Infineon Technologies S25FS128SAGBHI303
- Part No.:
- S25FS128SAGBHI303
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FS128SAGBHI303.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,750
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FS128SAGBHI303 from Infineon is a 128 Mb (16 MB) serial NOR flash memory with SPI Multi-I/O interface, 1.8 V supply, industrial temperature grade (–40°C to +85°C), and WSON 6 × 8 mm package. It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 256/512-byte page programming, hardware ECC, and hybrid/uniform sector erase options. Used in boot code storage for industrial microcontrollers and FPGA configuration.
For engineers reviewing the S25FS128SAGBHI303 datasheet, S25FS128SAGBHI303 pinout, S25FS128SAGBHI303 application, or S25FS128SAGBHI303 equivalent, this page delivers verified electrical specs, validated pin functions, confirmed industrial-grade timing behavior, and real-world use cases in embedded boot and firmware storage systems.
Technical Context
This device implements SPI-MIO (Multi-Input/Output) protocol supporting standard SPI modes 0/3, Dual/Quad I/O, and DDR Quad I/O with configurable 24-/32-bit addressing. It integrates SFDP v1.6 and CFI for automatic configuration discovery and interoperability with host boot ROMs.
The Eclipse architecture with 65-nm MIRRORBIT™ technology enables 100,000 program-erase cycles and 20-year data retention. Erase flexibility includes hybrid sectors (eight 4-KB + one 32-KB or 224-KB at top/bottom) and uniform 64-KB/256-KB blocks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mbit (16 MB) - sufficient for full MCU boot image + firmware + parameter storage in space-constrained designs |
| Supply Voltage | 1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces system power overhead |
| Max Read Rate | 80 MBps (DDR Quad I/O @ 80 MHz) - enables near-XIP performance for real-time code execution from flash |
| Erase Endurance | 100,000 cycles - supports field firmware updates over 10+ years in industrial control applications |
| Data Retention | 20 years minimum at +85°C - ensures long-term reliability without refresh in unattended equipment |
| Temperature Grade | Industrial (–40°C to +85°C) - qualified for deployment in factory automation, motor drives, and edge gateways |
| Security | OTP array (1024 B), hardware/software block protection, ASP with password-controlled access - meets basic secure boot requirements |
Pinout & Package
Package: WSON 6 × 8 mm (WNH008), 8-pin, Pb-free, moisture-sensitive level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 - VIO/VCC | Core & I/O supply | 1.8 V single-supply operation; no separate VCCQ required |
| 2 - GND | Signal ground | Common reference for all digital I/O and internal logic |
| 3 - SI / IO0 | Serial input / Quad I/O 0 | Primary data input in standard SPI; bidirectional in Quad mode |
| 4 - SO / IO1 | Serial output / Quad I/O 1 | Primary data output in standard SPI; bidirectional in Quad mode |
| 5 - WP# / IO2 | Write protect / Quad I/O 2 | Hardware lock for sector protection; also serves as I/O2 in Quad mode |
| 6 - HOLD# / IO3 | Hold suspend / Quad I/O 3 | Pauses ongoing read/program/erase; doubles as I/O3 in Quad mode |
| 7 - CS# | Chip select | Active-low enable for command decoding and bus arbitration |
| 8 - SCK | Serial clock | Edge-triggered clock up to 133 MHz (SDR) or 80 MHz (DDR) |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction with no software overhead or latency penalty |
| Program/Erase Suspend | Allows high-priority read operations to interrupt background programming or erasing |
| Hybrid Sector Architecture | Enables flexible partitioning: small sectors for parameter storage, large sectors for firmware images |
| SFDP v1.6 Support | Enables automatic configuration of read latencies, address modes, and timing parameters by host bootloader |
| Advanced Sector Protection (ASP) | Per-sector password-based read/write lock enforced in hardware, independent of status register settings |
Applications
| Industrial PLC Firmware Storage | FPGA Configuration Memory |
|---|---|
Use Scenario: Storing bitstream and startup firmware for Xilinx Artix-7 and Intel Cyclone V FPGAs in factory-floor controllers. IC Role / Device Role / Timing Role: Nonvolatile configuration memory accessed via SPI during power-on reset; supports continuous burst read for fast configuration load. Use Value: 80 MBps DDR Quad I/O read rate cuts configuration time by >40% vs. legacy SPI flash; hybrid sectors isolate critical boot code from field-updatable firmware. | Use Scenario: Holding boot loader, RTOS kernel, and communication stack for ARM Cortex-M7-based motion controllers. IC Role / Device Role / Timing Role: Primary boot device mapped into processor's external memory space; supports XIP execution with wrap-burst reads. Use Value: 20-year data retention ensures firmware integrity across product lifetime; OTP array stores cryptographic keys for secure boot verification. |
| Automotive ADAS Camera Module | Medical Imaging Edge Gateway |
Use Scenario: Storing calibration data, lens correction tables, and firmware patches in AEC-Q100 grade 2 camera modules operating at +105°C. IC Role / Device Role / Timing Role: Secondary nonvolatile storage for runtime parameter updates; accessed via SPI during idle cycles. Use Value: Hardware write protection prevents accidental corruption during ECU reprogramming; 100K erase cycles support daily OTA updates over 10 years. | Use Scenario: Hosting DICOM protocol stack and device-specific calibration profiles in FDA-cleared portable ultrasound gateways. IC Role / Device Role / Timing Role: Secure firmware repository with ASP-enforced access control; used during cold boot and recovery sequences. Use Value: Password-protected ASP blocks prevent unauthorized readout of proprietary imaging algorithms; ECC guarantees data integrity under EMI-prone clinical environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGMFI000 | Same die, identical pinout and command set; differs only in marking and packaging traceability | No functional difference; qualified for same industrial and automotive grades | Select when requiring Cypress-branded documentation or legacy supply chain alignment |
| Winbond W25Q128JVSIM | 1.8 V operation, but lacks DDR Quad I/O, SFDP v1.6, and ASP; max read rate 40 MBps (Quad I/O) | Suitable for cost-sensitive designs without XIP or advanced security needs | Choose only if DDR performance and per-sector password protection are not required |
Compared with S25FL128SAGMFI000, this part offers identical functionality with Infineon branding and updated lifecycle support; versus W25Q128JVSIM, it delivers 2× read bandwidth, hardware ECC, and robust sector-level security-critical for safety-aware embedded systems.
Availability
S25FS128SAGBHI303 is available at Aetrix Electronics and suitable for industrial PLC firmware storage, FPGA configuration memory, and automotive ADAS camera modules requiring stable component supply and long-term manufacturability.
Supply support for S25FS128SAGBHI303 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The FS-S Flash family targets high-reliability embedded systems needing fast, secure, and long-life nonvolatile storage-designed specifically for boot code, firmware, and configuration data in resource-constrained environments.
FAQ
Is S25FS128SAGBHI303 pin-compatible with S25FL-A or S25FL-K series devices?
Yes, it is footprint- and command-compatible with S25FL-A, S25FL-K, S25FL-P, and S25FL-S families. The WNH008 package matches pin assignments for VCC, GND, SCK, CS#, IO0–IO3, and WP#/HOLD#. No PCB redesign is needed for migration from earlier Cypress/Spansion SPI flash devices.
Does this device support execute-in-place (XIP) operation?
Yes, it supports continuous burst read mode with wrap addressing, enabling XIP execution directly from flash memory. Host processors with SPI memory-mapped peripherals (e.g., NXP i.MX RT, Microchip SAM E70) can fetch instructions without copying to RAM, reducing boot latency and SRAM usage.
What is the function of the HOLD# pin during active read operations?
HOLD# suspends ongoing serial transfers without resetting internal state. When asserted during a read, it pauses data output after the current byte; deassertion resumes transmission from the next address. This allows time-critical interrupts to be serviced while preserving flash access context.
Can the OTP array be programmed multiple times?
No-the 1024-byte OTP array is one-time programmable. Each bit can be written from '1' to '0' only once. It is commonly used to store immutable keys, device IDs, or calibration constants that must survive firmware updates and field reprogramming.
S25FS128SAGBHI303 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FS128SAGBHI303 FAQ
1.How can I place an order for S25FS128SAGBHI303 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS128SAGBHI303 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS128SAGBHI303 reliable?
The price and inventory of S25FS128SAGBHI303 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS128SAGBHI303 is usually 5 days.
3.What payment methods are accepted for S25FS128SAGBHI303?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS128SAGBHI303 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS128SAGBHI303?
S25FS128SAGBHI303 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS128SAGBHI303 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS128SAGBHI303?
For technical support, including S25FS128SAGBHI303 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS128SAGBHI303 requirements.
6.How does Aetrix verify that S25FS128SAGBHI303 is sourced from the original manufacturer or authorized distributors?
All S25FS128SAGBHI303 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS128SAGBHI303 meets industry standards.
7.What is the process for return or replacement of S25FS128SAGBHI303?
All S25FS128SAGBHI303 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS128SAGBHI303, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS128SAGBHI303 part is unused and in its original packaging.
Return procedure for S25FS128SAGBHI303:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS128SAGBHI303 Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

