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Infineon Technologies S25FS256SAGBHI300
- Part No.:
- S25FS256SAGBHI300
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FS256SAGBHI300.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,170
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Product details
Overview
S25FS256SAGBHI300 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, industrial-plus temperature range (–40°C to +105°C), and BGA-24 6 × 8 mm package (FAC024 footprint). It supports Quad I/O, DDR Quad I/O read up to 80 MBps, 100,000 program-erase cycles, and hardware ECC for single-bit error correction.
For engineers reviewing the S25FS256SAGBHI300 datasheet, S25FS256SAGBHI300 pinout, S25FS256SAGBHI300 application, or S25FS256SAGBHI300 equivalent, key selection factors include hybrid/uniform sector erase options, SFDP/CFI configuration support, OTP array size (1024 bytes), AEC-Q100 Grade 2 qualification, and compatibility with S25FL-P/S25FL-S families.
Technical Context
This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density nonvolatile storage with deterministic timing for XIP and burst-wrap reads. It supports both SDR and DDR SPI protocols, with configurable 24-/32-bit addressing and full command subset compatibility across FS-S, FL-P, and FL-S families.
The flash integrates dual-sector protection schemes: status-register-based block protection and password-controlled Advanced Sector Protection (ASP), plus dedicated 1024-byte OTP array for secure boot code or calibration data storage. Erase granularity includes 4-KB, 32-KB, 64-KB, 224-KB, and 256-KB physical sectors depending on configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbit (32 MB) - fixed capacity for firmware/image storage in resource-constrained embedded systems |
| Supply Voltage | 1.7 V to 2.0 V - enables low-power operation in 1.8 V system rails without level shifting |
| Read Speed | 80 MBps (DDR Quad I/O) - supports real-time XIP execution of code from flash in microcontroller boot applications |
| Erase Endurance | 100,000 cycles minimum - suitable for field-upgradable firmware with frequent OTA updates |
| Data Retention | 20 years minimum at +85°C - ensures long-term reliability in industrial control and automotive ECUs |
| Temperature Grade | Industrial Plus (–40°C to +105°C) - qualified for under-hood and factory-floor environments |
| Package | BGA-24, 6 × 8 mm, FAC024 footprint (4 × 6 ball array) - compact, thermally efficient layout for space-constrained PCBs |
Pinout & Package
Package: BGA-24, 6 × 8 mm, FAC024 footprint (4 × 6 ball array), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Power supply | 1.8 V core supply input; decoupling required within 5 mm of ball |
| VSS | Ground | Signal and power ground reference; must connect all VSS balls |
| CS# | Chip select | Active-low enable for SPI command/address/data transfer sequence |
| SCK | Serial clock | Input clock for SDR (up to 133 MHz) or DDR (up to 80 MHz) operation |
| IO0 | Serial input / I/O0 | Primary bidirectional data line; used for SI in standard SPI, I/O0 in Quad mode |
| IO1 | Serial output / I/O1 | Primary bidirectional data line; used for SO in standard SPI, I/O1 in Quad mode |
| IO2 | Write protect / I/O2 | Hardware write-protection enable or secondary I/O line in multi-I/O commands |
| IO3 | Reset / I/O3 | Active-low hardware reset or tertiary I/O line; supports RESET# functionality per JEDEC JESD22-A102 |
| WP# | Write protect | Dedicated hardware write-protection control (not multiplexed); tied high for full program/erase access |
| NC | No connect | Unbonded pad; must be left floating or connected to VSS per layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| Hardware ECC | On-the-fly single-bit error correction with no software overhead or latency penalty |
| Hybrid Sector Erase | Mixed 4-KB/32-KB top/bottom sectors + uniform 64-KB/256-KB blocks - enables flexible firmware partitioning |
| Advanced Sector Protection (ASP) | Password-protected individual sector locking - prevents unauthorized firmware modification in production units |
| SFDP & CFI Support | Standardized parameter tables readable via SPI - enables automatic driver initialization without hard-coded timing values |
| OTP Array | 1024-byte one-time-programmable region - stores immutable keys, calibration data, or device-specific identifiers |
Applications
| Automotive ECU Boot Memory | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Stores boot code and safety-critical firmware for engine control units operating in under-hood environments. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with XIP-capable Quad DDR read for deterministic startup timing. Use Value: AEC-Q100 Grade 2 qualification and 20-year data retention ensure compliance with ISO 26262 ASIL-B requirements. | Use Scenario: Holds field-upgradable ladder logic and motion control algorithms in programmable logic controllers. IC Role / Device Role / Timing Role: Firmware image repository supporting over-the-air updates with suspend/resume erase capability. Use Value: 100,000 program-erase cycles and hybrid sector options allow safe partitioning of update and runtime zones. |
| Medical Imaging System BIOS | Edge AI Inference Accelerator Config |
Use Scenario: Stores trusted boot firmware and diagnostic self-test routines in FDA-cleared imaging equipment. IC Role / Device Role / Timing Role: Secure silicon region (OTP) holds cryptographic keys; ASP enforces read/write access control. Use Value: Hardware-based password protection and 1024-byte OTP prevent tampering with regulatory-certified boot assets. | Use Scenario: Configures neural network model parameters and runtime calibration data for low-power vision accelerators. IC Role / Device Role / Timing Role: High-speed Quad DDR interface feeds weights and activation maps directly to on-chip SRAM during inference. Use Value: 80 MBps read bandwidth reduces model load latency by >40% versus standard SPI flash in benchmarked edge inference workloads. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256SAGBHI200 | Same die, identical specs, but rated for Industrial (–40°C to +85°C) only - no +105°C rating | Lacks Industrial Plus thermal margin; unsuitable for extended-temperature industrial gateways | Select when cost sensitivity outweighs extended temperature requirement |
| Winbond W25Q256JWSIQ | 256 Mb, 1.8 V, but uses different command set; no native SFDP v1.6 support; no ASP or OTP array | Requires custom driver adaptation; lacks hardware security features for secure boot | Choose only if legacy Winbond ecosystem integration is mandatory |
Compared with S25FS256SAGBHI300, the S25FS256SAGBHI200 sacrifices thermal margin for lower cost, while the W25Q256JWSIQ requires firmware rework and forfeits OTP/ASP security - making the 300-grade optimal for new designs needing robustness and security.
Availability
S25FS256SAGBHI300 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware updates, and medical imaging system BIOS storage requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for S25FS256SAGBHI300 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT applications.
The FS-S Flash family targets high-reliability embedded systems requiring secure, fast, and thermally robust nonvolatile storage - especially where AEC-Q100 qualification, hardware ECC, and flexible sector protection are mandatory.
FAQ
Is S25FS256SAGBHI300 pin-compatible with S25FS128SAGBHI300?
No. The S25FS128SAGBHI300 uses an 8-lead WSON package, while S25FS256SAGBHI300 uses a 24-ball BGA (FAC024). They share command-set compatibility and voltage/temperature specs but differ physically and electrically in I/O drive strength and timing margins.
Does this part support QPI (Quad Peripheral Interface) mode?
Yes. The S25FS256SAGBHI300 supports QPI mode for continuous read operations, enabling higher throughput than standard SPI by using all four I/O lines for address and data transmission after initial command phase.
What is the function of the IO3/RESET# pin in normal operation?
In normal operation, IO3 serves as the fourth I/O line for Quad and DDR Quad I/O commands. When asserted low, it triggers a hardware reset that clears internal state and returns the device to standby mode - independent of CS# deassertion.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP array is one-time programmable: bits can only be changed from '1' to '0', and no erase mechanism exists. Once written, contents are permanent and immune to subsequent power cycles or command sequences.
S25FS256SAGBHI300 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FS256SAGBHI300 FAQ
1.How can I place an order for S25FS256SAGBHI300 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SAGBHI300 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SAGBHI300 reliable?
The price and inventory of S25FS256SAGBHI300 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGBHI300 is usually 5 days.
3.What payment methods are accepted for S25FS256SAGBHI300?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGBHI300 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SAGBHI300?
S25FS256SAGBHI300 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SAGBHI300 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SAGBHI300?
For technical support, including S25FS256SAGBHI300 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGBHI300 requirements.
6.How does Aetrix verify that S25FS256SAGBHI300 is sourced from the original manufacturer or authorized distributors?
All S25FS256SAGBHI300 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGBHI300 meets industry standards.
7.What is the process for return or replacement of S25FS256SAGBHI300?
All S25FS256SAGBHI300 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGBHI300, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SAGBHI300 part is unused and in its original packaging.
Return procedure for S25FS256SAGBHI300:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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