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Infineon Technologies S25FS256SAGBHI203
- Part No.:
- S25FS256SAGBHI203
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FS256SAGBHI203.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,241
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Product details
Overview
S25FS256SAGBHI203 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, 1.8 V supply, industrial-plus temperature range (–40°C to +105°C), and BGA-24 6 × 8 mm package (FAC024 footprint). It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 100,000 program-erase cycles, 20-year data retention, and hardware ECC.
For engineers reviewing the S25FS256SAGBHI203 datasheet, S25FS256SAGBHI203 pinout, S25FS256SAGBHI203 application, or S25FS256SAGBHI203 equivalent, key selection criteria include hybrid/uniform sector erase options, OTP array size (1024 bytes), SFDP/CFI compliance, AEC-Q100 Grade 2 qualification, and compatibility with S25FL-P/S25FL-S families.
Technical Context
This device implements Infineon's 65-nm MIRRORBIT™ Eclipse architecture with embedded hardware ECC for single-bit correction and error detection. It operates in standard SPI modes 0/3 and supports extended addressing (24-/32-bit), burst wrap, continuous XIP, and QPI mode for enhanced execution-in-place capability.
The flash integrates dual-mode protection: status register-based block protection and advanced sector protection (ASP) with password-controlled read access and boot-code-triggered individual sector locking - enabling secure firmware storage and field-upgrade integrity in automotive and industrial control systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbits (32 MB) - fixed capacity for firmware image storage in resource-constrained embedded hosts |
| Supply Voltage | 1.7 V to 2.0 V - optimized for low-power 1.8 V system rails with tight regulation tolerance |
| Read Throughput | 80 MBps DDR Quad I/O - enables real-time XIP of compressed boot code without external RAM buffering |
| Erase Endurance | 100,000 cycles minimum - supports frequent OTA firmware updates over 10+ years in telematics ECUs |
| Data Retention | 20 years minimum at +105°C - validated for long-life operation in under-hood automotive environments |
| Temperature Grade | Industrial Plus (–40°C to +105°C) - qualified per AEC-Q100 Grade 2 for engine control and ADAS modules |
| OTP Array | 1024 bytes - stores immutable keys, calibration constants, or device-specific identifiers with one-time write lock |
Pinout & Package
Package: BGA-24, 6 × 8 mm, FAC024 footprint (4 × 6 ball array), Pb-free, known tested die.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS# | Chip Select | Active-low enable for SPI command latching; supports daisy-chain configuration with hold-time margin |
| SCK | Serial Clock | Input clock for SDR (up to 133 MHz) or DDR (up to 80 MHz); phase/polarity configurable per mode 0/3 |
| IO0–IO3 | Multi-I/O Data Lines | Bi-directional pins supporting single/dual/quad I/O and DDR protocols; IO2/IO3 double as WP#/RESET# |
| VCC | Power Supply | 1.8 V core supply; requires local 1 µF + 100 nF decoupling per JEDEC guidelines |
| VSS | Ground | Signal and power return; dedicated VSS balls on all four corners for impedance control |
| NC | No Connect | Unbonded pad; must be left floating or tied to VSS per layout rules to avoid noise coupling |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction with no software overhead; maintains data integrity during power-loss events |
| Hybrid Sector Erase | Mixed 4-KB/32-KB/224-KB physical sectors at address boundaries - enables fast parameter update without erasing full firmware image |
| Advanced Sector Protection (ASP) | Password-protected read lock per sector - prevents unauthorized firmware extraction while allowing debug access via authenticated boot loader |
| SFDP & CFI Compliance | Standardized parameter tables accessible via SPI - enables automatic driver initialization and runtime configuration in Linux MTD and U-Boot |
| Deep Power-Down Mode | 6 µA typical current draw - extends battery life in always-on vehicle network gateways during sleep states |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing calibrated fuel injection maps and real-time diagnostic logs in an ISO 26262 ASIL-B compliant ECU. IC Role / Device Role / Timing Role: Non-volatile firmware and parameter storage with AEC-Q100 Grade 2 qualification and 20-year data retention. Use Value: Enables zero-latency XIP of safety-critical boot code and supports secure field updates via ASP-locked sectors. | Use Scenario: Holding ladder logic programs and I/O configuration data in a DIN-rail mounted programmable logic controller. IC Role / Device Role / Timing Role: High-reliability code storage with hybrid sector erase for partial reprogramming without full flash wipe. Use Value: Reduces maintenance downtime by allowing runtime firmware patching while preserving persistent process variables. |
| ADAS Camera Module Boot Memory | Medical Imaging System Configuration Store |
Use Scenario: Hosting boot firmware and sensor calibration profiles in a compact 77 GHz radar camera fusion module. IC Role / Device Role / Timing Role: Low-voltage (1.8 V), high-speed Quad DDR read memory enabling sub-100 ms cold boot time. Use Value: Meets strict automotive startup timing budgets while maintaining thermal stability at +105°C ambient. | Use Scenario: Storing DICOM metadata templates and regulatory-compliant calibration signatures in portable ultrasound equipment. IC Role / Device Role / Timing Role: Secure, OTP-backed configuration store with password-protected read access for HIPAA/FDA audit trails. Use Value: Ensures immutable device identity and traceable calibration history across clinical deployment lifecycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256SAGBHI201 | Same die, identical specs, but shipped in SOIC-16 package - no BGA footprint compatibility | Used in legacy PCBs with through-hole or wide-pitch surface-mount layouts; lacks FAC024 mechanical fit | Select only when board redesign for BGA is not feasible and thermal/power constraints allow SOIC form factor |
| Winbond W25Q256JWSIQ | 256 Mb, 1.8 V, QFN-24; no DDR support, max 133 MHz SDR Quad read (66 MBps), no ASP or OTP password read lock | Lower-cost alternative for non-automotive applications where security and DDR bandwidth are not required | Choose for cost-sensitive industrial HMI or consumer IoT where AEC-Q100 and advanced protection are unnecessary |
Compared with S25FS256SAGBHI203, the S25FS256SAGBHI201 offers identical functionality in SOIC-16 but lacks BGA integration benefits, while the W25Q256JWSIQ trades DDR performance and ASP security for lower unit cost and broader commercial availability.
Availability
S25FS256SAGBHI203 is available at Aetrix Electronics and suitable for automotive ECU design, industrial PLC firmware upgrades, and ADAS camera module production requiring stable component supply and long-term lifecycle assurance.
Supply support for S25FS256SAGBHI203 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, automotive microcontrollers, and secure memory solutions for mission-critical systems.
The FS-S Flash family targets automotive and industrial applications demanding AEC-Q100 qualification, high endurance, and robust security features - designed specifically for firmware storage in safety-aware electronic control units.
FAQ
Is S25FS256SAGBHI203 pin-compatible with earlier S25FL-S devices?
Yes - it maintains identical pinout and command set compatibility with S25FL-P and S25FL-S families in the same package variant (FAC024 BGA). This allows drop-in replacement in existing designs without layout changes, provided the host controller supports DDR Quad I/O and SFDP parsing.
Does this part support Execute-in-Place (XIP) mode?
Yes - it supports continuous XIP mode with burst wrap addressing and QPI protocol, enabling direct CPU instruction fetch from flash. XIP operation is validated across the full –40°C to +105°C range and requires proper cache coherency handling in the host MCU.
What is the function of the IO2 and IO3 pins beyond data I/O?
IO2 serves as Write Protect (WP#) for hardware-enabled sector protection, and IO3 doubles as RESET# for synchronous device reset. Both functions are active-low and operate independently of SPI transaction state, enabling secure lockdown and recovery without interrupting ongoing transfers.
How is the 1024-byte OTP array accessed and secured?
The OTP array is accessed via dedicated SPI commands (0x4B and 0x42) and locked permanently after programming using the OTP Lock command (0x98). Once locked, reads require password authentication via ASP commands, preventing unauthorized access even with physical probe access to the BGA pads.
S25FS256SAGBHI203 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (8x6)
S25FS256SAGBHI203 FAQ
1.How can I place an order for S25FS256SAGBHI203 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SAGBHI203 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SAGBHI203 reliable?
The price and inventory of S25FS256SAGBHI203 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGBHI203 is usually 5 days.
3.What payment methods are accepted for S25FS256SAGBHI203?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGBHI203 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SAGBHI203?
S25FS256SAGBHI203 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SAGBHI203 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SAGBHI203?
For technical support, including S25FS256SAGBHI203 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGBHI203 requirements.
6.How does Aetrix verify that S25FS256SAGBHI203 is sourced from the original manufacturer or authorized distributors?
All S25FS256SAGBHI203 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGBHI203 meets industry standards.
7.What is the process for return or replacement of S25FS256SAGBHI203?
All S25FS256SAGBHI203 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGBHI203, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SAGBHI203 part is unused and in its original packaging.
Return procedure for S25FS256SAGBHI203:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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