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Infineon Technologies S25FS128SAGNFI000

Part No.:
S25FS128SAGNFI000
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
8-WDFN Exposed Pad
Datasheet:
AetrixS25FS128SAGNFI000.pdf
Description:
IC FLASH 128MBIT SPI/QUAD 8WSON
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:830

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Product details

Overview

S25FS128SAGNFI000 from Infineon is a 128 Mbit (16 MB) serial NOR flash memory IC with SPI Multi-I/O interface, operating at 1.8 V supply, supporting DDR Quad I/O read up to 80 MBps, hybrid/ uniform sector erase options, and integrated hardware ECC for single-bit error correction. It is used in industrial embedded systems requiring reliable nonvolatile code storage and XIP execution.

For engineers reviewing the S25FS128SAGNFI000 datasheet, S25FS128SAGNFI000 pinout, S25FS128SAGNFI000 application, or S25FS128SAGNFI000 equivalent, key selection criteria include 1.7–2.0 V supply range, AEC-Q100 Grade 2 (–40°C to +105°C) qualification, WSON 6 × 5 mm package, SFDP/CFI support, and OTP array security features.

Technical Context

This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density NOR flash with deterministic timing and robust data retention. Its SPI-MIO interface supports standard SPI modes 0/3, dual/quad I/O, DDR Quad I/O, and extended addressing (24-/32-bit), ensuring compatibility with legacy S25FL-P/S families while delivering higher bandwidth than conventional SPI flash.

The embedded algorithm engine handles page programming (256/512-byte buffers), erase suspend/resume, and automatic ECC generation. Sector protection is implemented via status register bits, hardware/software WP#, and Advanced Sector Protection (ASP) with password-controlled access-enabling secure boot code partitioning and firmware integrity enforcement.

Key Specifications

ParameterValue and Actual Design Meaning
Density128 Mbit (16 MB) - fixed capacity for boot code and firmware image storage in space-constrained designs
Supply Voltage1.7 V to 2.0 V - enables low-power operation in 1.8 V system rails without level-shifting
Read Bandwidth80 MBps DDR Quad I/O - supports real-time XIP execution of firmware from flash without local RAM buffering
Erase Endurance100,000 program-erase cycles - ensures longevity in field-updatable embedded applications
Data Retention20 years minimum - guarantees firmware integrity over full product lifecycle in industrial environments
Temperature Range–40°C to +105°C (Industrial Plus / AEC-Q100 Grade 2) - validated for under-hood automotive and factory-floor control units
Security Features1024-byte OTP array + ASP with password read control - enables immutable root-of-trust and secure firmware authentication

Pinout & Package

Package: WSON 6 × 5 mm (WND008), 8-pin, Pb-free, moisture sensitivity level 3 (MSL3).

Pin/TerminalCircuit RoleDesign Meaning
1 (CS#)Chip SelectActive-low enable for SPI command latching; must be asserted before clock edge to initiate transaction
2 (DO/IO1)Serial Output / I/O1Output during standard/fast read; bidirectional during Dual/Quad I/O; requires pull-up for tri-state release
3 (WP#/IO2)Write Protect / I/O2Hardware lock for sector protection when held low; functions as I/O2 in Quad mode
4 (VSS)GroundSignal and power return path; decoupling capacitor required within 5 mm of pin
5 (VCC)Power Supply1.7–2.0 V core supply; bypassed with 1 µF ceramic capacitor adjacent to pin
6 (SI/IO0)Serial Input / I/O0Command/data input in standard mode; bidirectional I/O0 in Multi-I/O protocols
7 (SCK)Serial ClockInput-only clock; supports up to 133 MHz SDR or 80 MHz DDR; duty cycle tolerance ±5%
8 (RESET#/IO3)Reset / I/O3Hardware reset trigger (active-low); serves as I/O3 in Quad mode; internal pull-down when unused

Key Features

FeatureDesign Value
DDR Quad I/O InterfaceEnables 80 MBps read throughput using double-data-rate on four I/O lines-reducing bus occupancy vs. SDR Quad I/O by 50%
Hybrid Sector ArchitectureCombines eight 4-KB + one 32-KB sectors at top/bottom with 64-KB main array-optimizes small-parameter storage and large-firmware updates
Automatic Hardware ECCOn-the-fly single-bit error correction without CPU intervention-eliminates need for external error-handling firmware overhead
Advanced Sector Protection (ASP)Password-protected per-sector read/write control-supports secure boot loader isolation and anti-rollback firmware versioning
SFDP & CFI ComplianceSelf-describing configuration via JEDEC JESD216 SFDP table-enables automatic driver initialization without hard-coded timing parameters

Applications

Automotive Instrument ClusterIndustrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, CAN message lookup tables, and OTA update staging area in digital dashboards.

IC Role / Device Role / Timing Role: Nonvolatile code and data storage with XIP-capable Quad DDR read for real-time UI rendering.

Use Value: 80 MBps DDR Quad I/O eliminates frame stutter during dynamic gauge animation; AEC-Q100 Grade 2 rating ensures reliability at 105°C ambient.

Use Scenario: Holding ladder logic runtime images, I/O mapping tables, and safety-critical firmware patches in modular control cabinets.

IC Role / Device Role / Timing Role: Boot-time firmware loader and field-update repository with hardware write protection against accidental corruption.

Use Value: Hybrid sector layout allows atomic 4-KB parameter updates alongside 64-KB firmware swaps; 100K-cycle endurance supports 10+ years of scheduled maintenance cycles.

Medical Imaging Boot LoaderEdge AI Gateway Configuration

Use Scenario: Securely storing signed bootloader binaries and cryptographic keys for DICOM protocol stack initialization in portable ultrasound devices.

IC Role / Device Role / Timing Role: Root-of-trust anchor with OTP-based key vault and ASP-enforced read lockdown.

Use Value: 1024-byte OTP array stores immutable public keys; password-controlled ASP prevents unauthorized firmware introspection during regulatory audit.

Use Scenario: Hosting model weights metadata, sensor calibration profiles, and network stack configuration in battery-powered smart sensors.

IC Role / Device Role / Timing Role: Low-voltage (1.8 V) persistent configuration store with deep power-down current of 6 µA.

Use Value: 0.006 mA deep power-down extends battery life >10 years in LoRaWAN nodes; SFDP auto-detection simplifies driver porting across sensor variants.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Cypress S25FL128SAGNFI010Same die, identical pinout and timing; differs only in marking and traceability documentationNo functional difference; qualified for same AEC-Q100 Grade 2 and Industrial Plus temperature gradesSelect when cross-qualified sourcing or legacy BOM continuity is required
Winbond W25Q128JVSIM1.8 V, 128 Mbit, but lacks DDR mode, ASP, and hybrid sector options; max Quad I/O = 40 MBpsSuitable for cost-sensitive consumer applications where XIP bandwidth and advanced security are not requiredChoose only if DDR performance and OTP/ASP features are unnecessary and lower cost is primary

Compared with S25FS128SAGNFI000, the Cypress alternative offers identical functionality and qualification, while the Winbond part trades DDR bandwidth, sector flexibility, and security for lower unit cost-making it viable only in non-safety-critical, non-XIP use cases.

Availability

S25FS128SAGNFI000 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging boot loaders, and edge AI gateways requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for S25FS128SAGNFI000 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for automotive, industrial, and IoT markets.

The FS-S Flash family targets high-reliability embedded systems needing deterministic boot performance, secure firmware updates, and extended temperature operation-designed specifically for automotive ADAS, industrial control, and medical diagnostics platforms.

FAQ

Is S25FS128SAGNFI000 pin-compatible with earlier S25FL-A or S25FL-K series devices?

Yes, it maintains footprint compatibility with S25FL-A, S25FL-K, S25FL-P, and S25FL-S families in the same WSON 6×5 mm package. Signal mapping, voltage levels, and command set subsets are preserved, enabling drop-in replacement in existing PCB layouts without redesign-though DDR and ASP features require updated firmware initialization sequences.

Does this device support Execute-in-Place (XIP) operation?

Yes, it supports continuous read mode for true XIP execution, including Fast Read, Dual I/O, Quad I/O, and DDR Quad I/O commands. The burst wrap feature enables seamless address wrapping during instruction fetch, and SFDP provides programmable latency and dummy cycle parameters required for reliable cache-line-aligned execution from flash.

What is the function of the RESET#/IO3 pin in normal operation?

In standard SPI mode, RESET#/IO3 serves as an active-low hardware reset input that forces the device into a known state and clears internal registers. When configured for Quad I/O, it becomes IO3-functioning as a bidirectional data line. Internal weak pull-down ensures safe default behavior during power-up or floating conditions.

How does the hybrid sector architecture improve firmware update reliability?

Hybrid sector architecture isolates critical boot code in protected 4-KB sectors while allocating larger 64-KB blocks for application firmware. This enables atomic updates: a failed 64-KB erase/program leaves the 4-KB boot sector intact, guaranteeing recovery capability. Combined with erase suspend/resume, it allows background updates without halting real-time system operation.

S25FS128SAGNFI000 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
FS-S
Package/Case:
8-WDFN Exposed Pad
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Memory Type:
Non-Volatile
Memory Format:
FLASH
Technology:
FLASH - NOR
Memory Size:
128Mbit
Memory Organization:
16M x 8
Memory Interface:
SPI - Quad I/O, QPI
Clock Frequency:
133 MHz
Write Cycle Time - Word, Page:
-
Access Time:
-
Voltage - Supply:
1.7V ~ 2V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-WSON (6x8)

S25FS128SAGNFI000 FAQ

1.How can I place an order for S25FS128SAGNFI000 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS128SAGNFI000 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS128SAGNFI000 reliable?

The price and inventory of S25FS128SAGNFI000 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS128SAGNFI000 is usually 5 days.

3.What payment methods are accepted for S25FS128SAGNFI000?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS128SAGNFI000 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS128SAGNFI000?

S25FS128SAGNFI000 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS128SAGNFI000 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS128SAGNFI000?

For technical support, including S25FS128SAGNFI000 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS128SAGNFI000 requirements.

6.How does Aetrix verify that S25FS128SAGNFI000 is sourced from the original manufacturer or authorized distributors?

All S25FS128SAGNFI000 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS128SAGNFI000 meets industry standards.

7.What is the process for return or replacement of S25FS128SAGNFI000?

All S25FS128SAGNFI000 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS128SAGNFI000, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS128SAGNFI000 part is unused and in its original packaging.

Return procedure for S25FS128SAGNFI000:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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