My Inquiry
My Account
Infineon Technologies S25FS128SAGMFV101
- Part No.:
- S25FS128SAGMFV101
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-SOIC (0.209", 5.30mm Width)
- Datasheet:
-
S25FS128SAGMFV101.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 8SOIC
- Quantity:
- Payment:
- Shipping:
Inventory:2,309
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
S25FS128SAGMFV101 from Infineon is a 128 Mbit (16 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V supply. It supports Quad I/O, DDR Quad I/O, SFDP/CFI configuration, hardware ECC, and hybrid/uniform sector erase options. Designed for embedded boot code storage in industrial control systems requiring AEC-Q100 Grade 2 (–40°C to +105°C) reliability.
For engineers reviewing the S25FS128SAGMFV101 datasheet, S25FS128SAGMFV101 pinout, S25FS128SAGMFV101 application, or S25FS128SAGMFV101 equivalent, key selection factors include 133 MHz Fast Read (66 MBps), 256-byte page programming buffer, OTP array, block protection via status register, and WSON 6 × 5 mm (WND008) package compatibility.
Technical Context
This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density nonvolatile storage with deterministic timing for XIP-capable microcontroller boot. It supports SPI clock modes 0 and 3, extended addressing (24-/32-bit), and command subsets compatible with S25FL-P/S families.
The flash integrates on-die ECC for single-bit correction and supports both hybrid sector erase (eight 4-KB + one 32-KB sectors) and uniform 64-KB sector options. Erase suspend/resume, program suspend/resume, and deep power-down (6 µA) are implemented in hardware without external controller intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mbit (16 MB) - fixed capacity for boot image and firmware storage in space-constrained designs |
| Supply Voltage | 1.7 V to 2.0 V - optimized for low-power 1.8 V system rails with ±0.15 V tolerance |
| Read Speed | Quad I/O at 133 MHz = 66 MBps - enables fast execution-in-place (XIP) from flash without local RAM copy |
| Erase Endurance | 100,000 cycles minimum - supports field firmware updates over product lifetime |
| Data Retention | 20 years minimum at +85°C - ensures long-term integrity of stored boot code and calibration data |
| Temperature Grade | Industrial Plus (–40°C to +105°C) - validated for extended thermal operation in motor drives and power converters |
| Package | WSON 6 × 5 mm (WND008), 8-pin - surface-mount footprint with exposed pad for thermal dissipation |
Pinout & Package
Package: WSON 6 × 5 mm (WND008), 8-lead, Pb-free, moisture sensitivity level 3 (MSL3).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (CS#) | Chip Select | Active-low enable for SPI command latching; must be held low during entire transaction |
| 2 (DO / IO1) | Serial Output / I/O Line 1 | Output during standard read; bidirectional in Dual/Quad I/O modes for data transfer |
| 3 (WP# / IO2) | Write Protect / I/O Line 2 | Hardware lock for top/bottom sectors when asserted low; also functions as Quad I/O pin |
| 4 (GND) | Ground | Signal and power reference plane; connected to exposed pad for thermal conduction |
| 5 (VCC) | Power Supply | 1.8 V core supply; requires local 1 µF ceramic decoupling adjacent to pin |
| 6 (SI / IO0) | Serial Input / I/O Line 0 | Command/address input in standard mode; bidirectional in Multi-I/O for full-duplex transfers |
| 7 (SCK) | Serial Clock | Input-only clock; supports up to 133 MHz SDR or 80 MHz DDR for timing-critical boot sequences |
| 8 (RESET# / IO3) | Reset / I/O Line 3 | Hardware reset initiation; also serves as fourth I/O line in Quad mode for maximum bandwidth |
Key Features
| Feature | Design Value |
|---|---|
| DDR Quad I/O Read | 80 MBps throughput using double-data-rate on four lines - reduces boot time by ~2× vs. standard Quad I/O |
| On-Die ECC | Automatic single-bit error correction per 512-bit word - eliminates need for external error-handling logic in safety-critical boot paths |
| Hybrid Sector Architecture | Eight 4-KB + one 32-KB sectors at top/bottom - enables fine-grained protection of bootloader while preserving large contiguous space for application firmware |
| OTP Array | 1024-byte one-time-programmable region - stores immutable keys, device IDs, or calibration constants resistant to field reprogramming |
| Deep Power-Down Mode | 6 µA typical current - extends battery life in always-on edge nodes without sacrificing nonvolatile retention |
Applications
| Industrial Motor Control | Automotive ADAS Camera Module |
|---|---|
Use Scenario: Storing boot firmware and real-time motion control algorithms in servo drives with thermal cycling from –40°C to +105°C. IC Role / Device Role / Timing Role: Primary boot memory mapped into MCU address space for XIP execution; provides deterministic <50 ns access latency during startup. Use Value: Hybrid sector layout isolates bootloader from field-updatable motor profile tables, reducing risk of corruption during over-the-air updates. | Use Scenario: Holding camera sensor initialization parameters and ISP firmware in rear-view and surround-view modules meeting AEC-Q100 Grade 2. IC Role / Device Role / Timing Role: Nonvolatile configuration store accessed during cold boot; supports SFDP parsing for dynamic interface configuration. Use Value: On-die ECC ensures pixel pipeline calibration data remains intact after 10,000+ thermal cycles in under-hood environments. |
| Medical Imaging Edge Node | Smart Grid RTU |
Use Scenario: Securing diagnostic firmware and regulatory-compliant calibration coefficients in portable ultrasound devices with battery backup. IC Role / Device Role / Timing Role: Trusted storage for encrypted boot images; OTP array holds asymmetric key pairs used in secure boot chain. Use Value: Block protection + ASP prevents unauthorized modification of FDA-cleared software revisions during service interventions. | Use Scenario: Hosting protocol stack (IEC 61850, DNP3) and grid event logs in remote terminal units deployed in substations. IC Role / Device Role / Timing Role: High-endurance flash for cyclic logging; uniform 64-KB erase blocks align with firmware update partitioning schemes. Use Value: 100,000 program-erase cycles support daily firmware patching over 27-year deployment without wear leveling overhead. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGMFV101 | Same die, legacy Cypress branding pre-Infineon acquisition; identical electrical specs and pinout | No functional difference; supported by same Infineon documentation and tools | Select when maintaining legacy BOM continuity or sourcing from distributors with existing Cypress stock |
| Winbond W25Q128JVSIM | 1.8 V Quad SPI NOR; no DDR mode, no on-die ECC, 64-KB uniform sectors only | Lacks hybrid sector option and hardware ECC - requires external error handling and limits bootloader isolation flexibility | Choose for cost-sensitive designs where DDR performance and ECC are not required, and simpler sector management suffices |
Compared with S25FS128SAGMFV101, the Cypress variant offers identical functionality under new branding, while the Winbond part trades DDR speed and ECC for lower unit cost and broader distributor availability - making it suitable only where those features are noncritical.
Availability
S25FS128SAGMFV101 is available at Aetrix Electronics and suitable for industrial motor control, automotive ADAS camera modules, medical imaging edge nodes, and smart grid RTUs requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for S25FS128SAGMFV101 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and connectivity solutions for automotive, industrial, and IoT markets.
The FS-S Flash family targets high-reliability embedded systems needing deterministic boot performance, robust data integrity, and AEC-Q100 compliance - with emphasis on seamless migration from legacy S25FL series.
FAQ
Is S25FS128SAGMFV101 pin-compatible with S25FL128SAGMFV101?
Yes, S25FS128SAGMFV101 is a direct replacement for S25FL128SAGMFV101 with identical WSON 6 × 5 mm (WND008) pinout, signal timing, and command set. Infineon retained full backward compatibility after acquiring Cypress's flash business, including register maps and SFDP descriptors.
Does this device support execute-in-place (XIP) operation?
Yes, S25FS128SAGMFV101 supports continuous read mode for XIP execution, with burst wrap capability and deterministic latency. The device delivers up to 66 MBps in Quad I/O mode, enabling MCU cores to fetch instructions directly from flash without intermediate RAM buffering.
What is the function of the RESET# / IO3 pin in normal operation?
In standard SPI mode, RESET# / IO3 serves as hardware reset input. During Quad I/O operations, it functions as IO3 - the fourth bidirectional data line. Its dual role is controlled by instruction opcode and is transparent to host software when using standard read/write commands.
How is the 1024-byte OTP array protected against accidental overwrite?
The OTP array is write-locked after initial programming via dedicated One-Time Program commands. Once programmed, bits cannot be changed; further writes return status indicating lock violation. Protection is enforced in hardware - no software or voltage-based override is possible, ensuring permanent storage of cryptographic keys or calibration data.
S25FS128SAGMFV101 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 8-SOIC (0.209", 5.30mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 105°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
S25FS128SAGMFV101 FAQ
1.How can I place an order for S25FS128SAGMFV101 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS128SAGMFV101 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS128SAGMFV101 reliable?
The price and inventory of S25FS128SAGMFV101 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS128SAGMFV101 is usually 5 days.
3.What payment methods are accepted for S25FS128SAGMFV101?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS128SAGMFV101 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS128SAGMFV101?
S25FS128SAGMFV101 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS128SAGMFV101 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS128SAGMFV101?
For technical support, including S25FS128SAGMFV101 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS128SAGMFV101 requirements.
6.How does Aetrix verify that S25FS128SAGMFV101 is sourced from the original manufacturer or authorized distributors?
All S25FS128SAGMFV101 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS128SAGMFV101 meets industry standards.
7.What is the process for return or replacement of S25FS128SAGMFV101?
All S25FS128SAGMFV101 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS128SAGMFV101, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS128SAGMFV101 part is unused and in its original packaging.
Return procedure for S25FS128SAGMFV101:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
S25FS128SAGMFV101 Tags
-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology
-
AT21CS01-STUM10-T
Microchip Technology
-
AT24C02C-SSHM-T
Microchip Technology
-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics
-
AT24CS02-SSHM-T
Microchip Technology
-
93LC46BT-I/OT
Microchip Technology
-
AT24C04C-SSHM-T
Microchip Technology
-
24LC01BT-I/SN
Microchip Technology
-
24AA02UIDT-I/OT
Microchip Technology
-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
