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Infineon Technologies S25FS128SAGMFB100
- Part No.:
- S25FS128SAGMFB100
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
S25FS128SAGMFB100.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,366
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Product details
Overview
S25FS128SAGMFB100 from Infineon is a 128 Mb (16 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, industrial temperature grade (–40°C to +85°C), and WSON 6 × 8 mm package. It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 256-byte/512-byte page programming, and hardware ECC for single-bit error correction. Used in boot code storage for embedded microcontrollers in industrial control systems.
For engineers reviewing the S25FS128SAGMFB100 datasheet, S25FS128SAGMFB100 pinout, S25FS128SAGMFB100 application, or S25FS128SAGMFB100 equivalent, key selection factors include hybrid/uniform sector erase options, SFDP/CFI configuration support, OTP array size, AEC-Q100 grade compatibility, and WSON-8 thermal performance under sustained read/write loads.
Technical Context
This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density NOR flash with deterministic latency for XIP execution. It supports both standard SPI (modes 0/3) and enhanced Multi-I/O protocols including Dual/Quad/DDR Quad I/O, with configurable 24-/32-bit addressing.
The internal ECC engine operates transparently during program/erase cycles, correcting single-bit errors without software intervention. Sector protection is implemented via status register bits, hardware WP#, and advanced password-controlled ASP-enabling secure boot partitioning and firmware update isolation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mbit (16 MB) non-volatile memory array for firmware/image storage |
| Supply Voltage | 1.7 V to 2.0 V - compatible with low-power 1.8 V system rails |
| Read Throughput | 80 MBps DDR Quad I/O - enables fast XIP execution from flash |
| Erase Endurance | 100,000 program-erase cycles - suitable for field-updatable firmware |
| Data Retention | 20 years minimum at +85°C - validated for long-life industrial deployments |
| Temperature Grade | Industrial (–40°C to +85°C) - qualified per JEDEC JESD22-A104 |
| OTP Array | 1024 bytes one-time programmable space for secure keys or calibration data |
Pinout & Package
Package: WSON 6 × 8 mm (WNH008), 8-pin, lead-free, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (CS#) | Chip Select | Active-low enable for SPI command/address/data transfer; supports multi-device bus sharing |
| 2 (DO/IO1) | Serial Output / I/O Line 1 | Output during standard read; bidirectional in Dual/Quad I/O modes |
| 3 (WP#/IO2) | Write Protect / I/O Line 2 | Hardware sector lock when asserted low; functions as IO2 in Quad mode |
| 4 (VSS) | Ground | Signal and power reference plane; requires low-impedance PCB connection |
| 5 (VCC) | Power Supply | 1.7–2.0 V core supply; bypass capacitor required per datasheet layout guidelines |
| 6 (SI/IO0) | Serial Input / I/O Line 0 | Command/address/data input in standard mode; bidirectional in Multi-I/O modes |
| 7 (SCK) | Serial Clock | Edge-triggered clock up to 133 MHz (SDR) or 80 MHz (DDR); phase/polarity configurable |
| 8 (RESET#/IO3) | Reset / I/O Line 3 | Hardware reset input; serves as IO3 in Quad I/O operation |
Key Features
| Feature | Design Value |
|---|---|
| Hybrid Sector Erase | Combines eight 4-KB + one 32-KB sectors at top/bottom with uniform 64-KB main array - optimizes small-parameter updates and large-firmware overwrites |
| Hardware ECC | On-the-fly single-bit error correction with no CPU overhead - maintains data integrity across 20-year retention window |
| Advanced Sector Protection (ASP) | Password-protected individual sector locking - prevents unauthorized firmware modification during field service or remote updates |
| SFDP & CFI Support | Standardized parameter tables accessible via SPI - enables automatic driver initialization without hard-coded timing or configuration |
| Deep Power-Down Mode | 6 µA typical current draw - extends battery life in always-on edge nodes with infrequent firmware access |
Applications
| Industrial PLC Firmware Storage | Automotive ADAS Boot Memory |
|---|---|
Use Scenario: Storing bootloader and real-time OS images in programmable logic controllers with frequent field updates. IC Role / Device Role / Timing Role: Primary non-volatile boot source accessed via SPI-MIO during cold start; supports suspend/resume during partial reprogramming. Use Value: Hybrid sector architecture allows 4-KB parameter updates without erasing full 64-KB firmware blocks, reducing update time by >70% vs uniform-erase alternatives. | Use Scenario: Secure boot code storage for radar processing units requiring AEC-Q100 Grade 2 qualification (–40°C to +105°C). IC Role / Device Role / Timing Role: Trusted execution environment (TEE) root-of-trust component; OTP stores cryptographic keys; ASP enforces signed firmware validation. Use Value: Hardware ECC and 20-year data retention ensure boot integrity over vehicle lifetime, even under thermal cycling stress. |
| Medical Imaging System Configuration | Smart Grid RTU Firmware |
Use Scenario: Holding calibration tables, sensor profiles, and safety-critical configuration data in portable ultrasound devices. IC Role / Device Role / Timing Role: Non-volatile parameter store accessed via Quad I/O at 66 MBps; SFDP auto-configures host controller timing parameters. Use Value: 1024-byte OTP array securely stores factory-calibrated coefficients, preventing tampering during recalibration procedures. | Use Scenario: Firmware storage for remote terminal units deployed in unattended substations with 15+ year service life. IC Role / Device Role / Timing Role: Long-term firmware archive with deep power-down mode active between polling intervals; block protection prevents accidental overwrite during OTA updates. Use Value: 100,000 program-erase cycles and industrial-grade temperature tolerance ensure reliable operation across seasonal ambient extremes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGMFI101 | Same die, legacy Cypress branding; identical electrical specs and pinout | No functional difference; same Infineon post-merger documentation and support | Select when sourcing from legacy inventory or distributor stock with prior part numbering |
| Winbond W25Q128JVSIM | 3.3 V supply only; no DDR mode; 1.2 V I/O tolerance not supported | Lacks AEC-Q100 qualification and hardware ECC; requires external error handling | Consider only for cost-sensitive non-automotive designs where voltage and reliability requirements are relaxed |
Compared with S25FL128SAGMFI101, this part offers identical functionality under Infineon's unified support model; versus W25Q128JVSIM, it delivers critical automotive-grade reliability, 1.8 V operation, and integrated ECC-justifying premium use in safety-critical firmware storage.
Availability
S25FS128SAGMFB100 is available at Aetrix Electronics and suitable for industrial PLCs, automotive ADAS modules, medical imaging systems, and smart grid RTUs requiring stable component supply across extended product lifecycles.
Supply support for S25FS128SAGMFB100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The FS-S Flash family targets high-reliability embedded systems needing deterministic XIP performance, secure firmware storage, and long-term data integrity-designed specifically for mission-critical boot and configuration memory roles.
FAQ
What is the maximum clock frequency supported in DDR Quad I/O mode?
The S25FS128SAGMFB100 supports up to 80 MHz DDR clock frequency in Quad I/O mode, delivering 80 MBps effective read throughput. This is specified under AC characteristics section 6.5 of the datasheet, with timing validated across the full industrial temperature range and 1.7–2.0 V supply.
Does this device require external ECC circuitry?
No. The device integrates hardware-based ECC that automatically detects and corrects single-bit errors during read operations and generates correction codes during program/erase cycles. No external logic or software intervention is needed to maintain data integrity over its 20-year retention period.
Can the OTP array be reprogrammed after initial write?
No. The 1024-byte OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses and cannot be erased or rewritten. Once written, contents remain immutable-making it suitable for storing cryptographic keys, calibration constants, or security certificates.
Is the WSON 6 × 8 mm package RoHS and REACH compliant?
Yes. The WNH008 package is Pb-free and fully compliant with RoHS Directive 2011/65/EU and REACH Regulation (EC) No. 1907/2006. Material declarations and test reports are available through Infineon's official product change notifications and compliance portal.
S25FS128SAGMFB100 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
S25FS128SAGMFB100 FAQ
1.How can I place an order for S25FS128SAGMFB100 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS128SAGMFB100 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS128SAGMFB100 reliable?
The price and inventory of S25FS128SAGMFB100 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS128SAGMFB100 is usually 5 days.
3.What payment methods are accepted for S25FS128SAGMFB100?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS128SAGMFB100 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS128SAGMFB100?
S25FS128SAGMFB100 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS128SAGMFB100 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS128SAGMFB100?
For technical support, including S25FS128SAGMFB100 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS128SAGMFB100 requirements.
6.How does Aetrix verify that S25FS128SAGMFB100 is sourced from the original manufacturer or authorized distributors?
All S25FS128SAGMFB100 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS128SAGMFB100 meets industry standards.
7.What is the process for return or replacement of S25FS128SAGMFB100?
All S25FS128SAGMFB100 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS128SAGMFB100, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS128SAGMFB100 part is unused and in its original packaging.
Return procedure for S25FS128SAGMFB100:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS128SAGMFB100 Tags
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M24C02-WMN6TP
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AT24C02C-XHM-T
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AT21CS01-STUM10-T
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M24C02-FMC6TG
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