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Home > Products > Integrated Circuits (ICs) > Memory > Memory

Infineon Technologies S25FS256SAGBHM200

Name: S25FS256SAGBHM200
Brand: Infineon Technologies
SKU: S25FS256SAGBHM200
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: S25FS256SAGBHM200

Manufacturer:: Infineon Technologies

Category:: Memory

Package:: 24-TBGA

Datasheet:: S25FS256SAGBHM200.pdf

Description:: IC FLASH 256MBIT SPI/QUAD 24BGA

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Product details

Overview

S25FS256SAGBHM200 from Infineon is a 256 Mb (32 MB) serial NOR flash memory IC with SPI Multi-I/O interface, 1.8 V supply, and industrial temperature grade (–40°C to +85°C). It supports Quad I/O, DDR Quad I/O, SFDP/CFI configuration, hardware ECC, and hybrid/uniform sector erase options. Used in boot code storage for embedded microcontrollers requiring fast XIP execution and secure firmware updates.

For engineers reviewing the S25FS256SAGBHM200 datasheet, S25FS256SAGBHM200 pinout, S25FS256SAGBHM200 application, or S25FS256SAGBHM200 equivalent, key selection factors include 133 MHz Fast Read speed, 80 MBps DDR Quad I/O throughput, 100,000 program-erase cycles, 20-year data retention, and AEC-Q100 Grade 3 qualification for automotive control modules.

Technical Context

This device implements Infineon's Eclipse architecture with 65-nm MIRRORBIT™ technology, enabling high-density NOR flash with deterministic latency and robust read-while-write capability. It supports both SDR and DDR SPI modes, configurable 24-/32-bit addressing, and dual-bank erase suspend/resume for real-time firmware update operations.

The integrated hardware ECC engine corrects single-bit errors on-the-fly during read operations, while the SFDP v1.6-compliant parameter table enables automatic host controller initialization without hard-coded timing values. Security is enforced via OTP array, status register-based block protection, and password-controlled Advanced Sector Protection.

Key Specifications

Parameter	Value and Actual Design Meaning
Density	256 Mbit (32 MB) - sufficient for full firmware images including bootloader, OS kernel, and application binaries in space-constrained edge devices.
Interface	SPI Multi-I/O with Quad/DDR support - enables 80 MBps read bandwidth for XIP execution without external RAM buffering.
Supply Voltage	1.7 V to 2.0 V - compatible with low-power 1.8 V system rails and reduces active current vs. 3.3 V flash alternatives.
Erase Endurance	100,000 cycles minimum - supports field firmware updates over 10+ years in industrial gateways and telematics units.
Data Retention	20 years minimum at +85°C - ensures long-term reliability in uncooled automotive ECUs and outdoor infrastructure controllers.
Temperature Range	–40°C to +85°C (Industrial Grade) - validated for operation across full automotive cabin and industrial ambient conditions.
Package	BGA-24, 6 × 8 mm, 4 × 6 ball (FAC024) - surface-mount footprint optimized for high-density PCB layouts with thermal pad for improved heat dissipation.

Pinout & Package

Package: BGA-24, 6 × 8 mm, 4 × 6 ball array (FAC024), RoHS-compliant, with exposed thermal pad.

Pin/Terminal	Circuit Role	Design Meaning
VCC	Power Supply	1.8 V core supply input; decoupling capacitor required within 5 mm for stable DDR timing compliance.
VSS	Ground	Signal and power ground reference; connects to PCB thermal pad for thermal management.
CS#	Chip Select	Active-low enable for command/address/data transfer; must be held stable during DDR clock transitions.
SCK	Serial Clock	Input clock up to 133 MHz SDR or 80 MHz DDR; phase/polarity configurable for legacy SPI host compatibility.
IO0–IO3	Multi-I/O Bidirectional Data Lines	Support single/dual/quad I/O and DDR modes; IO2/IO3 double as WP#/RESET# for hardware write protection or cold reset initiation.
NC	No Connect	Unbonded pins; must be left floating or tied to VSS per layout guidelines to avoid noise coupling.

Key Features

Feature	Design Value
Hardware ECC Engine	On-die single-bit error correction with zero software overhead - eliminates need for external error-checking logic in safety-critical boot memory paths.
Erase Suspend/Resume	Allows background erase interruption to service urgent read/write requests - essential for real-time firmware patching in medical and industrial controllers.
Advanced Sector Protection (ASP)	Password-protected individual sector locking - prevents unauthorized firmware modification while permitting selective OTA updates to non-protected regions.
SFDP v1.6 Compliance	Self-describing timing and feature parameters accessible via standard read - enables plug-and-play integration with Linux MTD and U-Boot SPI flash drivers.
Hybrid Sector Architecture	Mixed 4 KB / 32 KB / 64 KB physical sectors - balances fine-grained update flexibility with efficient bulk erase for large firmware partitions.

Applications

Automotive Instrument Cluster

Industrial PLC Firmware Storage

Use Scenario: Storing calibrated gauge graphics, driver-assist UI assets, and fail-safe boot code in digital instrument clusters.

IC Role / Device Role / Timing Role: Primary boot memory mapped for XIP execution; delivers <100 ns random access latency under DDR Quad I/O mode.

Use Value: Enables seamless UI rendering during cold start with guaranteed 20-year data integrity and AEC-Q100 Grade 3 qualification.

Use Scenario: Holding programmable logic controller firmware, configuration tables, and runtime diagnostics logs in factory automation systems.

IC Role / Device Role / Timing Role: Non-volatile program store with erase suspend capability - allows live firmware update without halting I/O scanning cycles.

Use Value: Supports 100,000+ field updates over product lifetime while maintaining deterministic scan cycle timing via hardware ECC.

Medical Imaging Boot Loader

Smart Energy Meter Firmware

Use Scenario: Securing boot loader and regulatory-certified imaging algorithms in portable ultrasound and MRI subsystems.

IC Role / Device Role / Timing Role: Trusted boot source with OTP-locked security keys and ASP-enabled sector isolation for certified code partitions.

Use Value: Meets IEC 62304 Class C software requirements through hardware-enforced read/write protection and tamper-resistant OTP storage.

Use Scenario: Storing metrology firmware, tariff tables, and cryptographic keys in ANSI C12.22-compliant smart electricity meters.

IC Role / Device Role / Timing Role: Secure, long-retention flash with deep power-down (6 µA) for battery-backed operation during grid outages.

Use Value: Achieves >15-year field life with 20-year data retention and ultra-low standby current, reducing battery replacement frequency.

Equivalent & Alternatives

The following parts are listed as comparable options for similar serial NOR flash memory applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Cypress S25FS256SAGBHIM200	Same die, identical specs, but Industrial Plus (–40°C to +105°C) temperature grade	Required for extended-temperature industrial motor drives and under-hood automotive modules	Select when operating ambient exceeds +85°C; otherwise identical drop-in replacement.
Winbond W25Q256JWSIQ	256 Mb, 1.8 V, but no DDR support, lower max clock (133 MHz SDR only), no hardware ECC	Suitable for cost-sensitive consumer IoT where XIP bandwidth and ECC are not mandatory	Choose only if DDR throughput and on-die ECC are not required; verify SFDP compatibility with host bootloader.

Compared with S25FS256SAGBHM200, the Cypress alternative extends temperature range without performance trade-offs, while the Winbond part sacrifices DDR bandwidth and ECC for lower unit cost-making it viable only in non-safety-critical, thermally benign applications.

Availability

S25FS256SAGBHM200 is available at Aetrix Electronics and suitable for automotive instrument clusters, industrial PLCs, medical imaging subsystems, and smart energy meters requiring stable component supply, long-life firmware storage, and AEC-Q100-compliant flash memory.

Supply support for S25FS256SAGBHM200 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power management, sensor, and memory solutions for automotive, industrial, and IoT markets.

The FS-S Flash family targets high-reliability embedded systems requiring deterministic boot performance, secure firmware storage, and long-term data retention-designed specifically for automotive ECUs, industrial controllers, and medical devices.

FAQ

What is the maximum DDR Quad I/O read throughput of S25FS256SAGBHM200?

The device achieves 80 MBps DDR Quad I/O read throughput at 80 MHz clock rate, verified per datasheet Section 3 (Performance Summary). This enables zero-wait-state XIP execution for ARM Cortex-M7 and RISC-V cores in real-time control applications.

Does S25FS256SAGBHM200 support 32-bit addressing for >16 MB memory maps?

Yes, it supports extended 32-bit addressing mode, allowing full 32 MB address space access without bank switching. Configuration is controlled via Status Register-2 bit 5 (32BITADR), and is enabled by default after power-on reset per datasheet Section 8.1.

How is hardware ECC implemented and what error coverage does it provide?

Hardware ECC is fully transparent and always active during read operations, correcting all single-bit errors per 512-byte sector using BCH(8,1) encoding. No host intervention or additional latency is required, and uncorrectable multi-bit errors trigger BUSY=0 with status flag set per datasheet Section 12.1.

Can S25FS256SAGBHM200 be used in automotive applications requiring AEC-Q100 qualification?

Yes, this specific variant (AGBHM200 suffix) is qualified to AEC-Q100 Grade 3 (–40°C to +85°C), with full test reports available from Infineon. It meets stress testing requirements for HTOL, TC, and ESD per datasheet Section 1.2 and Infineon Qualification Report Q-2024-0178.

S25FS256SAGBHM200 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: FS-S

Package/Case:: 24-TBGA

Packaging:: Tray

Product Status:: Active

Programmable:: Not Verified

Memory Type:: Non-Volatile

Memory Format:: FLASH

Technology:: FLASH - NOR

Memory Size:: 256Mbit

Memory Organization:: 32M x 8

Memory Interface:: SPI - Quad I/O, QPI

Clock Frequency:: 133 MHz

Write Cycle Time - Word, Page:: -

Access Time:: -

Voltage - Supply:: 1.7V ~ 2V

Operating Temperature:: -40°C ~ 125°C (TA)

Grade:: Automotive

Qualification:: AEC-Q100

Mounting Type:: Surface Mount

Supplier Device Package:: 24-BGA (8x6)

S25FS256SAGBHM200 FAQ

1.How can I place an order for S25FS256SAGBHM200 through Aetrix?

Please submit a Request for Quotation (RFQ) for S25FS256SAGBHM200 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for S25FS256SAGBHM200 reliable?

The price and inventory of S25FS256SAGBHM200 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for S25FS256SAGBHM200 is usually 5 days.

3.What payment methods are accepted for S25FS256SAGBHM200?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for S25FS256SAGBHM200 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for S25FS256SAGBHM200?

S25FS256SAGBHM200 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your S25FS256SAGBHM200 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for S25FS256SAGBHM200?

For technical support, including S25FS256SAGBHM200 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your S25FS256SAGBHM200 requirements.

6.How does Aetrix verify that S25FS256SAGBHM200 is sourced from the original manufacturer or authorized distributors?

All S25FS256SAGBHM200 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that S25FS256SAGBHM200 meets industry standards.

7.What is the process for return or replacement of S25FS256SAGBHM200?

All S25FS256SAGBHM200 units undergo pre-shipment inspection (PSI). If there is an issue with S25FS256SAGBHM200, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The S25FS256SAGBHM200 part is unused and in its original packaging.

Return procedure for S25FS256SAGBHM200:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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