My Inquiry
My Account
Infineon Technologies S25FS128SAGMFI103
- Part No.:
- S25FS128SAGMFI103
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
S25FS128SAGMFI103.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:944
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FS128SAGMFI103 from Infineon is a 128 Mbit (16 MB) serial NOR flash memory IC with SPI Multi-I/O interface, operating at 1.8 V supply. It supports Quad I/O and DDR Quad I/O read modes up to 80 MBps, features hardware ECC, 100,000 program-erase cycles, 20-year data retention, and AEC-Q100 Grade 2 (–40°C to +105°C) qualification for automotive applications.
For engineers reviewing the S25FS128SAGMFI103 datasheet, S25FS128SAGMFI103 pinout, S25FS128SAGMFI103 application, or S25FS128SAGMFI103 equivalent, key selection factors include its hybrid/uniform sector erase architecture, OTP array, advanced sector protection, and compatibility with S25FL-P/S SPI families in footprint and command set.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture, enabling high-speed, low-power SPI-MIO operation with support for both SDR and DDR protocols. Its dual-sector architecture allows flexible memory mapping-eight 4-KB sectors plus one 32-KB or 224-KB sector at top/bottom, with remaining uniform 64-KB or 256-KB blocks.
The integrated SFDP and CFI interfaces provide standardized configuration discovery, while hardware-accelerated ECC ensures single-bit error correction without host intervention. Security is enforced via status-register-based block protection, OTP array, and password-controlled Advanced Sector Protection (ASP).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mbit (16 MB) nonvolatile storage capacity |
| Supply Voltage | 1.7 V to 2.0 V - enables low-power operation in battery-sensitive and automotive systems |
| Max Read Speed | 80 MBps via DDR Quad I/O - supports XIP execution with minimal latency |
| Erase Endurance | 100,000 program-erase cycles - suitable for firmware update-intensive embedded applications |
| Data Retention | 20 years minimum at +85°C - validated for long-life industrial and automotive deployments |
| Temperature Grade | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive ECUs |
| Security Features | 1024-byte OTP array + ASP + hardware/software block protection - enables secure boot and firmware integrity |
Pinout & Package
Package: 8-pin WSON (6 mm × 5 mm, WND008), Pb-free, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command/address/data transfer; controls device participation in bus transactions |
| SO / IO1 | Serial Output / I/O1 | Primary output during standard reads; bidirectional in Dual/Quad I/O modes for data multiplexing |
| WP# / IO2 | Write Protect / I/O2 | Hardware lock for status register and sector protection; serves as second I/O line in multi-I/O commands |
| IO3 / RESET# | I/O3 / Reset | Third I/O line in Quad mode; active-low reset input that halts ongoing operations and returns to standby |
| SI / IO0 | Serial Input / I/O0 | Command/address/data input in SDR; first bidirectional I/O line in multi-I/O configurations |
| SCK | Serial Clock | Master-generated clock synchronizing all SPI transfers; supports modes 0 and 3, up to 133 MHz (SDR) or 80 MHz (DDR) |
| VCC | Power Supply | 1.8 V core supply; decoupling required per datasheet layout guidelines to maintain signal integrity |
| VSS | Ground | Signal and power reference plane; requires low-impedance connection to minimize noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O Interface | Enables 80 MBps read throughput with reduced pin count vs parallel NOR, supporting XIP in resource-constrained MCUs |
| Hybrid Sector Architecture | Combines eight 4-KB and one 32-KB physical sectors at address boundaries - ideal for bootloader + parameter storage partitioning |
| Hardware ECC Engine | On-the-fly single-bit error correction without CPU overhead, improving reliability in extended-temperature environments |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled per-sector read/write lock - prevents unauthorized firmware modification or extraction |
| Serial Flash Discoverable Parameters (SFDP) | Standardized JEDEC JESD216 v1.6+ register map - enables automatic driver configuration across MCU platforms |
Applications
| Automotive ECU Firmware Storage | Industrial PLC Configuration Memory |
|---|---|
Use Scenario: Storing boot code, calibration tables, and OTA-updatable application firmware in engine control units. IC Role / Device Role / Timing Role: Nonvolatile program storage with AEC-Q100 Grade 2 qualification and 20-year data retention. Use Value: Ensures functional safety compliance (ISO 26262 ASIL-B ready) and eliminates field failures due to data corruption over vehicle lifetime. | Use Scenario: Holding runtime configuration, I/O mapping, and firmware patches in programmable logic controllers. IC Role / Device Role / Timing Role: High-reliability, sector-protected memory for deterministic startup and hot-swap updates. Use Value: Hybrid sector layout isolates critical boot sectors from frequent reprogramming of user logic blocks, reducing risk of bricking. |
| Medical Imaging Bootloader Storage | Edge AI Inference Model Cache |
Use Scenario: Securely storing certified bootloader images and cryptographic keys in diagnostic imaging subsystems. IC Role / Device Role / Timing Role: OTP-secured, ASP-protected flash for tamper-resistant boot chain enforcement. Use Value: Prevents unauthorized firmware replacement and meets FDA cybersecurity guidance for Class II devices. | Use Scenario: Caching quantized neural network weights and activation parameters for low-latency inference on edge SoCs. IC Role / Device Role / Timing Role: High-bandwidth Quad DDR read interface feeding DMA engines with minimal CPU involvement. Use Value: 80 MBps read speed reduces model load time by >60% vs legacy SPI NOR, accelerating inference pipeline startup. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS128SAGNFI101 | Same die, identical electrical specs, but WSON 6×8 mm (WNH008) package instead of 6×5 mm (WND008) | Larger footprint requires PCB redesign; same thermal and timing behavior | Select when board layout accommodates larger WSON or when higher thermal mass is preferred |
| Winbond W25Q128JVSIM | 1.8 V, 128 Mbit, but lacks DDR mode, ASP, and AEC-Q100 Grade 2 qualification; max Quad read = 40 MBps | Not suitable for automotive or safety-critical use; lower security and performance ceiling | Consider only for cost-sensitive industrial applications where DDR and ASP are unnecessary |
Compared with S25FS128SAGMFI103, the S25FS128SAGNFI101 offers identical functionality in a larger WSON package, while the W25Q128JVSIM trades DDR, ASP, and automotive qualification for lower cost and broader commercial availability.
Availability
S25FS128SAGMFI103 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC development, and medical imaging system integration requiring stable component supply and long-term lifecycle assurance.
Supply support for S25FS128SAGMFI103 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.
The FS-S Flash product line delivers high-reliability, feature-rich serial NOR flash optimized for automotive-grade firmware storage, secure boot, and real-time embedded systems demanding robust data integrity and long-term availability.
FAQ
What is the maximum clock frequency supported in DDR Quad I/O mode?
The S25FS128SAGMFI103 supports up to 80 MHz in DDR Quad I/O mode, delivering 80 MBps effective read bandwidth. This frequency is specified under industrial temperature conditions (–40°C to +85°C) with proper signal integrity layout and VCC regulation within 1.7–2.0 V.
Does this device require external ECC circuitry?
No. The device integrates hardware-based ECC that automatically detects and corrects single-bit errors during read operations. No external logic or software overhead is needed, and correction occurs transparently within the memory controller path.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP (One-Time Programmable) array is permanently programmed using high-voltage pulses and cannot be erased or rewritten. Once written, its contents remain immutable, making it suitable for storing cryptographic keys or device-specific identifiers.
Is the S25FS128SAGMFI103 pin-compatible with earlier S25FL-S family devices?
Yes - it maintains footprint and command-set compatibility with S25FL-S devices in 8-pin WSON packages. However, DDR mode, ASP, and enhanced SFDP support are new features not present in legacy S25FL-S parts, requiring firmware updates for full utilization.
S25FS128SAGMFI103 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
S25FS128SAGMFI103 FAQ
1.How can I place an order for S25FS128SAGMFI103 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS128SAGMFI103 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS128SAGMFI103 reliable?
The price and inventory of S25FS128SAGMFI103 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS128SAGMFI103 is usually 5 days.
3.What payment methods are accepted for S25FS128SAGMFI103?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS128SAGMFI103 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS128SAGMFI103?
S25FS128SAGMFI103 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS128SAGMFI103 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS128SAGMFI103?
For technical support, including S25FS128SAGMFI103 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS128SAGMFI103 requirements.
6.How does Aetrix verify that S25FS128SAGMFI103 is sourced from the original manufacturer or authorized distributors?
All S25FS128SAGMFI103 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS128SAGMFI103 meets industry standards.
7.What is the process for return or replacement of S25FS128SAGMFI103?
All S25FS128SAGMFI103 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS128SAGMFI103, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS128SAGMFI103 part is unused and in its original packaging.
Return procedure for S25FS128SAGMFI103:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS128SAGMFI103 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
