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Infineon Technologies S25FS256SAGBHI303
- Part No.:
- S25FS256SAGBHI303
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 24-TBGA
- Datasheet:
-
S25FS256SAGBHI303.pdf
- Description:
- IC FLASH 256MBIT SPI/QUAD 24BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,598
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Product details
Overview
S25FS256SAGBHI303 from Infineon is a 256 Mb (32 MB) serial NOR flash memory with SPI Multi-I/O interface, operating at 1.8 V supply, supporting DDR Quad I/O read up to 80 MBps, hybrid/ uniform sector erase options, and integrated hardware ECC for single-bit error correction. It targets boot code storage in industrial and automotive microcontroller systems requiring high reliability and fast XIP execution.
For engineers reviewing the S25FS256SAGBHI303 datasheet, S25FS256SAGBHI303 pinout, S25FS256SAGBHI303 application, or S25FS256SAGBHI303 equivalent, key selection factors include 1.7–2.0 V operation, AEC-Q100 Grade 2 (–40°C to +105°C), BGA-24 FAB024 package, SFDP/CFI support, and OTP array for secure configuration storage.
Technical Context
This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling simultaneous read-while-write via program/erase suspend-resume functionality. It supports both standard SPI (modes 0/3) and enhanced protocols including QPI, DDR Quad I/O, and burst wrap addressing for deterministic latency in real-time firmware execution.
The memory array is organized with configurable sector layouts: hybrid (eight 4-KB + one 32-KB or 224-KB sectors) or uniform (64-KB or 256-KB blocks), and integrates dedicated status registers for hardware/software block protection plus Advanced Sector Protection with password-controlled access to boot sectors.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Density | 256 Mbit (32 MB) - sufficient for full MCU boot image + firmware + parameter storage in space-constrained embedded systems |
| Supply Voltage | 1.7 V to 2.0 V - compatible with low-voltage SoC I/O domains and reduces system power consumption |
| Read Speed | 80 MBps DDR Quad I/O - enables near-zero-latency XIP execution for real-time control applications |
| Erase Endurance | 100,000 cycles minimum - supports field firmware updates over extended product lifetime |
| Data Retention | 20 years minimum at +85°C - ensures long-term integrity of stored calibration data and security keys |
| Temperature Grade | AEC-Q100 Grade 2 (–40°C to +105°C) - qualified for under-hood automotive ECUs and industrial motor drives |
| Package | BGA-24, 6 × 8 mm, FAB024 footprint (5 × 5 ball array) - surface-mount compatible with automated PCB assembly and thermal management |
Pinout & Package
Package: BGA-24, 6 × 8 mm, FAB024 footprint (5 × 5 ball array), Pb-free, RoHS-compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC | Power supply | 1.7–2.0 V core and I/O supply; decoupling required per layout guidelines for stable SPI timing |
| VSS | Ground | Signal and power return path; must be connected to low-impedance ground plane |
| CS# | Chip select | Active-low enable for command/address/data transfer; controls device isolation on shared SPI bus |
| SCK | Serial clock | Input clock for SDR or DDR modes; phase/polarity configurable per SPI mode 0/3 |
| IO0 | Serial input / I/O0 | Primary data line for standard SPI; bidirectional in Dual/Quad I/O modes |
| IO1 | Serial output / I/O1 | Primary output in standard mode; bidirectional in Dual/Quad I/O for parallel data transfer |
| IO2 | Write protect / I/O2 | Hardware write protection when asserted low; also functions as third I/O line in Quad mode |
| IO3 | Reset / I/O3 | Hardware reset input; doubles as fourth I/O line in Quad mode and supports RESET# command |
| WP# | Write protect | Alternate function of IO2; enables sector-level hardware lock independent of software commands |
| RESET# | Reset | Alternate function of IO3; initiates hardware reset sequence to restore default register state |
Key Features
| Feature | Design Value |
|---|---|
| Integrated hardware ECC | Single-bit error correction with automatic detection - eliminates need for external error-handling logic in safety-critical boot paths |
| Program/Erase suspend-resume | Allows background read during active programming or erase - essential for real-time systems requiring uninterrupted firmware access |
| OTP array (1024 bytes) | Immutable storage for cryptographic keys, device IDs, or calibration offsets - prevents tampering after initial programming |
| Advanced Sector Protection (ASP) | Password- or boot-code-controlled sector locking - enables secure boot partitioning without exposing credentials to host software |
| SFDP & CFI support | Standardized parameter discovery - enables automatic driver initialization and eliminates hardcoded timing/register values in BSPs |
Applications
| Automotive Engine Control Unit (ECU) | Industrial PLC Firmware Storage |
|---|---|
Use Scenario: Storing boot loader, safety-critical application firmware, and calibration maps in diesel/gasoline engine controllers. IC Role / Device Role / Timing Role: Primary nonvolatile boot memory with XIP-capable Quad DDR read for deterministic startup timing. Use Value: AEC-Q100 Grade 2 qualification and 20-year data retention ensure compliance with ISO 26262 ASIL-B requirements. | Use Scenario: Holding firmware images, configuration databases, and runtime logs in programmable logic controllers deployed in factory automation. IC Role / Device Role / Timing Role: High-reliability code storage with suspend/resume for seamless firmware updates during live operation. Use Value: 100,000 erase cycles and hardware block protection prevent corruption during frequent field upgrades. |
| Medical Imaging System Boot Memory | Avionics Data Recorder Nonvolatile Cache |
Use Scenario: Hosting boot firmware and FPGA configuration bitstreams in MRI/CT scanner mainboards where radiation tolerance and long-term stability are critical. IC Role / Device Role / Timing Role: Secure, ECC-protected boot source with OTP for storing device-specific encryption keys. Use Value: Integrated ECC and 20-year retention meet IEC 62304 Class C software lifecycle requirements. | Use Scenario: Buffering flight telemetry and sensor data before transfer to permanent storage in black box recorders. IC Role / Device Role / Timing Role: High-speed, low-latency intermediate storage with DDR Quad I/O for burst capture of time-synchronized sensor streams. Use Value: 80 MBps read throughput enables real-time streaming without CPU intervention or DMA bottlenecks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar serial NOR flash memory applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Cypress S25FS256SAGBHIM10 | Same die, identical electrical specs, but Industrial grade (–40°C to +85°C) only - no AEC-Q100 qualification | Lacks automotive temperature and stress qualification - unsuitable for under-hood deployment | Select when cost sensitivity outweighs automotive qualification needs and ambient temperature remains ≤+85°C |
| Winbond W25Q256JWSIQ | 256 Mb, 1.8 V, but no DDR support; max Quad I/O = 40 MBps; no integrated ECC or ASP | Requires external error handling and software-based sector locking - increases firmware complexity and validation burden | Choose for legacy designs already using Winbond SPI NOR drivers and where DDR/XIP performance is not required |
Compared with S25FS256SAGBHI303, the Cypress alternative lacks automotive qualification while matching all electrical parameters, whereas the Winbond part trades DDR speed, hardware ECC, and ASP for broader ecosystem compatibility and lower unit cost in non-safety-critical applications.
Availability
S25FS256SAGBHI303 is available at Aetrix Electronics and suitable for automotive ECU development, industrial PLC firmware updates, and medical imaging system boot storage requiring stable component supply across multi-year production cycles.
Supply support for S25FS256SAGBHI303 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensing, and memory solutions for automotive, industrial, and IoT applications.
The FS-S Flash family is designed for high-reliability embedded systems demanding fast, secure, and long-life nonvolatile storage - particularly where AEC-Q100 qualification, ECC, and XIP performance are mandatory.
FAQ
What is the maximum clock frequency supported in DDR Quad I/O mode?
The S25FS256SAGBHI303 supports DDR Quad I/O read operations at up to 80 MHz clock frequency, delivering 80 MBps effective bandwidth. This is specified in the AC characteristics section of the datasheet (Rev. *O, Table 6.5), and requires proper impedance-controlled PCB routing and termination to maintain signal integrity at this rate.
Does this device require external hardware ECC circuitry?
No. The S25FS256SAGBHI303 includes fully integrated hardware ECC that automatically detects and corrects single-bit errors during read operations. No external circuitry or software intervention is needed, and correction occurs transparently within the memory controller pipeline.
Can the OTP array be reprogrammed after initial programming?
No. The 1024-byte OTP (One-Time Programmable) array is physically fused after programming and cannot be erased or rewritten. Once programmed, its contents remain permanently immutable - making it suitable for storing cryptographic keys, device identifiers, or calibration constants that must survive field updates.
Is the FAB024 BGA package compatible with standard reflow profiles?
Yes. The FAB024 package (6 × 8 mm, 5 × 5 ball array) uses standard Pb-free solder paste and complies with IPC/JEDEC J-STD-020 moisture sensitivity level 3. Recommended peak reflow temperature is 260°C for ≤60 seconds, with preheat and soak phases aligned to IPC-7095B guidelines for fine-pitch BGA assembly.
S25FS256SAGBHI303 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- FS-S
- Package/Case:
- 24-TBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Non-Volatile
- Memory Format:
- FLASH
- Technology:
- FLASH - NOR
- Memory Size:
- 256Mbit
- Memory Organization:
- 32M x 8
- Memory Interface:
- SPI - Quad I/O, QPI
- Clock Frequency:
- 133 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- -
- Voltage - Supply:
- 1.7V ~ 2V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-BGA (6x8)
S25FS256SAGBHI303 FAQ
1.How can I place an order for S25FS256SAGBHI303 through Aetrix?
Please submit a Request for Quotation (RFQ) for S25FS256SAGBHI303 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for S25FS256SAGBHI303 reliable?
The price and inventory of S25FS256SAGBHI303 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGBHI303 is usually 5 days.
3.What payment methods are accepted for S25FS256SAGBHI303?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGBHI303 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for S25FS256SAGBHI303?
S25FS256SAGBHI303 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your S25FS256SAGBHI303 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for S25FS256SAGBHI303?
For technical support, including S25FS256SAGBHI303 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGBHI303 requirements.
6.How does Aetrix verify that S25FS256SAGBHI303 is sourced from the original manufacturer or authorized distributors?
All S25FS256SAGBHI303 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGBHI303 meets industry standards.
7.What is the process for return or replacement of S25FS256SAGBHI303?
All S25FS256SAGBHI303 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGBHI303, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The S25FS256SAGBHI303 part is unused and in its original packaging.
Return procedure for S25FS256SAGBHI303:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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