Reset / I/O3Hardware reset assertion clears internal registers; serves as fourth I/O line in Quad mode; pulled high internally

Key Features

FeatureDesign Value
XIP-Capable Continuous Read ModeEnables direct code execution from flash via burst wrap addressing, eliminating need for shadow RAM copy in MCU boot loaders
Hardware ECC with Single-Bit CorrectionOn-the-fly error detection and correction without CPU overhead or external logic, meeting IEC 61508 SIL-2 requirements for safety-critical firmware
Hybrid Sector ArchitectureCombines eight 4-KB + one 32-KB sectors at top/bottom with uniform 64-KB main array - supports secure boot partitioning and flexible OTA update schemes
Advanced Sector Protection (ASP)Password-protected individual sector locking and optional read-access restriction - prevents unauthorized firmware extraction or modification in deployed edge devices
SFDP & CFI ComplianceSelf-describing configuration via JEDEC JESD216 SFDP table and Common Flash Interface - enables automatic driver initialization without hard-coded parameters

Applications

Industrial PLC Firmware StorageAutomotive ADAS Boot Memory

Use Scenario: Storing bootloader, FPGA configuration bitstream, and real-time control firmware in programmable logic controllers with extended field life.

IC Role / Device Role / Timing Role: Primary nonvolatile code storage with XIP support and 20-year data retention at 85°C ambient.

Use Value: Eliminates external RAM buffering during startup; hybrid sector layout isolates critical boot code from application updates.

Use Scenario: Holding safety-certified boot images and sensor calibration data in front-camera ECU modules operating under AEC-Q100 Grade 2 conditions.

IC Role / Device Role / Timing Role: Secure, high-speed flash memory supporting DDR Quad I/O reads for sub-100 ms boot time compliance.

Use Value: ASP and OTP array prevent tampering with ASIL-B boot code; ECC ensures integrity across thermal cycling.

Medical Imaging System ConfigurationSmart Grid Communication Module

Use Scenario: Storing FPGA configuration, calibration tables, and regulatory-compliant diagnostic firmware in portable ultrasound units.

IC Role / Device Role / Timing Role: High-reliability SPI flash with 100K P/E cycles for frequent field calibration updates.

Use Value: Uniform 64-KB sector option simplifies firmware delta update management; deep power-down mode reduces standby current to 6 µA.

Use Scenario: Hosting protocol stack binaries and encrypted communication keys in DIN-rail-mounted IIoT gateways deployed in substations.

IC Role / Device Role / Timing Role: Industrial-grade serial NOR flash with hardware write protection and SFDP auto-configuration for interoperable firmware loading.

Use Value: WP# pin and status register protection guard against accidental overwrite during remote firmware upgrades over cellular links.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL128SAGMFI00Same die, legacy Cypress branding; identical pinout, timing, and feature set; obsolete per Infineon migration noticeNo functional difference; supported by same drivers and tools; migration path documented in Infineon AN229772Select only for legacy BOM continuity; new designs should use S25FS128SAGBHB200 for long-term supply assurance
Winbond W25Q128JVSIM1.8 V Quad SPI NOR flash; no DDR support; lacks SFDP v1.6, ASP, or hardware ECC; 64-KB uniform sectors onlyLower cost for non-XIP, non-safety applications; insufficient for AEC-Q100 or SIL-2 designs requiring ECC and sector-level protectionAcceptable for consumer IoT where firmware integrity is managed in software; not suitable for industrial control or automotive boot memory

Compared with S25FL128SAGMFI00, this part offers assured long-term availability and updated documentation; versus W25Q128JVSIM, it delivers hardware ECC, DDR performance, and ASP-critical for safety-aware and high-throughput embedded systems.

Availability

S25FS128SAGBHB200 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS ECUs, medical imaging subsystems, and smart grid communication modules requiring stable component supply, guaranteed 20-year data retention, and AEC-Q100-compatible qualification.

Supply support for S25FS128SAGBHB200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and connectivity solutions for automotive, industrial, and power systems markets.

The FS-S Flash family targets high-reliability embedded applications demanding XIP capability, robust data integrity, and flexible security features-designed specifically for automotive boot code, industrial firmware, and safety-critical configuration storage.

FAQ

Does S25FS128SAGBHB200 support 3.3 V I/O signaling?

No. This device operates exclusively at 1.7–2.0 V VCC and uses 1.8 V I/O logic levels. It is not 3.3 V tolerant. Connecting to a 3.3 V SPI host requires level-shifting circuitry on all signal lines (CS#, SCK, IO0–IO3) to avoid damage and ensure reliable communication.

Can the OTP array be reprogrammed after initial programming?

No. The 1024-byte One-Time Programmable array is permanently programmed using high-voltage pulses. Once a bit is set to '0', it cannot be changed back to '1'. It is intended for immutable data such as cryptographic keys, device identifiers, or calibration constants locked at manufacturing or final test.

What is the purpose of the RESET# pin beyond hardware reset?

In Quad I/O mode, pin 8 functions as IO3-the fourth bidirectional data line. During normal operation with CS# active, it carries data; during reset assertion (low pulse ≥20 ns), it forces the device into hardware reset state, clearing internal registers and terminating any ongoing command sequence.

Is the WSON 6 × 8 mm package RoHS compliant and halogen-free?

Yes. The WNH008 package is Pb-free and fully compliant with RoHS Directive 2011/65/EU and JEDEC JS709C halogen-free requirements. The marking "G" in the part number suffix confirms green packaging; material declarations are available in Infineon's Eco Reports (document number 002-00368 Rev. *O).

S25FS128SAGBHB200 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FS-S
Package/Case:
24-TBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR (SLC)
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
2ms
Access Time:
6 ns
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 105°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
24-BGA (8x6)

S25FS128SAGBHB200 FAQ

1.How can I place an order for S25FS128SAGBHB200 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS128SAGBHB200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS128SAGBHB200 reliable?

The price and inventory of S25FS128SAGBHB200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS128SAGBHB200 is usually 5 days.

3.What payment methods are accepted for S25FS128SAGBHB200?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS128SAGBHB200 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS128SAGBHB200?

S25FS128SAGBHB200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS128SAGBHB200 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS128SAGBHB200?

For technical support, including S25FS128SAGBHB200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS128SAGBHB200 requirements.

6.How does Aetrix verify that S25FS128SAGBHB200 is sourced from the original manufacturer or authorized distributors?

All S25FS128SAGBHB200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS128SAGBHB200 meets industry standards.

7.What is the process for return or replacement of S25FS128SAGBHB200?

All S25FS128SAGBHB200 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS128SAGBHB200, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS128SAGBHB200 part is unused and in its original packaging.

Return procedure for S25FS128SAGBHB200:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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