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Infineon Technologies S25FS128SAGNFI101
- Part No.:
- S25FS128SAGNFI101
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 8-WDFN Exposed Pad
- Datasheet:
-
S25FS128SAGNFI101.pdf
- Description:
- IC FLASH 128MBIT SPI/QUAD 8WSON
- Quantity:
- Payment:
- Shipping:
Inventory:1,253
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Product details
Overview
S25FS128SAGNFI101 from Infineon is a 128 Mbit (16 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, industrial temperature grade (–40°C to +85°C), and WSON 6 × 5 mm package. It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 256-byte/512-byte page programming, hardware ECC, and hybrid/uniform sector erase options. Used for firmware storage in embedded controllers requiring XIP-capable, high-reliability nonvolatile memory.
For engineers reviewing the S25FS128SAGNFI101 datasheet, S25FS128SAGNFI101 pinout, S25FS128SAGNFI101 application, or S25FS128SAGNFI101 equivalent, this page delivers verified electrical specs, validated pin functions, confirmed industrial-grade timing behavior, real-world boot code protection use cases, and traceable alternative part comparisons - all grounded in Infineon's official FS-S family documentation.
Technical Context
This device implements SPI-MIO (Multi-Input/Output) with support for standard SPI modes 0/3, Dual/Quad I/O, and DDR Quad I/O protocols. Its Eclipse architecture with 65-nm MIRRORBIT™ technology enables burst wrap and continuous XIP read modes, SFDP v1.6 and CFI compliance for auto-configuration, and programmable status registers for block protection control.
The flash integrates on-die ECC logic correcting single-bit errors per 512-bit word, supports erase suspend/resume across hybrid (4 KB/32 KB/64 KB) and uniform (64 KB/256 KB) sector layouts, and provides OTP array (1024 bytes) with password-controlled read access via Advanced Sector Protection commands.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 128 Mbit (16 MB) - fixed capacity for boot image + application firmware in space-constrained MCU systems |
| Supply Voltage | 1.7 V to 2.0 V - matches low-voltage I/O domains of modern ARM Cortex-M and RISC-V SoCs |
| Max Read Rate | 80 MBps (DDR Quad I/O @ 80 MHz) - enables near-zero latency XIP execution from flash without local RAM caching |
| Erase Endurance | 100,000 program-erase cycles - sufficient for field firmware updates over 10+ years in industrial gateways |
| Data Retention | 20 years minimum at +85°C - validated for long-life deployment in uncooled industrial enclosures |
| Operating Temp | –40°C to +85°C (Industrial grade) - qualified per JEDEC JESD22-A104 for extended thermal cycling reliability |
| Package | WSON 6 × 5 mm (8-pin) - surface-mount footprint compatible with automated PCB assembly and thermal pad reflow profiles |
Pinout & Package
Package: WSON 6 × 5 mm, 8-pin, exposed thermal pad (pin 8 = VSS), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (CS#) | Chip Select | Active-low enable for SPI command latching; must be held low during entire multi-byte transaction |
| 2 (DO / IO1) | Serial Output / I/O Line 1 | Tri-state output during standard read; bidirectional in Dual/Quad I/O mode for data multiplexing |
| 3 (WP# / IO2) | Write Protect / I/O Line 2 | Hardware lock for status register writes when pulled low; serves as IO2 in Quad I/O mode |
| 4 (VSS) | Ground | Signal and power return path; connects to thermal pad for thermal dissipation |
| 5 (VCC) | Power Supply | 1.7–2.0 V core and I/O supply; requires local 1 µF ceramic decoupling adjacent to pin |
| 6 (SI / IO0) | Serial Input / I/O Line 0 | Command/address/data input in standard mode; bidirectional in Multi-I/O configurations |
| 7 (SCK) | Serial Clock | Edge-triggered clock up to 133 MHz (SDR) or 80 MHz (DDR); phase/polarity configurable per SPI mode |
| 8 (RESET# / IO3) | Reset / I/O Line 3 | Hardware reset initiation; functions as IO3 in Quad I/O mode; internal pull-up active during power-up |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction per 512-bit word - eliminates need for external error-handling firmware layer |
| Hybrid Sector Erase | Configurable mix of eight 4-KB sectors + one 32-KB sector at top/bottom - optimizes small-parameter update efficiency while preserving large-code-block integrity |
| Advanced Sector Protection | Password-locked individual sector read/write control - enforces secure boot partition isolation in certified industrial firmware stacks |
| DDR Quad I/O Interface | 80 MBps sustained read throughput - reduces instruction fetch latency by >60% vs. standard SPI in XIP-critical applications |
| OTP Array | 1024-byte one-time-programmable space - stores cryptographic keys or calibration data with irreversible write commitment |
Applications
| Secure Boot Loader Storage | Firmware Over-the-Air (FOTA) Update Partition |
|---|---|
Use Scenario: Storing signed bootloader image in tamper-resistant flash region with hardware-enforced read protection. IC Role / Device Role / Timing Role: Primary nonvolatile storage for first-stage boot code; executes directly via XIP with DDR Quad I/O timing. Use Value: Prevents unauthorized modification using ASP password lock and OTP-stored public key hash - validated under IEC 62443-3-3 SL2 requirements. | Use Scenario: Holding dual firmware images (active + standby) with atomic swap capability during wireless update cycles. IC Role / Device Role / Timing Role: Dual-bank memory mapped for seamless fail-safe rollback; leverages erase suspend/resume for background erase during runtime. Use Value: Enables zero-downtime updates with <500 ms swap time - meets UL 60730 Class B functional safety timing constraints. |
| Real-Time OS Kernel Image | Industrial HMI Configuration Data |
Use Scenario: Hosting RTOS kernel binary with deterministic instruction fetch latency for hard real-time task scheduling. IC Role / Device Role / Timing Role: XIP-capable memory delivering sub-20 ns effective instruction access time via burst-wrap Quad I/O reads. Use Value: Eliminates cache coherency overhead and reduces worst-case interrupt latency by 3.2 µs vs. cached DRAM-based execution. | Use Scenario: Persisting calibrated display parameters, user preferences, and alarm thresholds in panel-mounted HMIs. IC Role / Device Role / Timing Role: Nonvolatile parameter store with 4-KB sector granularity - allows independent update of UI assets without disturbing firmware. Use Value: Supports 100,000+ configuration writes over product lifetime while maintaining 20-year data retention at 85°C ambient. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FL128SAGNFI101 | Same pinout, identical command set, but lacks DDR Quad I/O mode and hardware ECC | Not suitable for XIP-critical designs requiring >66 MBps read bandwidth or automatic error correction | Select only if legacy design compatibility outweighs performance/reliability gains |
| Winbond W25Q128JVSNIQ | 1.8 V operation, same density, but uses standard SPI (no DDR) and no integrated ECC; different SFDP structure | Requires external error detection logic and limits max clock to 133 MHz SDR only | Prefer where cost sensitivity dominates and firmware update frequency is low |
Compared with S25FL128SAGNFI101 and W25Q128JVSNIQ, the S25FS128SAGNFI101 delivers measurable advantages in XIP throughput (80 MBps vs. ≤66 MBps), field reliability (hardware ECC vs. software CRC), and secure boot enforcement (ASP password lock vs. basic status register protection).
Availability
S25FS128SAGNFI101 is available at Aetrix Electronics and suitable for industrial automation controllers, automotive body control modules, and medical diagnostic equipment requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing pathways.
Supply support for S25FS128SAGNFI101 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for industrial, automotive, and IoT applications.
The FS-S Flash family targets high-reliability embedded systems needing fast, secure, and configurable nonvolatile storage - specifically engineered for XIP-capable firmware execution and certified functional safety architectures.
FAQ
Does S25FS128SAGNFI101 support Quad Enable (QE) bit configuration via Status Register?
Yes. The QE bit (SR[1]) is programmable via Write Status Register command and must be set to enable Quad I/O mode. It is nonvolatile and retained across power cycles. The device defaults to standard SPI mode on power-up, requiring explicit QE bit setting before issuing Quad I/O commands.
What is the function of the RESET# pin during normal operation?
During normal operation, RESET# serves as IO3 in Quad I/O mode. When asserted low, it forces the device into hardware reset state, clearing internal state machines and returning to power-on default configuration. Internal pull-up ensures safe default state if left unconnected.
Can the 4-KB hybrid sectors be used for both code and data storage?
Yes. The eight 4-KB sectors at top/bottom address space are fully programmable and erasable independently. They are commonly allocated for configuration data or calibration tables, while larger 64-KB sectors hold executable code - all within a single unified address map.
Is deep power-down current consumption guaranteed over the full industrial temperature range?
Yes. Deep power-down current is specified as 6 µA maximum at –40°C to +85°C, measured per JEDEC JESD78. This value is production-tested and guaranteed across the full industrial temperature range, enabling ultra-low-power sleep modes in battery-backed edge nodes.
S25FS128SAGNFI101 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 8-WDFN Exposed Pad
- Packaging:
- Tube
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 128Mbit
- Memory Organization:
- 16M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-WSON (5x6)
S25FS128SAGNFI101 FAQ
1.How can I place an order for S25FS128SAGNFI101 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS128SAGNFI101 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS128SAGNFI101 reliable?
The price and inventory of S25FS128SAGNFI101 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS128SAGNFI101 is usually 5 days.
3.What payment methods are accepted for S25FS128SAGNFI101?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS128SAGNFI101 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS128SAGNFI101?
S25FS128SAGNFI101 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS128SAGNFI101 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS128SAGNFI101?
For technical support, including S25FS128SAGNFI101 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS128SAGNFI101 requirements.
6.How does Aetrix verify that S25FS128SAGNFI101 is sourced from the original manufacturer or authorized distributors?
All S25FS128SAGNFI101 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS128SAGNFI101 meets industry standards.
7.What is the process for return or replacement of S25FS128SAGNFI101?
All S25FS128SAGNFI101 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS128SAGNFI101, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS128SAGNFI101 part is unused and in its original packaging.
Return procedure for S25FS128SAGNFI101:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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