My Inquiry
My Account
Infineon Technologies S25FS128SAGBHI200
- Part No.:
- S25FS128SAGBHI200
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FS128SAGBHI200.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:415
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FS128SAGBHI200 from Infineon is a 128 Mbit (16 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, industrial temperature grade (–40°C to +85°C), and WSON 6 × 8 mm package. It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 256-byte/512-byte page programming, hardware ECC, and hybrid/uniform sector erase options.
For engineers reviewing the S25FS128SAGBHI200 datasheet, S25FS128SAGBHI200 pinout, S25FS128SAGBHI200 application, or S25FS128SAGBHI200 equivalent, key selection factors include its 1.8 V operation, AEC-Q100 Grade 3 qualification, SFDP/CFI support for auto-configuration, OTP array for secure boot, and compatibility with S25FL-P/S SPI families.
Technical Context
This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density, low-voltage NOR flash operation. It supports both SDR and DDR SPI modes, with configurable 24-/32-bit addressing and burst wrap/continuous XIP read modes.
The flash integrates dual-sector erase architecture-eight 4-KB + one 32-KB or 224-KB sectors at top/bottom plus uniform 64-KB or 256-KB blocks-and includes dedicated status registers for hardware/software block protection and advanced sector protection via boot code or password.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mbit (16 MB) nonvolatile storage capacity |
| Supply Voltage | 1.7 V to 2.0 V - enables low-power embedded systems with 1.8 V rail |
| Read Throughput | 80 MBps DDR Quad I/O - supports real-time code execution from flash in XIP mode |
| Erase Endurance | 100,000 program-erase cycles - suitable for firmware update-intensive applications |
| Data Retention | 20 years minimum - ensures long-term reliability in unpowered storage |
| Temperature Range | –40°C to +85°C (Industrial Grade) - validated for extended ambient operation |
| Package | WSON 6 × 8 mm (WNH008), 8-pin, Pb-free - surface-mount compatible with automated assembly |
Pinout & Package
Package: WSON 6 × 8 mm (WNH008), 8-pin, exposed pad, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (CS#) | Chip Select | Active-low enable for SPI command decoding and bus arbitration |
| 2 (DO/IO1) | Serial Output / I/O1 | Primary data output in standard SPI; bidirectional in Dual/Quad I/O modes |
| 3 (WP#/IO2) | Write Protect / I/O2 | Hardware lock for sector protection; second I/O line in multi-I/O protocols |
| 4 (VSS) | Ground | Signal and power reference plane for noise-sensitive SPI timing |
| 5 (VCC) | Power Supply | 1.8 V core and I/O supply - decoupling required per datasheet layout guidelines |
| 6 (SI/IO0) | Serial Input / I/O0 | Command/data input in standard SPI; bidirectional in multi-I/O configurations |
| 7 (SCK) | Serial Clock | Edge-triggered clock up to 133 MHz SDR or 80 MHz DDR - defines maximum interface bandwidth |
| 8 (RESET#/IO3) | Reset / I/O3 | Hardware reset initiation; third I/O line in Quad mode; supports software reset via command |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction with no software overhead or latency penalty |
| Program/Erase Suspend | Allows background read access during active programming or erasing - critical for real-time systems |
| OTP Array | 1024-byte one-time programmable region for secure boot keys or calibration data |
| Advanced Sector Protection | Password- or boot-code-controlled individual sector locking - prevents unauthorized firmware modification |
| SFDP & CFI Support | Standardized parameter tables enable automatic driver initialization without hard-coded timing values |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing firmware images and configuration data in programmable logic controllers operating continuously in factory environments. IC Role / Device Role / Timing Role: Nonvolatile code storage with XIP-capable Quad I/O interface for deterministic boot and runtime code fetch. Use Value: 20-year data retention and 100K erase cycles ensure field longevity without replacement; industrial temp grade guarantees uptime across thermal cycling. | Use Scenario: Holding boot code and safety-critical sensor fusion algorithms in automotive camera or radar ECUs. IC Role / Device Role / Timing Role: AEC-Q100 Grade 3 qualified SPI flash providing secure, fast-access boot memory with OTP-based root-of-trust. Use Value: Hardware ECC and ASP prevent corruption or tampering of boot firmware; DDR Quad I/O enables sub-100ms cold boot time. |
| Medical Imaging System Configuration | Network Edge Router Image Storage |
Use Scenario: Storing calibration profiles, DICOM metadata templates, and UI assets in portable ultrasound or MRI control units. IC Role / Device Role / Timing Role: High-reliability, low-voltage (1.8 V) flash supporting burst-wrap reads for rapid UI asset loading. Use Value: Hybrid sector architecture allows fine-grained updates of calibration data without erasing full firmware; deep power-down current (6 µA) extends battery life. | Use Scenario: Hosting bootloader, OS kernel, and feature firmware in enterprise-grade 5G small cell gateways. IC Role / Device Role / Timing Role: SPI-MIO flash interfacing with ARM Cortex-A series SoCs via QPI or DDR mode for parallel instruction fetch. Use Value: SFDP compliance enables automatic driver adaptation across firmware revisions; uniform 256-KB sectors simplify OTA update partitioning. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGNFI000 | Same die, legacy Cypress branding; identical electrical specs and pinout | No functional difference - direct drop-in replacement pre-Infineon acquisition | Select when sourcing from legacy inventory or distributor stock labeled under Cypress part numbering |
| Winbond W25Q128JVSIM | 1.8 V operation, but lacks DDR mode, OTP array, and ASP; uses different SFDP layout | Lower security and performance ceiling - suitable only where XIP speed and firmware integrity are noncritical | Choose only if cost sensitivity outweighs need for ECC, suspend/resume, or secure boot features |
Compared with S25FS128SAGBHI200, the Cypress alternative offers identical functionality and qualification, while the Winbond part trades advanced reliability and security features for lower unit cost and simpler integration - making it viable only in non-safety-critical consumer applications.
Availability
S25FS128SAGBHI200 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, automotive ADAS boot memory, and medical imaging system configuration requiring stable component supply and long-term lifecycle assurance.
Supply support for S25FS128SAGBHI200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive MCUs, and secure memory solutions, with global R&D and manufacturing infrastructure.
The FS-S Flash family targets high-reliability embedded systems needing secure, fast, and long-life nonvolatile storage - particularly in automotive, industrial, and medical applications demanding AEC-Q100 or extended temperature operation.
FAQ
Is S25FS128SAGBHI200 pin-compatible with S25FL128SAGNFI000?
Yes - S25FS128SAGBHI200 is a direct pin- and footprint-compatible successor to the Cypress S25FL128SAGNFI000. Both use the WNH008 (6 × 8 mm WSON) package with identical pin assignments, voltage ranges, and command sets. No PCB redesign is required for migration.
Does this device support execute-in-place (XIP) operation?
Yes - S25FS128SAGBHI200 supports continuous read mode for true XIP operation, including burst wrap and linear address incrementing. Its DDR Quad I/O interface delivers up to 80 MBps read throughput, enabling deterministic instruction fetch directly from flash without RAM loading.
What security mechanisms does S25FS128SAGBHI200 provide for firmware protection?
It provides three layered protections: (1) 1024-byte OTP array for immutable keys or certificates; (2) hardware/software block protection via status register bits; and (3) Advanced Sector Protection with password- or boot-code-controlled individual sector locking - all enforced at the silicon level without host CPU involvement.
Can S25FS128SAGBHI200 operate in both SDR and DDR SPI modes?
Yes - the device supports both Single Data Rate (SDR) and Double Data Rate (DDR) SPI protocols. DDR mode is enabled via configuration register bit CR3[1], allowing data transfer on both clock edges. Maximum DDR Quad I/O clock rate is 80 MHz, delivering 80 MBps effective bandwidth.
S25FS128SAGBHI200 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FS128SAGBHI200 FAQ
1.How can I place an order for S25FS128SAGBHI200 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS128SAGBHI200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS128SAGBHI200 reliable?
The price and inventory of S25FS128SAGBHI200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS128SAGBHI200 is usually 5 days.
3.What payment methods are accepted for S25FS128SAGBHI200?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS128SAGBHI200 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS128SAGBHI200?
S25FS128SAGBHI200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS128SAGBHI200 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS128SAGBHI200?
For technical support, including S25FS128SAGBHI200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS128SAGBHI200 requirements.
6.How does Aetrix verify that S25FS128SAGBHI200 is sourced from the original manufacturer or authorized distributors?
All S25FS128SAGBHI200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS128SAGBHI200 meets industry standards.
7.What is the process for return or replacement of S25FS128SAGBHI200?
All S25FS128SAGBHI200 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS128SAGBHI200, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS128SAGBHI200 part is unused and in its original packaging.
Return procedure for S25FS128SAGBHI200:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS128SAGBHI200 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
